JPH0249352B2 - - Google Patents
Info
- Publication number
- JPH0249352B2 JPH0249352B2 JP58009938A JP993883A JPH0249352B2 JP H0249352 B2 JPH0249352 B2 JP H0249352B2 JP 58009938 A JP58009938 A JP 58009938A JP 993883 A JP993883 A JP 993883A JP H0249352 B2 JPH0249352 B2 JP H0249352B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- epoxy resin
- curing agent
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58009938A JPS59136368A (ja) | 1983-01-26 | 1983-01-26 | 導電性接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58009938A JPS59136368A (ja) | 1983-01-26 | 1983-01-26 | 導電性接着剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59136368A JPS59136368A (ja) | 1984-08-04 |
| JPH0249352B2 true JPH0249352B2 (OSRAM) | 1990-10-29 |
Family
ID=11733956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58009938A Granted JPS59136368A (ja) | 1983-01-26 | 1983-01-26 | 導電性接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59136368A (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4732702A (en) * | 1986-02-13 | 1988-03-22 | Hitachi Chemical Company, Ltd. | Electroconductive resin paste |
| JPS63132041A (ja) * | 1986-11-21 | 1988-06-04 | 日立化成工業株式会社 | 銅箔処理方法 |
| JPS63161015A (ja) * | 1986-12-25 | 1988-07-04 | Sumitomo Bakelite Co Ltd | 導電性樹脂ペ−スト |
| CN107046763B (zh) * | 2016-02-05 | 2019-12-24 | Jx金属株式会社 | 柔性印刷基板用铜箔、使用其的覆铜层叠体 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010639B2 (OSRAM) * | 1972-10-27 | 1975-04-23 | ||
| JPS5390344A (en) * | 1977-01-21 | 1978-08-09 | Hitachi Ltd | Adhesive composition |
| JPS5426000A (en) * | 1977-07-28 | 1979-02-27 | Mitsubishi Chem Ind Ltd | Epoxy resin composition |
-
1983
- 1983-01-26 JP JP58009938A patent/JPS59136368A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59136368A (ja) | 1984-08-04 |
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