JPH0259629B2 - - Google Patents
Info
- Publication number
- JPH0259629B2 JPH0259629B2 JP58189160A JP18916083A JPH0259629B2 JP H0259629 B2 JPH0259629 B2 JP H0259629B2 JP 58189160 A JP58189160 A JP 58189160A JP 18916083 A JP18916083 A JP 18916083A JP H0259629 B2 JPH0259629 B2 JP H0259629B2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- ring
- laser
- laser beam
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明はマイクロ波帯乃至ミリ波帯（マイクロ
波と略称する）回路を収容する筐体の製造方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing a housing housing a microwave band to millimeter wave band (abbreviated as microwave) circuit.
第１図は従来のマイクロ波用筐体を示す図であ
る。同図において、１及び２は銅合金で形成した
筐体の本体及びキヤツプであり、キヤツプ２の溶
接はレーザ溶接が完全気密を保つ上で好ましい
が、材料が銅合金系であり熱伝導度が良いことか
らレーザ溶接が困難であるため接着剤を用いて封
止している。このためこのような従来のマイクロ
波用筐体は完全な気密が保たれないという欠点が
あつた。 FIG. 1 is a diagram showing a conventional microwave housing. In the figure, 1 and 2 are the main body and cap of the casing made of copper alloy. Laser welding is preferable for welding cap 2 in order to maintain complete airtightness, but since the material is copper alloy, the thermal conductivity is low. Although it is good, it is difficult to laser weld, so it is sealed using adhesive. For this reason, such conventional microwave casings have the disadvantage that complete airtightness cannot be maintained.
本発明は上記従来の欠点に鑑み、レーザ溶接に
よりキヤツプを封止し完全気密を保持し得るマイ
クロ波筐体の製造方法を提供することを目的とす
るものである。
SUMMARY OF THE INVENTION In view of the above-mentioned drawbacks of the prior art, it is an object of the present invention to provide a method for manufacturing a microwave casing that can seal the cap by laser welding and maintain complete airtightness.
そして、この目的は本発明によれば、筐体本体
の開口周囲にレーザ溶接性の良い金属リングを接
合して該リングにキヤツプを被せ、上記リングと
キヤツプの境界線をレーザビーム中に含んで何れ
か一方に該レーザビームの中心を偏倚させて全周
をレーザ溶接し、次に上記境界線を含む他方にレ
ーザビームの中心を偏倚させて全周をレーザ溶接
することにより、先の溶融部に後の溶融部を覆わ
せ相互に融合せしめた溶接構造として気密封止す
ることを特徴とするマイクロ波筐体の構造方法を
提供することによつて達成される。
According to the present invention, this purpose is achieved by joining a metal ring with good laser weldability around the opening of the housing body, covering the ring with a cap, and including the boundary line between the ring and the cap in the laser beam. The center of the laser beam is shifted to one side and the entire circumference is laser welded, and then the center of the laser beam is shifted to the other side including the boundary line and the entire circumference is laser welded. This is achieved by providing a method for constructing a microwave housing, which is characterized in that the subsequent fusion portion is covered and hermetically sealed as a welded structure that is fused to each other.
以下、本発明実施例を図面によつて詳述する。 Embodiments of the present invention will be described in detail below with reference to the drawings.
第２図は本発明方法により作成するマイクロ波
筐体を説明するための分解斜視図であり、１０は
筐体本体、１１はキヤツプ、１２はリングをそれ
ぞれ示している。 FIG. 2 is an exploded perspective view for explaining a microwave casing produced by the method of the present invention, in which numeral 10 indicates the casing body, 11 a cap, and 12 a ring.
本実施例は筐体の本体１０が銅合金で形成され
ておりキヤツプとの接合部にリング１２を溶接し
ておく。リング１２の材料としては鉄・ニツケ
ル・クロム合金（ステンレス鋼）又は鉄・ニツケ
ル・コバルト合金（商品名コバール）を用いる。
またキヤツプ１１はリングに用いた材料と同じ材
料を用いるのが好ましいが、溶接性が良ければリ
ングがステンレスでキヤツプがコバールといつた
異種の組合せでも良い。そしてリング１２を本体
１０に銀ローでロー付けしたのち、本体１０に高
周波回路を搭載し、その後キヤツプ１１をかぶせ
レーザ溶接によりキヤツプ１１とリング１２とを
溶接して本体１０を密封するのである。 In this embodiment, the main body 10 of the casing is made of copper alloy, and a ring 12 is welded to the joint with the cap. As the material of the ring 12, an iron-nickel-chromium alloy (stainless steel) or an iron-nickel-cobalt alloy (trade name Kovar) is used.
It is preferable to use the same material as the ring for the cap 11, but if the weldability is good, a different combination such as the ring being made of stainless steel and the cap being made of Kovar may be used. After the ring 12 is soldered to the main body 10 with silver brazing, a high frequency circuit is mounted on the main body 10, and then the cap 11 is covered and the cap 11 and the ring 12 are welded together by laser welding to seal the main body 10.
