JPH0240233B2 - - Google Patents

Info

Publication number
JPH0240233B2
JPH0240233B2 JP61248429A JP24842986A JPH0240233B2 JP H0240233 B2 JPH0240233 B2 JP H0240233B2 JP 61248429 A JP61248429 A JP 61248429A JP 24842986 A JP24842986 A JP 24842986A JP H0240233 B2 JPH0240233 B2 JP H0240233B2
Authority
JP
Japan
Prior art keywords
conductor
layer
wiring
etching
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61248429A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63104398A (ja
Inventor
Takaharu Imai
Rokuro Kanbe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP24842986A priority Critical patent/JPS63104398A/ja
Publication of JPS63104398A publication Critical patent/JPS63104398A/ja
Publication of JPH0240233B2 publication Critical patent/JPH0240233B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP24842986A 1986-10-21 1986-10-21 多層配線基板の製造方法 Granted JPS63104398A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24842986A JPS63104398A (ja) 1986-10-21 1986-10-21 多層配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24842986A JPS63104398A (ja) 1986-10-21 1986-10-21 多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS63104398A JPS63104398A (ja) 1988-05-09
JPH0240233B2 true JPH0240233B2 (enrdf_load_stackoverflow) 1990-09-10

Family

ID=17177991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24842986A Granted JPS63104398A (ja) 1986-10-21 1986-10-21 多層配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS63104398A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636443U (ja) * 1992-10-26 1994-05-17 正士 神志那 二段座板付椅子

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0286193A (ja) * 1988-09-22 1990-03-27 Fujitsu Ltd 薄膜多層回路基板の製造方法
JP2773366B2 (ja) * 1990-03-19 1998-07-09 富士通株式会社 多層配線基板の形成方法
JP2881270B2 (ja) * 1990-08-28 1999-04-12 日本特殊陶業株式会社 多層配線基板の製造方法
JP2749461B2 (ja) * 1991-05-29 1998-05-13 京セラ株式会社 多層回路基板及びその製造方法
JP2000340905A (ja) * 1999-05-28 2000-12-08 Toppan Printing Co Ltd 光・電気配線基板及び製造方法並びに実装基板
JP2001007529A (ja) * 1999-06-23 2001-01-12 Ibiden Co Ltd 多層プリント配線板及び多層プリント配線板の製造方法、半導体チップ及び半導体チップの製造方法
US8008188B2 (en) * 2007-06-11 2011-08-30 Ppg Industries Ohio, Inc. Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
JP6065359B2 (ja) * 2011-11-24 2017-01-25 凸版印刷株式会社 貫通電極付き配線基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60134497A (ja) * 1983-12-23 1985-07-17 株式会社日立製作所 配線基板およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636443U (ja) * 1992-10-26 1994-05-17 正士 神志那 二段座板付椅子

Also Published As

Publication number Publication date
JPS63104398A (ja) 1988-05-09

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