JPH0242901B2 - - Google Patents
Info
- Publication number
- JPH0242901B2 JPH0242901B2 JP62188030A JP18803087A JPH0242901B2 JP H0242901 B2 JPH0242901 B2 JP H0242901B2 JP 62188030 A JP62188030 A JP 62188030A JP 18803087 A JP18803087 A JP 18803087A JP H0242901 B2 JPH0242901 B2 JP H0242901B2
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- vacuum processing
- workpiece
- chambers
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012545 processing Methods 0.000 claims description 84
- 238000012546 transfer Methods 0.000 claims description 41
- 238000004544 sputter deposition Methods 0.000 claims description 20
- 238000011109 contamination Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 4
- 238000000992 sputter etching Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18803087A JPS6431971A (en) | 1987-07-28 | 1987-07-28 | Vacuum treatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18803087A JPS6431971A (en) | 1987-07-28 | 1987-07-28 | Vacuum treatment device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6431971A JPS6431971A (en) | 1989-02-02 |
| JPH0242901B2 true JPH0242901B2 (ru) | 1990-09-26 |
Family
ID=16216436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18803087A Granted JPS6431971A (en) | 1987-07-28 | 1987-07-28 | Vacuum treatment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6431971A (ru) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2644912B2 (ja) | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
| USRE39756E1 (en) * | 1990-08-29 | 2007-08-07 | Hitachi, Ltd. | Vacuum processing operating method with wafers, substrates and/or semiconductors |
| USRE39824E1 (en) | 1990-08-29 | 2007-09-11 | Hitachi, Ltd. | Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors |
| US7089680B1 (en) | 1990-08-29 | 2006-08-15 | Hitachi, Ltd. | Vacuum processing apparatus and operating method therefor |
| DE9407482U1 (de) * | 1994-05-05 | 1994-10-06 | Balzers und Leybold Deutschland Holding AG, 63450 Hanau | Funktionseinrichtung für eine Vakuumanlage für die Behandlung von scheibenförmigen Werkstücken |
| US20060102078A1 (en) * | 2004-11-18 | 2006-05-18 | Intevac Inc. | Wafer fab |
| US7611322B2 (en) | 2004-11-18 | 2009-11-03 | Intevac, Inc. | Processing thin wafers |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5763676A (en) * | 1980-10-03 | 1982-04-17 | Hitachi Ltd | Continuous sputtering device |
| JPS5877239A (ja) * | 1981-11-04 | 1983-05-10 | Ulvac Corp | 連続式真空処理装置 |
| JPS6040532A (ja) * | 1983-07-19 | 1985-03-02 | バリアン・アソシエイツ・インコ−ポレイテツド | デイスク又はウエ−ハ取り扱い及びコ−テイング装置 |
| JPS6050312A (ja) * | 1983-08-31 | 1985-03-20 | Sharp Corp | 石油燃焼器の点火装置 |
| JPS60109218A (ja) * | 1983-11-18 | 1985-06-14 | Hitachi Ltd | 分子線エピタキシャル成長装置 |
| JPS6155926A (ja) * | 1984-08-27 | 1986-03-20 | Nec Corp | 半導体製造装置 |
| JPS61112312A (ja) * | 1984-11-07 | 1986-05-30 | Hitachi Ltd | 真空連続処理装置 |
| JPS6328863A (ja) * | 1986-07-22 | 1988-02-06 | Ulvac Corp | 真空処理装置 |
-
1987
- 1987-07-28 JP JP18803087A patent/JPS6431971A/ja active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5763676A (en) * | 1980-10-03 | 1982-04-17 | Hitachi Ltd | Continuous sputtering device |
| JPS5877239A (ja) * | 1981-11-04 | 1983-05-10 | Ulvac Corp | 連続式真空処理装置 |
| JPS6040532A (ja) * | 1983-07-19 | 1985-03-02 | バリアン・アソシエイツ・インコ−ポレイテツド | デイスク又はウエ−ハ取り扱い及びコ−テイング装置 |
| JPS6050312A (ja) * | 1983-08-31 | 1985-03-20 | Sharp Corp | 石油燃焼器の点火装置 |
| JPS60109218A (ja) * | 1983-11-18 | 1985-06-14 | Hitachi Ltd | 分子線エピタキシャル成長装置 |
| JPS6155926A (ja) * | 1984-08-27 | 1986-03-20 | Nec Corp | 半導体製造装置 |
| JPS61112312A (ja) * | 1984-11-07 | 1986-05-30 | Hitachi Ltd | 真空連続処理装置 |
| JPS6328863A (ja) * | 1986-07-22 | 1988-02-06 | Ulvac Corp | 真空処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6431971A (en) | 1989-02-02 |
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