JPH033750U - - Google Patents

Info

Publication number
JPH033750U
JPH033750U JP1989064989U JP6498989U JPH033750U JP H033750 U JPH033750 U JP H033750U JP 1989064989 U JP1989064989 U JP 1989064989U JP 6498989 U JP6498989 U JP 6498989U JP H033750 U JPH033750 U JP H033750U
Authority
JP
Japan
Prior art keywords
lead
semiconductor element
plating
connection
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989064989U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989064989U priority Critical patent/JPH033750U/ja
Publication of JPH033750U publication Critical patent/JPH033750U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す半導体装置の
リードフレームの斜視図、第２図は同じくその断
面図、第３図はリードフレームを成形金型にセツ
トした状態を示す断面図、第４図はそのリードフ
レームを利用した半導体装置の完成品の斜視図、
第５図は従来の半導体装置のリードフレームを示
す断面図、第６図はリードフレームを成形金型に
セツトした状態を示す断面図、第７図はそのリー
ドフレームを利用した半導体装置の完成品の斜視
図である。 ２０……半導体素子、２１……搭載用リード端
子、２３……結線用リード端子、２５……タイバ
ー、２８……樹脂、３１……下地めつき、３２，
３３……インナーリード部、３４……結線用めつ
き、３５，３６……アウターリード部、３７……
外装めつき、２１ａ，２３ａ……範囲、３４ａ，
３７ａ……境界部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子が搭載される半導体素子搭載用リー
    ド端子と、半導体素子と内部結線される半導体素
    子結線用リード端子と、搭載用リード端子および
    結線用リード端子を連結支持するタイバーとを備
    え、該搭載用リード端子および結線用リード端子
    が樹脂により樹脂封止される半導体装置のリード
    フレームにおいて、予め、前記搭載用リード端子
    および結線用リード端子のうち、樹脂封止される
    インナーリード部に半導体素子との内部結線を可
    能にする結線用めつきが施され、樹脂封止されな
    いアウターリード部に外装めつきが施され、前記
    タイバーと、インナーリード部の結線用めつきの
    境界部からアウターリード部の外装めつきの境界
    部までの範囲とは、耐熱性の高い下地めつきが露
    出されたことを特徴とする半導体装置のリードフ
    レーム。
JP1989064989U 1989-06-02 1989-06-02 Pending JPH033750U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989064989U JPH033750U (ja) 1989-06-02 1989-06-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989064989U JPH033750U (ja) 1989-06-02 1989-06-02

Publications (1)

Publication Number Publication Date
JPH033750U true JPH033750U (ja) 1991-01-16

Family

ID=31596415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989064989U Pending JPH033750U (ja) 1989-06-02 1989-06-02

Country Status (1)

Country Link
JP (1) JPH033750U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002347889A (ja) * 2001-05-29 2002-12-04 Asahi Soft Drinks Co Ltd 樹脂製ボトルのキャップ巻き締め装置及び方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002347889A (ja) * 2001-05-29 2002-12-04 Asahi Soft Drinks Co Ltd 樹脂製ボトルのキャップ巻き締め装置及び方法

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