JPH0244149B2 - - Google Patents

Info

Publication number
JPH0244149B2
JPH0244149B2 JP59217137A JP21713784A JPH0244149B2 JP H0244149 B2 JPH0244149 B2 JP H0244149B2 JP 59217137 A JP59217137 A JP 59217137A JP 21713784 A JP21713784 A JP 21713784A JP H0244149 B2 JPH0244149 B2 JP H0244149B2
Authority
JP
Japan
Prior art keywords
scriber
wafer
semiconductor wafer
scribing
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59217137A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6194340A (ja
Inventor
Hayamizu Fukada
Haruo Tanaka
Masahito Mushigami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP59217137A priority Critical patent/JPS6194340A/ja
Publication of JPS6194340A publication Critical patent/JPS6194340A/ja
Publication of JPH0244149B2 publication Critical patent/JPH0244149B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Dicing (AREA)
JP59217137A 1984-10-15 1984-10-15 半導体ウェハのケガキ傷形成装置 Granted JPS6194340A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59217137A JPS6194340A (ja) 1984-10-15 1984-10-15 半導体ウェハのケガキ傷形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59217137A JPS6194340A (ja) 1984-10-15 1984-10-15 半導体ウェハのケガキ傷形成装置

Publications (2)

Publication Number Publication Date
JPS6194340A JPS6194340A (ja) 1986-05-13
JPH0244149B2 true JPH0244149B2 (enExample) 1990-10-02

Family

ID=16699430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59217137A Granted JPS6194340A (ja) 1984-10-15 1984-10-15 半導体ウェハのケガキ傷形成装置

Country Status (1)

Country Link
JP (1) JPS6194340A (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159743U (ja) * 1982-04-19 1983-10-25 日本電気株式会社 半導体ペレツタイズ装置

Also Published As

Publication number Publication date
JPS6194340A (ja) 1986-05-13

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