JPH0361354U - - Google Patents

Info

Publication number
JPH0361354U
JPH0361354U JP1989122387U JP12238789U JPH0361354U JP H0361354 U JPH0361354 U JP H0361354U JP 1989122387 U JP1989122387 U JP 1989122387U JP 12238789 U JP12238789 U JP 12238789U JP H0361354 U JPH0361354 U JP H0361354U
Authority
JP
Japan
Prior art keywords
resin case
resin
cut
semiconductor device
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989122387U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989122387U priority Critical patent/JPH0361354U/ja
Publication of JPH0361354U publication Critical patent/JPH0361354U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/40247—Connecting the strap to a bond pad of the item
    • H01L2224/40249—Connecting the strap to a bond pad of the item the bond pad protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は従来装置の断面構造図、第２図、第４
図は本考案の実施例をしめす断面構造図、第３図
ａ，ｂは製造工程図であり、１……半導体チツプ
、２，２′……リード片、Ａ，Ａ′……リード片
の外部電極面、Ｂ，Ｂ′……リード片の折曲部、
Ｃ，Ｃ′……リード片の端部切断面、Ｄ，Ｄ′…
…リード片の薄い部分、３……接続子、４……樹
脂ケースである。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 少なくとも、半導体チツプ、予め折曲部を
    形成した複数個のリード片、及び樹脂ケースから
    成り、リード片の折曲部を樹脂ケース内に配置し
    、その折曲部の一部を樹脂ケースから露出せしめ
    て外部電極面となし、かつ、折曲部から樹脂ケー
    スの外側に向うリード片の端部切断面を樹脂ケー
    ス表面の近傍又は内側に配置せしめるように構成
    したことを特徴とする樹脂封止型半導体装置。 (2) 樹脂ケース下方に各外部電極面を配置し、
    樹脂ケース側方にリード片の端部切断面を配置し
    た実用新案登録請求の範囲第(1)項の樹脂封止型
    半導体装置。 (3) 外力により切断し得るごとく、リード片に
    予め設けた切り込みなどによる薄い部分に端部切
    断面を設けた実用新案登録請求の範囲第(1)項、
    及び第(2)項の樹脂封止型半導体装置。
JP1989122387U 1989-10-19 1989-10-19 Pending JPH0361354U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989122387U JPH0361354U (ja) 1989-10-19 1989-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989122387U JPH0361354U (ja) 1989-10-19 1989-10-19

Publications (1)

Publication Number Publication Date
JPH0361354U true JPH0361354U (ja) 1991-06-17

Family

ID=31670388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989122387U Pending JPH0361354U (ja) 1989-10-19 1989-10-19

Country Status (1)

Country Link
JP (1) JPH0361354U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062527A (ja) * 2006-10-04 2013-04-04 Rohm Co Ltd 半導体装置
JP2016003910A (ja) * 2014-06-16 2016-01-12 アルプス電気株式会社 圧力検出装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062527A (ja) * 2006-10-04 2013-04-04 Rohm Co Ltd 半導体装置
JP2016003910A (ja) * 2014-06-16 2016-01-12 アルプス電気株式会社 圧力検出装置及びその製造方法

Similar Documents

Publication Publication Date Title
JPH0361354U (ja)
JPS6185159U (ja)
JPH0317644U (ja)
JPS6333642U (ja)
JPH032650U (ja)
JPH0381641U (ja)
JPH0350342U (ja)
JPS61106044U (ja)
JPH01139443U (ja)
JPS62163966U (ja)
JPH02118939U (ja)
JPS635646U (ja)
JPS63118247U (ja)
JPH0231147U (ja)
JPS63134548U (ja)
JPS6196557U (ja)
JPS63180929U (ja)
JPS6329938U (ja)
JPS636748U (ja)
JPH0328754U (ja)
JPH0356153U (ja)
JPH0312429U (ja)
JPS6387836U (ja)
JPH0317642U (ja)
JPH02101559U (ja)