JPS62126835U - - Google Patents
Info
- Publication number
- JPS62126835U JPS62126835U JP1986013136U JP1313686U JPS62126835U JP S62126835 U JPS62126835 U JP S62126835U JP 1986013136 U JP1986013136 U JP 1986013136U JP 1313686 U JP1313686 U JP 1313686U JP S62126835 U JPS62126835 U JP S62126835U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- metal substrate
- resin
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Description
第１図ａ，ｂ，ｃは従来装置の平面図、断面図
、説明図、第２図、第３図は本考案の実施例を示
す断面構造図。１は金属基板、１ａは取りつけ穴
、２は半導体ペレツト、３は外装樹脂用熱可塑性
樹脂、４は内部リード、５は半田、６は成形時の
外形、７は収縮後の外形、８は金属ペレツト、９
は第１層目の半田層、１０は第２層目の半田層で
ある。
、説明図、第２図、第３図は本考案の実施例を示
す断面構造図。１は金属基板、１ａは取りつけ穴
、２は半導体ペレツト、３は外装樹脂用熱可塑性
樹脂、４は内部リード、５は半田、６は成形時の
外形、７は収縮後の外形、８は金属ペレツト、９
は第１層目の半田層、１０は第２層目の半田層で
ある。
Claims (1)
- 金属基板上に半導体ペレツトを固着し、該半導
体ペレツト及び固着部を熱可塑性樹脂で被つてな
る樹脂封止型半導体装置において、該半導体ペレ
ツトと該金属基板の間に該金属基板と同材質の金
属ペレツトを介在せしめたことを特徴とする樹脂
封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986013136U JPS62126835U (ja) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986013136U JPS62126835U (ja) | 1986-01-31 | 1986-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62126835U true JPS62126835U (ja) | 1987-08-12 |
Family
ID=30801913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986013136U Pending JPS62126835U (ja) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62126835U (ja) |
-
1986
- 1986-01-31 JP JP1986013136U patent/JPS62126835U/ja active Pending