KR850003058A - 반도체 웨이퍼(Wafer)에 붙여진 시이트상 부재를 절단하는 장치 - Google Patents

반도체 웨이퍼(Wafer)에 붙여진 시이트상 부재를 절단하는 장치 Download PDF

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Publication number
KR850003058A
KR850003058A KR1019840006513A KR840006513A KR850003058A KR 850003058 A KR850003058 A KR 850003058A KR 1019840006513 A KR1019840006513 A KR 1019840006513A KR 840006513 A KR840006513 A KR 840006513A KR 850003058 A KR850003058 A KR 850003058A
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KR
South Korea
Prior art keywords
semiconductor wafer
edge
heating rod
heating
semiconductor wafers
Prior art date
Application number
KR1019840006513A
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English (en)
Other versions
KR920005803B1 (ko
Inventor
오노 다까도시
Original Assignee
미쓰오 세끼야
가부시끼 가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP58197359A external-priority patent/JPS6090700A/ja
Priority claimed from JP8655784A external-priority patent/JPS60231328A/ja
Application filed by 미쓰오 세끼야, 가부시끼 가이샤 디스코 filed Critical 미쓰오 세끼야
Publication of KR850003058A publication Critical patent/KR850003058A/ko
Application granted granted Critical
Publication of KR920005803B1 publication Critical patent/KR920005803B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D1/00—Planing or slotting machines cutting by relative movement of the tool and workpiece in a horizontal straight line only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S83/00—Cutting
    • Y10S83/01—Safety devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S83/00—Cutting
    • Y10S83/914—Flash trimming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T82/00—Turning
    • Y10T82/16—Severing or cut-off
    • Y10T82/16081—Combined with means to heat tool and/or work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y10T83/041—By heating or cooling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/283—With means to control or modify temperature of apparatus or work
    • Y10T83/293—Of tool

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Cutting Devices (AREA)

Abstract

내용 없음

Description

반도체 웨이퍼(Wafer)에 붙여진 시이트상 부재를 절단하는 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예에 따르는 테이프 접착장치의 개략적인 종단면도, 제2도는 접착된 테이프가절단된 상태를 나타내는 제1도와 같은 것의 개략적인 종단면도, 제3a도는 가열, 절단장치중 가열봉의 부분확대 사시도, 제3b도는 제3a도의 B-B선 단면도.

Claims (4)

  1. 반도체 웨이퍼의 표면에 붙여진 시이트상 부재를 상기 반도체 웨이퍼의 가장자리에서 절단시키는 장치에 있어서, 상기 반도체 웨이퍼의 가장자리와 접촉되게 하는 가열봉과, 가열봉을 가열시키는 가열수단과, 상기 반도체웨이퍼의 가장자리에 가열봉을 눌러주는 가압수단과, 상기 반도체웨이퍼의 가장자리를 따라서 가열봉을 이동시켜 주는 이동장치와, 상기 가열봉이 상기 반도체 웨이퍼의 가장자리로 눌러질 때 상기 반도웨이퍼의 가장자리를 따라서 가열봉이 이동되게 하여서, 상기 반도체 웨이퍼에 붙여진 상기 시이트 상부재를 상기 반도체 웨이퍼의 가장자리에서 용융 및 절단시켜 주도록 된 것.
  2. 제1항에 있어서, 상기 반도체 웨이퍼의 가장자리에 접촉되어지는 상기 가열봉의 부분이 모가난 것.
  3. 제2항에 있어서, 상기 가열봉의 모난 부분의 30°와 90°범위의 2면각으로 된 것.
  4. 제1항에 있어서, 상기 가열봉의 가열온도가 70℃와 500℃범위내에 있는 것.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840006513A 1983-10-21 1984-10-19 반도체 웨이퍼(Wafer)에 붙여진 시이트상 부재를 절단하는 장치 KR920005803B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP83-197359 1983-10-21
JP58-197359 1983-10-21
JP58197359A JPS6090700A (ja) 1983-10-21 1983-10-21 半導体ウエハに貼付されたシ−ト状部材を切断するための装置
JP8655784A JPS60231328A (ja) 1984-04-27 1984-04-27 半導体ウエハに貼付されたシ−ト状部材を切断するための装置
JP84-86557 1984-04-27
JP59-86557 1984-04-27

Publications (2)

Publication Number Publication Date
KR850003058A true KR850003058A (ko) 1985-05-28
KR920005803B1 KR920005803B1 (ko) 1992-07-18

Family

ID=26427664

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840006513A KR920005803B1 (ko) 1983-10-21 1984-10-19 반도체 웨이퍼(Wafer)에 붙여진 시이트상 부재를 절단하는 장치

Country Status (2)

Country Link
US (1) US4603609A (ko)
KR (1) KR920005803B1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6443458A (en) * 1987-08-11 1989-02-15 Nitto Denko Corp Stick cutter for tacky tape with respect to thin board
US5431076A (en) * 1993-04-19 1995-07-11 Ralph E. Hastings Trimming apparatus
US5689937A (en) * 1993-11-18 1997-11-25 World Class Packaging Systems, Inc. Method for packing food
JP3792417B2 (ja) 1998-10-26 2006-07-05 ナブテスコ株式会社 真空チャンバーに用いる回転軸のシール機構
US6892616B2 (en) * 2000-11-28 2005-05-17 Uht Corporation Cutting apparatus
JP4530638B2 (ja) * 2003-10-07 2010-08-25 日東電工株式会社 半導体ウエハへの保護テープ貼付方法及び貼付装置
JP4136890B2 (ja) * 2003-10-17 2008-08-20 日東電工株式会社 保護テープの切断方法及び切断装置
PL1607492T3 (pl) * 2004-06-02 2008-01-31 Applied Mat Gmbh & Co Kg Urządzenie do obróbki taśm mające co najmniej jedną komorę próżniową
JP2006272505A (ja) * 2005-03-29 2006-10-12 Nitto Denko Corp 保護テープ切断方法およびこれを用いた装置
JP4452691B2 (ja) * 2005-08-04 2010-04-21 リンテック株式会社 シート切断装置及び切断方法
JP4642002B2 (ja) * 2006-11-14 2011-03-02 日東電工株式会社 半導体ウエハの保護テープ切断方法および保護テープ切断装置
JP5028233B2 (ja) * 2007-11-26 2012-09-19 日東電工株式会社 半導体ウエハの保護テープ切断方法および保護テープ切断装置
KR20140019549A (ko) * 2012-08-06 2014-02-17 주성엔지니어링(주) 유기발광장치의 제조방법
JP6122311B2 (ja) * 2013-02-28 2017-04-26 日東電工株式会社 粘着テープ切断方法および粘着テープ片切断装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4414872A (en) * 1981-04-29 1983-11-15 American Optical Corporation Lens tape cutter

Also Published As

Publication number Publication date
US4603609A (en) 1986-08-05
KR920005803B1 (ko) 1992-07-18

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