JPH0259629B2 - - Google Patents

Info

Publication number
JPH0259629B2
JPH0259629B2 JP58189160A JP18916083A JPH0259629B2 JP H0259629 B2 JPH0259629 B2 JP H0259629B2 JP 58189160 A JP58189160 A JP 58189160A JP 18916083 A JP18916083 A JP 18916083A JP H0259629 B2 JPH0259629 B2 JP H0259629B2
Authority
JP
Japan
Prior art keywords
cap
ring
laser
laser beam
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58189160A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6081843A (ja
Inventor
Minoru Suzuki
Satoshi Kotaka
Hiromi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58189160A priority Critical patent/JPS6081843A/ja
Publication of JPS6081843A publication Critical patent/JPS6081843A/ja
Publication of JPH0259629B2 publication Critical patent/JPH0259629B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
JP58189160A 1983-10-12 1983-10-12 マイクロ波筐体の製造方法 Granted JPS6081843A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58189160A JPS6081843A (ja) 1983-10-12 1983-10-12 マイクロ波筐体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58189160A JPS6081843A (ja) 1983-10-12 1983-10-12 マイクロ波筐体の製造方法

Publications (2)

Publication Number Publication Date
JPS6081843A JPS6081843A (ja) 1985-05-09
JPH0259629B2 true JPH0259629B2 (enrdf_load_stackoverflow) 1990-12-13

Family

ID=16236454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58189160A Granted JPS6081843A (ja) 1983-10-12 1983-10-12 マイクロ波筐体の製造方法

Country Status (1)

Country Link
JP (1) JPS6081843A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2648275A1 (fr) * 1989-06-09 1990-12-14 Thomson Csf Procede et dispositif d'encapsulation de modules hyperfrequence
US5656184A (en) * 1995-03-27 1997-08-12 General Electric Company Method of laser welding open receptacles
CN102653034A (zh) * 2011-12-16 2012-09-05 成都泛华航空仪表电器有限公司 高压密封阀体组件脉冲激光焊接的方法
JP6497503B2 (ja) * 2014-11-21 2019-04-10 三浦工業株式会社 プレート式熱交換器の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878443A (ja) * 1981-11-04 1983-05-12 Nec Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6081843A (ja) 1985-05-09

Similar Documents

Publication Publication Date Title
KR930017162A (ko) 반도체장치용 리이드프레임의 제조방법과 반도체장치용 리이드프레임 및 수지봉지형 반도체장치
JP3670008B2 (ja) 気密ろう接合部の作成方法
US5279623A (en) Method of fabricating flat type electrochemical device
JP3908838B2 (ja) アルミニウム容器及びその製造方法
JP2904638B2 (ja) ロー付け方法及びロー付け接合体
JPH0259629B2 (enrdf_load_stackoverflow)
JPH0252425B2 (enrdf_load_stackoverflow)
JP3878899B2 (ja) 電子装置及びその製造方法
JPS5810364A (ja) 電池の封口方法
JP2001274649A (ja) 水晶振動デバイスの気密封止方法
JPH06151629A (ja) 光透過用ウィンドを備えたパッケージ
JPH043609A (ja) 発振器
JPH10148736A (ja) 光通信用パッケージ
JP3248842B2 (ja) 電子部品用パッケージの製造方法
JP2001267867A (ja) 圧電振動子の製造方法
JP2007019537A (ja) 電子装置及びその製造方法
JPS586783A (ja) 薄肉パイプ中への金網の接合方法
JPH0590870A (ja) 水晶振動子
JP2004241671A (ja) 電子部品パッケージ及びその封止方法
JPS635234Y2 (enrdf_load_stackoverflow)
JPH07291753A (ja) セラミック部材と金属部材との接合方法
JP2000003973A (ja) 電子部品用パッケージ
JPS6248888B2 (enrdf_load_stackoverflow)
JPS6054152B2 (ja) ハ−メチツクシ−ル端子の溶接方法
JPH01133009A (ja) 光素子モジュール