JPH027182B2 - - Google Patents

Info

Publication number
JPH027182B2
JPH027182B2 JP59227800A JP22780084A JPH027182B2 JP H027182 B2 JPH027182 B2 JP H027182B2 JP 59227800 A JP59227800 A JP 59227800A JP 22780084 A JP22780084 A JP 22780084A JP H027182 B2 JPH027182 B2 JP H027182B2
Authority
JP
Japan
Prior art keywords
electrode
external lead
region
metal
silicon substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59227800A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61107753A (ja
Inventor
Seiichi Myagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Inter Electronics Corp
Original Assignee
Nihon Inter Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Inter Electronics Corp filed Critical Nihon Inter Electronics Corp
Priority to JP59227800A priority Critical patent/JPS61107753A/ja
Publication of JPS61107753A publication Critical patent/JPS61107753A/ja
Publication of JPH027182B2 publication Critical patent/JPH027182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H01L23/4926—Bases or plates or solder therefor characterised by the materials the materials containing semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59227800A 1984-10-31 1984-10-31 半導体装置 Granted JPS61107753A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59227800A JPS61107753A (ja) 1984-10-31 1984-10-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59227800A JPS61107753A (ja) 1984-10-31 1984-10-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS61107753A JPS61107753A (ja) 1986-05-26
JPH027182B2 true JPH027182B2 (cs) 1990-02-15

Family

ID=16866582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59227800A Granted JPS61107753A (ja) 1984-10-31 1984-10-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS61107753A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0418074U (cs) * 1990-06-05 1992-02-14

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0418074U (cs) * 1990-06-05 1992-02-14

Also Published As

Publication number Publication date
JPS61107753A (ja) 1986-05-26

Similar Documents

Publication Publication Date Title
JP4646284B2 (ja) 単一表面上のバンプコンタクトを有する垂直伝導フリップチップ半導体デバイス
US6885096B2 (en) Semiconductor device having at least three power terminals superposed on each other
JP2021192461A (ja) 半導体装置
EP0291014A2 (en) Semiconductor device in which wiring layer is formed below bonding pad
JP2004207723A (ja) フリップチップｆｅｔ素子
JP3677519B2 (ja) 電力用半導体モジュール
US4161740A (en) High frequency power transistor having reduced interconnection inductance and thermal resistance
JP2987088B2 (ja) Ｍｏｓ技術電力デバイスチィップ及びパッケージ組立体
JP4797445B2 (ja) 絶縁ゲート型バイポーラトランジスタ
JP4706551B2 (ja) パワー半導体素子及びパワーモジュール
JP2009164288A (ja) 半導体素子及び半導体装置
JP2000058820A (ja) パワー半導体素子及びパワーモジュール
JPH027182B2 (cs)
JPS60225467A (ja) 縦型ｍｏｓゲ−ト入力半導体装置
TW497232B (en) Semiconductor device and method of manufacturing the same
JP3000809B2 (ja) 半導体装置
CN109994445B (zh) 半导体元件和半导体装置
US9362221B2 (en) Surface mountable power components
JPS58188159A (ja) 半導体装置
JPH023300B2 (cs)
JPH01276673A (ja) 絶縁ゲート型半導体装置
JP2525558Y2 (ja) 半導体装置
JP2000114525A (ja) 半導体装置およびその製造方法
JPH0622997Y2 (ja) 絶縁物封止型半導体装置
JPH07202202A (ja) 電力用ｍｏｓデバイスチップ及びパッケージアッセンブリ