JPS6429871U - - Google Patents
Info
- Publication number
- JPS6429871U JPS6429871U JP12354287U JP12354287U JPS6429871U JP S6429871 U JPS6429871 U JP S6429871U JP 12354287 U JP12354287 U JP 12354287U JP 12354287 U JP12354287 U JP 12354287U JP S6429871 U JPS6429871 U JP S6429871U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- notch
- substrate
- attached
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 239000003990 capacitor Substances 0.000 description 1
Description
第１図は、本考案よりなる実施例を示した斜視
図、第２図は本考案の他の実施例に要部を示した
平面図、第３図は従来例の回路基板の要部平面図
、第４図は、回路基板と電子部品との結束状態を
示した側面図である。
１……回路基板、１′……辺縁、２……コンデ
ンサー、３……透孔、４……紐・ベルト、５……
通し孔、６……切欠き。
Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is a plan view showing main parts of another embodiment of the invention, and Fig. 3 is a plan view of main parts of a conventional circuit board. FIG. 4 is a side view showing a state in which the circuit board and electronic components are bundled. 1... Circuit board, 1'... Edge, 2... Capacitor, 3... Through hole, 4... String/belt, 5...
Through hole, 6...notch.
Claims (1)
交する方向に、バンド等４によつて締付けて基板
１に固定してなる回路基板装置において、前記電
子部品２をそのリード端子取付け方向が前記基板
１の一辺に平行となるように取付けると共に、該
基板１の一辺に切欠き６を設け、かつその切欠き
６位置に対する前記電子部品２の反対位置に透し
孔５を設け、前記バンド等４を前記切欠き６及び
透し孔５に挿通して電子部品２と基板１とを結束
することを特徴とする回路基板装置。 In a circuit board device in which an electronic component 2 is fixed to a substrate 1 by tightening with a band or the like 4 in a direction perpendicular to the direction in which the lead terminals are attached, the electronic component 2 is fixed to the substrate 1 in a direction perpendicular to the direction in which the lead terminals are attached. At the same time, a notch 6 is provided on one side of the substrate 1, and a through hole 5 is provided at a position opposite to the position of the notch 6 of the electronic component 2, and the band etc. 4 is attached so as to be parallel to one side. A circuit board device characterized in that it is inserted into the notch 6 and the through hole 5 to bind the electronic component 2 and the board 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12354287U JPS6429871U (en) | 1987-08-12 | 1987-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12354287U JPS6429871U (en) | 1987-08-12 | 1987-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6429871U true JPS6429871U (en) | 1989-02-22 |
Family
ID=31372488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12354287U Pending JPS6429871U (en) | 1987-08-12 | 1987-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6429871U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008026516A1 (en) * | 2006-08-28 | 2008-03-06 | Daikin Industries, Ltd. | Electric component unit |
| WO2009087323A2 (en) * | 2008-01-04 | 2009-07-16 | Valeo Equipements Electriques Moteur | Method for dismantling a device including at least one article at least partially imbedded in a resin |
-
1987
- 1987-08-12 JP JP12354287U patent/JPS6429871U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008026516A1 (en) * | 2006-08-28 | 2008-03-06 | Daikin Industries, Ltd. | Electric component unit |
| JP2008053635A (en) * | 2006-08-28 | 2008-03-06 | Daikin Ind Ltd | Electrical equipment unit |
| WO2009087323A2 (en) * | 2008-01-04 | 2009-07-16 | Valeo Equipements Electriques Moteur | Method for dismantling a device including at least one article at least partially imbedded in a resin |
| WO2009087323A3 (en) * | 2008-01-04 | 2009-09-03 | Valeo Equipements Electriques Moteur | Method for dismantling a device including at least one article at least partially imbedded in a resin |
| US8507128B2 (en) | 2008-01-04 | 2013-08-13 | Valeo Equipements Electriques Moteur | Method for dismantling device comprising at least one article embedded at least partially in resin |
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