JPH0350342U - - Google Patents
Info
- Publication number
- JPH0350342U JPH0350342U JP1989111715U JP11171589U JPH0350342U JP H0350342 U JPH0350342 U JP H0350342U JP 1989111715 U JP1989111715 U JP 1989111715U JP 11171589 U JP11171589 U JP 11171589U JP H0350342 U JPH0350342 U JP H0350342U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- heat sink
- recess
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Description
第１図は従来装置の断面構造図、第２図、第３
図は本考案の実施例を示す断面構造図、斜視構造
図、第４図は第３図の製造工程図、１……半導体
チツプ、２……内部接続片、３……外部取出しリ
ード片、４……絶縁金属基板、５……樹脂ケース
、６……注入樹脂部、７……凹部、８……放熱体
、Ａ……接着材である。
図は本考案の実施例を示す断面構造図、斜視構造
図、第４図は第３図の製造工程図、１……半導体
チツプ、２……内部接続片、３……外部取出しリ
ード片、４……絶縁金属基板、５……樹脂ケース
、６……注入樹脂部、７……凹部、８……放熱体
、Ａ……接着材である。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 放熱体を具備する樹脂封止型半導体装置に
おいて、樹脂ケースの内、半導体チツプを装着し
た部分の少なくとも片面に凹部を形成し、該凹部
に放熱体をその一部が露出するごとく、はめ込ん
で固着したことを特徴とする樹脂封止型半導体装
置。 (2) 樹脂ケースの内、放熱体の固着部分よりリ
ード取出し部分を厚く形成した実用新案登録請求
の範囲第(1)項の樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989111715U JPH0350342U (ja) | 1989-09-25 | 1989-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989111715U JPH0350342U (ja) | 1989-09-25 | 1989-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350342U true JPH0350342U (ja) | 1991-05-16 |
Family
ID=31660182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989111715U Pending JPH0350342U (ja) | 1989-09-25 | 1989-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350342U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6366953A (ja) * | 1986-09-08 | 1988-03-25 | Toshiba Corp | 樹脂絶縁型半導体装置 |
-
1989
- 1989-09-25 JP JP1989111715U patent/JPH0350342U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6366953A (ja) * | 1986-09-08 | 1988-03-25 | Toshiba Corp | 樹脂絶縁型半導体装置 |