JPH0263570U - - Google Patents
Info
- Publication number
- JPH0263570U JPH0263570U JP14371688U JP14371688U JPH0263570U JP H0263570 U JPH0263570 U JP H0263570U JP 14371688 U JP14371688 U JP 14371688U JP 14371688 U JP14371688 U JP 14371688U JP H0263570 U JPH0263570 U JP H0263570U
- Authority
- JP
- Japan
- Prior art keywords
- board
- electronic components
- lead wires
- locking pieces
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図乃至第4図は本考案の一実施例を示し、
第1図は平断面図、第2図は側断面図、第3図は
第1図のA―A線断面図、第4図は回路図である
。第5図は他の実施例を示す斜視図である。
21……基板、22,23……コンデンサ、2
4,25,48……係止片、27,29……リー
ド線。
1 to 4 show an embodiment of the present invention,
1 is a plan sectional view, FIG. 2 is a side sectional view, FIG. 3 is a sectional view taken along line AA in FIG. 1, and FIG. 4 is a circuit diagram. FIG. 5 is a perspective view showing another embodiment. 21... Board, 22, 23... Capacitor, 2
4, 25, 48... Locking piece, 27, 29... Lead wire.
補正 平1.1.18
実用新案登録請求の範囲を次のように補正する
。Amendment 1.18.18 The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
基板に電子部品を配置し、この電子部品のリー
ド線を基板を貫通させて、基板の裏面側で半田付
けするようにしたものにおいて、
基板上に係止片を突設し、この係止片に、電子
部品を位置規制するように、リード線の中途部を
引つ掛けたことを特微とする電子部品の位置決め
構造。[Scope of claim for utility model registration] An electronic component is placed on a board , and the lead wires of the electronic component are passed through the board and soldered on the back side of the board . The feature is that a locking piece is provided protrudingly on the board , and the middle part of the lead wire is hooked onto this locking piece so as to regulate the position of the electronic component . Positioning structure for electronic components.
Claims (1)
電子部品22,23のリード線27,27を基板
1を貫通させて、基板21の裏面側で半田付けす
るようにしたものにおいて、 基板21上に係止片24,25,48を突設し
、この係止片24,25,48に、電子部品22
,23を位置規制するように、リード線27,2
7の中途部を引つ掛けたことを特徴とする電子部
品の位置決め構造。[Claims for Utility Model Registration] Electronic components 22 and 23 are arranged on a board 21, and lead wires 27 and 27 of the electronic components 22 and 23 are passed through the board 1 and soldered on the back side of the board 21. In this device, locking pieces 24, 25, and 48 are provided protrudingly on the board 21, and electronic components 22 are attached to these locking pieces 24, 25, and 48.
, 23, the lead wires 27, 2
A positioning structure for electronic components characterized by hooking the middle part of No. 7.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14371688U JPH0263570U (en) | 1988-11-01 | 1988-11-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14371688U JPH0263570U (en) | 1988-11-01 | 1988-11-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0263570U true JPH0263570U (en) | 1990-05-11 |
Family
ID=31410786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14371688U Pending JPH0263570U (en) | 1988-11-01 | 1988-11-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0263570U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5812982B2 (en) * | 1976-10-01 | 1983-03-11 | 株式会社日立製作所 | chemical ionization ion source |
JPS6245880B2 (en) * | 1979-12-10 | 1987-09-29 | Takeda Chemical Industries Ltd |
-
1988
- 1988-11-01 JP JP14371688U patent/JPH0263570U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5812982B2 (en) * | 1976-10-01 | 1983-03-11 | 株式会社日立製作所 | chemical ionization ion source |
JPS6245880B2 (en) * | 1979-12-10 | 1987-09-29 | Takeda Chemical Industries Ltd |