JPH0244149B2 - - Google Patents
Info
- Publication number
- JPH0244149B2 JPH0244149B2 JP59217137A JP21713784A JPH0244149B2 JP H0244149 B2 JPH0244149 B2 JP H0244149B2 JP 59217137 A JP59217137 A JP 59217137A JP 21713784 A JP21713784 A JP 21713784A JP H0244149 B2 JPH0244149 B2 JP H0244149B2
- Authority
- JP
- Japan
- Prior art keywords
- scriber
- wafer
- semiconductor wafer
- scribing
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10P54/00—
Landscapes
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59217137A JPS6194340A (ja) | 1984-10-15 | 1984-10-15 | 半導体ウェハのケガキ傷形成装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59217137A JPS6194340A (ja) | 1984-10-15 | 1984-10-15 | 半導体ウェハのケガキ傷形成装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6194340A JPS6194340A (ja) | 1986-05-13 |
| JPH0244149B2 true JPH0244149B2 (enExample) | 1990-10-02 |
Family
ID=16699430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59217137A Granted JPS6194340A (ja) | 1984-10-15 | 1984-10-15 | 半導体ウェハのケガキ傷形成装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6194340A (enExample) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58159743U (ja) * | 1982-04-19 | 1983-10-25 | 日本電気株式会社 | 半導体ペレツタイズ装置 |
-
1984
- 1984-10-15 JP JP59217137A patent/JPS6194340A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6194340A (ja) | 1986-05-13 |
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