このように作成されたマイクロ波筐体は、キヤ
ツプ１１は予め本体１０にロー付けされたレーザ
溶接性の良いリング１２にレーザ溶接されるため
熱的な問題がなく加工性が良くなり、従つて完全
なレーザ溶接ができ気密封止の信頼度が向上す
る。 In the microwave casing created in this way, the cap 11 is laser welded to the ring 12 which has good laser weldability and is brazed to the main body 10 in advance, so there is no thermal problem and the processability is good. Complete laser welding is possible, improving the reliability of hermetic sealing.
第３図はリングとキヤツプのレーザ溶接の実際
例を説明するための図であり、ａ〜ｃはその工程
を示す図である。同図において、１０は筐体、１
１はキヤツプ、１２はリング、１３はレーザ加工
機、１４はレーザビームをそれぞれ示す。 FIG. 3 is a diagram for explaining an actual example of laser welding of a ring and a cap, and ac is a diagram showing the process. In the figure, 10 is a housing, 1
1 is a cap, 12 is a ring, 13 is a laser processing machine, and 14 is a laser beam.
本実際例は、キヤツプ１１には厚さ0.3mmのス
テンレス鋼（SUS304）を用い、リングは厚さ２
mmのステンレス鋼（SUS304）を用い筐体１０に
銀ロー付けした。両者の溶接にはYAGレーザ加
工機を用い、溶接条件として、出力180W、溶接
速度10mm／ｓ、ビーム径0.3mmとし、雰囲気には
O2：３％、He：10％、N287％の混合ガスを用い
た。溶接は１回目をａ図の如くレーザビーム１４
を45゜の角度から図に示す位置を照射し、次いで
２回目をｂ図の如く照射位置をずらしてレーザビ
ーム１４を照射し、ｃ図の如く完成した。このよ
うに溶接した本実施例の気密性は10-8Torr・
／ses以上（従来の接着剤封止では10-4Torr・
／ses程度）が得られた。 In this actual example, the cap 11 is made of stainless steel (SUS304) with a thickness of 0.3 mm, and the ring is made of stainless steel with a thickness of 2 mm.
The housing 10 was silver-brazed using stainless steel (SUS304) with a diameter of 2 mm. A YAG laser processing machine was used to weld the two, and the welding conditions were: output 180W, welding speed 10mm/s, beam diameter 0.3mm, and the atmosphere was
A mixed gas of 3% O 2 , 10% He, and 87% N 2 was used. For the first welding, use the laser beam 14 as shown in figure a.
The position shown in the figure was irradiated from an angle of 45 degrees, and then the laser beam 14 was irradiated a second time with the irradiation position shifted as shown in figure b, completing the process as shown in figure c. The airtightness of this example welded in this way is 10 -8 Torr・
/ses or higher (10 -4 Torr・s with conventional adhesive sealing)
/ses) was obtained.
上記のように、第１回目の照射はレーザビーム
１４の中心をキヤツプ１１とリング１２の境界線
よりもキヤツプ１１の端面上に偏倚させ、レーザ
ビーム１４中に境界線とリング１２を含んで溶融
させることにより、主としてキヤツプ１１が大き
く溶融してリング１２側へ溶け込む。このように
して全周を溶接する。次に第２回目の照射はレー
ザビーム１４の中心をリング１２とキヤツプ１１
の境界線よりもリング１２の面上に偏倚させ、レ
ーザビーム１４中に境界線とキヤツプ１１を含ん
で溶融させることにより、主としてリング１２が
大きく溶融して第１回目の溶融部分上を覆うよう
にして融合する。このように２段階の溶接構造と
することは、境界面に直接行うと僅かな送りの変
動が生じてレーザビーム１４の中心がキヤツプ１
１とリング１２とに変移し、両者が融合しない部
分が生じることが判明したことにより、相互に溶
融部を融合させるようにした溶接構造として好結
果を得たものである。 As mentioned above, the first irradiation shifts the center of the laser beam 14 onto the end face of the cap 11 rather than the boundary line between the cap 11 and the ring 12, and melts the boundary line and the ring 12 in the laser beam 14. By doing so, mainly the cap 11 largely melts and melts into the ring 12 side. In this way, the entire circumference is welded. Next, for the second irradiation, the center of the laser beam 14 is focused on the ring 12 and the cap 11.
The ring 12 is deviated from the boundary line to the surface of the ring 12, and the boundary line and the cap 11 are included in the laser beam 14 and melted, so that the ring 12 is largely melted and covers the first melted part. and merge. This two-step welding structure means that if the welding is performed directly on the interface, slight fluctuations in feed will occur and the center of the laser beam 14 will be at the cap 1.
1 and ring 12, resulting in a portion where the two do not fuse, good results were obtained as a welded structure in which the fused portions are fused to each other.
以上、詳細に説明したように本発明のマイクロ
波筐体の製造方法はマイクロ波筐体の本体に該筐
体とロー付け性が良く且つキヤツプとレーザ溶接
性の良い金属で形成されたリングを介してキヤツ
プを封止する構造とし、筐体本体とキヤツプとの
接合は、両者の境界線の左右を２回にわたりレー
ザ溶接することにより十分な気密性が得られると
いつた効果大なるものである。
As explained above in detail, the method for manufacturing a microwave casing of the present invention includes attaching a ring to the main body of the microwave casing, which is made of a metal that is easily soldered to the casing and has good laser weldability to the cap. The structure is such that the cap is sealed through the cap, and the main body of the casing and the cap are joined by laser welding twice on the left and right sides of the boundary line between the two, which is highly effective in achieving sufficient airtightness. be.
