JPH0260467B2 - - Google Patents

Info

Publication number
JPH0260467B2
JPH0260467B2 JP55087458A JP8745880A JPH0260467B2 JP H0260467 B2 JPH0260467 B2 JP H0260467B2 JP 55087458 A JP55087458 A JP 55087458A JP 8745880 A JP8745880 A JP 8745880A JP H0260467 B2 JPH0260467 B2 JP H0260467B2
Authority
JP
Japan
Prior art keywords
wafer
surface plate
thickness
polishing
surface plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP55087458A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5715668A (en
Inventor
Kunihiko Hanazono
Yoshitada Kanda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Kikai Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Kikai Kogyo KK filed Critical Fujikoshi Kikai Kogyo KK
Priority to JP8745880A priority Critical patent/JPS5715668A/ja
Publication of JPS5715668A publication Critical patent/JPS5715668A/ja
Publication of JPH0260467B2 publication Critical patent/JPH0260467B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP8745880A 1980-06-27 1980-06-27 Lapping process and lapping device Granted JPS5715668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8745880A JPS5715668A (en) 1980-06-27 1980-06-27 Lapping process and lapping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8745880A JPS5715668A (en) 1980-06-27 1980-06-27 Lapping process and lapping device

Publications (2)

Publication Number Publication Date
JPS5715668A JPS5715668A (en) 1982-01-27
JPH0260467B2 true JPH0260467B2 (cg-RX-API-DMAC7.html) 1990-12-17

Family

ID=13915419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8745880A Granted JPS5715668A (en) 1980-06-27 1980-06-27 Lapping process and lapping device

Country Status (1)

Country Link
JP (1) JPS5715668A (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0630367Y2 (ja) * 1983-11-25 1994-08-17 東芝機械株式会社 ポリシング装置の定盤間隔保持構造
JPS62188671A (ja) * 1986-02-13 1987-08-18 Supiide Fuamu Kk 平面研磨機における定寸装置
IT1243537B (it) * 1990-10-19 1994-06-16 Melchiorre Off Mecc Metodo e dispositivo per il controllo al termine di ogni ciclo (post process) dei pezzi lavorati in una macchina lappatrice a doppio plateau
JPH1034529A (ja) * 1996-07-18 1998-02-10 Speedfam Co Ltd 自動定寸装置
JP7769391B2 (ja) * 2023-04-13 2025-11-13 株式会社太陽 両面研磨装置

Also Published As

Publication number Publication date
JPS5715668A (en) 1982-01-27

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