JPH0238443Y2 - - Google Patents
Info
- Publication number
- JPH0238443Y2 JPH0238443Y2 JP2877885U JP2877885U JPH0238443Y2 JP H0238443 Y2 JPH0238443 Y2 JP H0238443Y2 JP 2877885 U JP2877885 U JP 2877885U JP 2877885 U JP2877885 U JP 2877885U JP H0238443 Y2 JPH0238443 Y2 JP H0238443Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- bonding
- wire
- wire bonding
- wire bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 14
- 239000011295 pitch Substances 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003909 pattern recognition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2877885U JPH0238443Y2 (en)) | 1985-02-28 | 1985-02-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2877885U JPH0238443Y2 (en)) | 1985-02-28 | 1985-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61144641U JPS61144641U (en)) | 1986-09-06 |
JPH0238443Y2 true JPH0238443Y2 (en)) | 1990-10-17 |
Family
ID=30526977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2877885U Expired JPH0238443Y2 (en)) | 1985-02-28 | 1985-02-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0238443Y2 (en)) |
-
1985
- 1985-02-28 JP JP2877885U patent/JPH0238443Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61144641U (en)) | 1986-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6722412B2 (en) | Die bonder | |
JPH0238443Y2 (en)) | ||
JP2924459B2 (ja) | リードフレームの予備半田付け方法 | |
KR100368626B1 (ko) | 와이어본딩방법 및 장치 | |
JPH0964067A (ja) | ワークに対する半導体チップの供給装置 | |
JPH054277Y2 (en)) | ||
JPS6122636A (ja) | マウント方法 | |
JP2513437Y2 (ja) | ワイヤボンディング装置 | |
JPS6063936A (ja) | リ−ドフレ−ムの処理方法 | |
JP2526100Y2 (ja) | 銀ペーストキュア装置 | |
JP3229644B2 (ja) | キャリアテープのプレス工程における搬送装置 | |
JPS62105430A (ja) | 半導体装置の塗布装置 | |
JPH03212940A (ja) | リードフレームに対する半導体チップの供給方法 | |
JPH0149018B2 (en)) | ||
JPS6116689Y2 (en)) | ||
JPS6339481B2 (en)) | ||
JPH01316941A (ja) | ダイボンド装置 | |
JPH02163947A (ja) | 定ピッチ搬送装置 | |
JPH0810191Y2 (ja) | ワイヤボンディング装置 | |
JPS6063937A (ja) | 電子部品の組立装置 | |
JPS62154762A (ja) | 半導体製造方法 | |
JPH0464460B2 (en)) | ||
JPH0546985B2 (en)) | ||
JPS62150831A (ja) | ワイヤボンダ | |
JPS5914644A (ja) | 半導体装置組立用リ−ドフレ−ム位置決め装置 |