第１図は従来のマイクロ波用筐体を説明するた
めの図、第２図は本発明方法により作成するマイ
クロ波筐体を説明するための分解斜視図、第３図
はレーザ溶接の実際例を説明するための図であ
る。
図面において、１０は筐体本体、１１はキヤツ
プ、１２はリングをそれぞれ示す。
Figure 1 is a diagram for explaining a conventional microwave housing, Figure 2 is an exploded perspective view for explaining a microwave housing made by the method of the present invention, and Figure 3 is an actual example of laser welding. FIG. In the drawings, 10 represents a housing body, 11 represents a cap, and 12 represents a ring.
Claims (1)
属リングを接合して該リングにキヤツプを被せ、
上記リングとキヤツプの境界線をレーザビーム中
に含んで何れか一方に該レーザビームの中心を偏
倚させて全周をレーザ溶接し、次に上記境界線を
含む他方にレーザビームの中心を偏倚させて全周
をレーザ溶接することにより、先の溶融部に後の
溶融部を覆わせ相互に融合せしめた溶接構造とし
て気密封止することを特徴とするマイクロ波筐体
の製造方法。1. Join a metal ring with good laser weldability around the opening of the housing body, cover the ring with a cap,
The boundary line between the ring and the cap is included in the laser beam, and the center of the laser beam is shifted to one side to laser weld the entire circumference, and then the center of the laser beam is shifted to the other side, including the boundary line. 1. A method for manufacturing a microwave casing, characterized in that by laser welding the entire circumference of the casing, an earlier molten part is covered with a later fused part, and the welded structure is fused together to form an airtight seal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58189160A JPS6081843A (en) | 1983-10-12 | 1983-10-12 | Microwave box construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58189160A JPS6081843A (en) | 1983-10-12 | 1983-10-12 | Microwave box construction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6081843A JPS6081843A (en) | 1985-05-09 |
| JPH0259629B2 true JPH0259629B2 (en) | 1990-12-13 |
Family
ID=16236454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58189160A Granted JPS6081843A (en) | 1983-10-12 | 1983-10-12 | Microwave box construction |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6081843A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2648275A1 (en) * | 1989-06-09 | 1990-12-14 | Thomson Csf | Process and device for encapsulating microwave modules |
| US5656184A (en) * | 1995-03-27 | 1997-08-12 | General Electric Company | Method of laser welding open receptacles |
| CN102653034A (en) * | 2011-12-16 | 2012-09-05 | 成都泛华航空仪表电器有限公司 | Pulsed laser welding method for high-pressure sealed valve body component |
| JP6497503B2 (en) * | 2014-11-21 | 2019-04-10 | 三浦工業株式会社 | Manufacturing method of plate heat exchanger |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5878443A (en) * | 1981-11-04 | 1983-05-12 | Nec Corp | Manufacture of semiconductor device |
-
1983
- 1983-10-12 JP JP58189160A patent/JPS6081843A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5878443A (en) * | 1981-11-04 | 1983-05-12 | Nec Corp | Manufacture of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6081843A (en) | 1985-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR930017162A (en) | Manufacturing method of lead frame for semiconductor device and lead frame and resin encapsulated semiconductor device for semiconductor device | |
| JP3670008B2 (en) | How to make an airtight solder joint | |
| JP2001006767A (en) | Joining method for coated wire and resin chip with recess | |
| US5279623A (en) | Method of fabricating flat type electrochemical device | |
| JP3908838B2 (en) | Aluminum container and manufacturing method thereof | |
| JPH0259629B2 (en) | ||
| JPH0252425B2 (en) | ||
| JP3878899B2 (en) | Electronic device and manufacturing method thereof | |
| JPH06151629A (en) | Package equipped with window for transmission of light | |
| JP2007019537A (en) | Electronic apparatus and its manufacturing method | |
| JPH043609A (en) | Oscillator | |
| JP2001274649A (en) | Method for air-tightly sealing quartz vibration device | |
| JPH10148736A (en) | Package for optical communications | |
| JP3248842B2 (en) | Manufacturing method of electronic component package | |
| JPS586783A (en) | Joining method for wire net into thin walled pipe | |
| JPH0590870A (en) | Crystal oscillator | |
| JP2004241671A (en) | Electronic parts package and its sealing method | |
| JPS60117644A (en) | Manufacture of semiconductor device | |
| JPS635234Y2 (en) | ||
| JPH07291753A (en) | Joining method of ceramics member and metal member | |
| JP2000003973A (en) | Package for electronic component | |
| JPS6248888B2 (en) | ||
| JPS6054152B2 (en) | Welding method for hermetically sealed terminals | |
| JPH01133009A (en) | Optical element module | |
| JPH0346732A (en) | Magnetron and manufacture thereof |