JPS5671952A - Breaking semiconductor wafer - Google Patents

Breaking semiconductor wafer

Info

Publication number
JPS5671952A
JPS5671952A JP14911179A JP14911179A JPS5671952A JP S5671952 A JPS5671952 A JP S5671952A JP 14911179 A JP14911179 A JP 14911179A JP 14911179 A JP14911179 A JP 14911179A JP S5671952 A JPS5671952 A JP S5671952A
Authority
JP
Japan
Prior art keywords
tape
wafer
semiconductor wafer
fastened
cushion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14911179A
Other languages
Japanese (ja)
Inventor
Akihiro Yanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP14911179A priority Critical patent/JPS5671952A/en
Publication of JPS5671952A publication Critical patent/JPS5671952A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To give clearances between divided pellets by giving tension to an extension to an extensible tape with one end thereof fastened when a semiconductor wafer fastened to the tape and placed on a table with a cushion put therebetween is broken using a roller. CONSTITUTION:A recess is provided in the surface of a reciprocating table 8 and filled with a cushion 9 made of rubber for example. On the other hand, a semiconductor wafer 1 is connected to an extensible tape 2 larger than the wafer 1 so that the lateral and longitudinal grooves provided thereon may be kept exposed and the groove side of the wafer 1 is contacted with the cushion 9 with one end of the tape 2 fastened to a table 8. Thereafter, the wafer 1 is pelletized along the grooves with a roller contacted with the upper side of the tape 2 turned oppositely to the transfer direction of the table 8 while the tape 2 is heated using a heater placed on the upper part of the table 8. Thus, clearances are given between divided pellets without causing any damage.
JP14911179A 1979-11-16 1979-11-16 Breaking semiconductor wafer Pending JPS5671952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14911179A JPS5671952A (en) 1979-11-16 1979-11-16 Breaking semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14911179A JPS5671952A (en) 1979-11-16 1979-11-16 Breaking semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5671952A true JPS5671952A (en) 1981-06-15

Family

ID=15467938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14911179A Pending JPS5671952A (en) 1979-11-16 1979-11-16 Breaking semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5671952A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60165778A (en) * 1984-02-07 1985-08-28 Rohm Co Ltd Manufacture of chip of semiconductor laser
JPS60165779A (en) * 1984-02-07 1985-08-28 Rohm Co Ltd Manufacture of chip of semiconductor laser
JPS6116592A (en) * 1984-07-02 1986-01-24 Rohm Co Ltd Manufacture of chip of semiconductor laser
JPS6116591A (en) * 1984-07-02 1986-01-24 Rohm Co Ltd Manufacture of chip of semiconductor laser

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60165778A (en) * 1984-02-07 1985-08-28 Rohm Co Ltd Manufacture of chip of semiconductor laser
JPS60165779A (en) * 1984-02-07 1985-08-28 Rohm Co Ltd Manufacture of chip of semiconductor laser
JPH0259636B2 (en) * 1984-02-07 1990-12-13 Rohm Kk
JPH055195B2 (en) * 1984-02-07 1993-01-21 Rohm Kk
JPS6116592A (en) * 1984-07-02 1986-01-24 Rohm Co Ltd Manufacture of chip of semiconductor laser
JPS6116591A (en) * 1984-07-02 1986-01-24 Rohm Co Ltd Manufacture of chip of semiconductor laser
JPH0260076B2 (en) * 1984-07-02 1990-12-14 Rohm Kk

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