JPH0245637U - - Google Patents

Info

Publication number
JPH0245637U
JPH0245637U JP12535688U JP12535688U JPH0245637U JP H0245637 U JPH0245637 U JP H0245637U JP 12535688 U JP12535688 U JP 12535688U JP 12535688 U JP12535688 U JP 12535688U JP H0245637 U JPH0245637 U JP H0245637U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
mold cavity
sealing
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12535688U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12535688U priority Critical patent/JPH0245637U/ja
Publication of JPH0245637U publication Critical patent/JPH0245637U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す断面図、第２
図は封止後の半導体装置を示す図、第３図は従来
例を示す断面図、第４図は樹脂モールド型半導体
装置を示す斜視図である。 １……樹脂部、２……外部リード、３ａ，３ｂ
……金型、５……キヤビテイ、６……溝。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体装置を金型のキヤビテイ内に受け入れ、
    該キヤビテイ内に樹脂を注入して該半導体装置を
    樹脂封止する樹脂封止装置において、金型のキヤ
    ビテイ内から半導体装置の外部リードに沿つて漏
    出する樹脂を受け入れる溝を前記金型のキヤビテ
    イに隣接させて有することを特徴とする樹脂封入
    用治具。
JP12535688U 1988-09-26 1988-09-26 Pending JPH0245637U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12535688U JPH0245637U (ja) 1988-09-26 1988-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12535688U JPH0245637U (ja) 1988-09-26 1988-09-26

Publications (1)

Publication Number Publication Date
JPH0245637U true JPH0245637U (ja) 1990-03-29

Family

ID=31375893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12535688U Pending JPH0245637U (ja) 1988-09-26 1988-09-26

Country Status (1)

Country Link
JP (1) JPH0245637U (ja)

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