JPH0238443Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Field of Application) The present invention relates to a wire bonder with significantly improved bonding efficiency.

(Prior Art) FIG. 2 shows a conventional wire bonder. A is the supply side, B is the receiving side, and C is the bonding section. On the supply side A, a magazine ₂₁ storing multiple stages of lead frames ₁₁ that have been bonded with semiconductor pellets is intermittently raised in the direction of arrow a by an elevator (not shown), and is moved to the pusher 3 at each intermittent operation. It is then fed to the bonding section C.
At the receiving side B, the lead frames 1 ₂ that have undergone wire bonding are sent one by one and stored in an empty magazine 2 ₂ . This empty magazine 2 ₂ is also intermittently raised in the direction of arrow b by the elevator, and the lead frames 1 ₂ are stored one after another during each intermittent operation.

In the bonding section C, a heater 4 is provided, and a claw 5a of a carrier 5 (which moves back and forth by one pitch as shown by arrow c) is used to heat the heater 4.
The lead frame ₁₁ is fed one pitch at a time in pellet units, where it is positioned and clamped, and then the pattern recognition section of the bonding head 6 placed on the XY table detects the pellet position and lead position, and wire bonding is performed using a capillary. be exposed. And when this is completed, 1
A similar wire bonding process is performed on the next adjacent pellet.

As described above, since this conventional wire bonder is based on wire bonding in pellet units, the lead frame is also fed in pellet units, one pitch at a time.

However, with this feeding mechanism, the carrier 4 sometimes causes feeding errors, and the automation level cannot be increased beyond a certain level. Also, since it usually takes 500ms to feed one pitch,
When manufacturing products such as optical elements such as LEDs and phototransistors that require a small number of wires to be bonded, there is a problem in that the amount of time required for manufacturing increases the amount of time required for feeding.

(Purpose of the invention) The present invention was made in view of the above points, and its purpose is to create a wire bonder that does not cause mistakes in feeding the lead frame and can shorten the time required for feeding the lead frame. It is to provide.

(Structure of the invention) For this purpose, the wire bonder of the invention has a continuous transfer mechanism that transfers the lead frame from the supply side magazine toward the receiving side magazine, and a wire bonder that can move the lead frame over a distance approximately corresponding to the length of the lead frame. The wire bonding head is provided with a bonding head, and wire bonding is performed on all the pellets of the lead frame that have been transferred, positioned and clamped to the bonding position by the continuous transfer mechanism, so that bonding is performed in lead frame units.

(Example) Hereinafter, an example of the wire bonder of the present invention will be described. Figure 1 shows an example of this.
Components that are the same as those in FIG. 2 are given the same reference numerals. In this embodiment, the lead frame feeding mechanism in the bonding section C is a continuous feeding mechanism.
For example, it is composed of a plurality of sets of rollers 10. The rollers 10 are arranged on both sides of the lead frame along the feeding direction at a pitch equal to or less than the length of the lead frame, and are configured to grip both sides of the lead frame (the part where the claws 5a were conventionally hooked) and transport the lead frame. .

The lead frame 1 ₁ fed from the magazine 2 ₁ on the supply side A is fed without stopping until it is entirely placed on the heater 4, and then stopped there. After being positioned by a positioning mechanism (not shown), the lead frame 1 1 is moved to the tip 1a. After being clamped by a clamping mechanism (not shown), wire bonding is performed on all semiconductor pellets bonded to the lead frame ₁₁ .

This wire bonding is done on lead frame 1.
After the clamping in _{step 1} , the bonding head 6 is first moved in the direction of arrow d from its tip 1a side toward the supply side A, and during this movement, the pattern recognition section detects each pellet position and lead position, and When the detection is complete, move in the opposite direction (arrow e
direction), and wire bonding is performed on each pellet during its movement.

Note that at this time, the lead frame ₁₁ with the tip 1a clamped expands due to the heat generated by the heater 4;
Since the position of pellets, etc. is detected sequentially along the direction of their expansion, errors due to thermal expansion do not occur.

Further, the positioning of the stopping point of the lead frame on the heater 4 can be performed by the pattern recognition section of the bonding head 6, and the positional deviation at that time can be corrected by the roller 10.

The lead frame 1 ₂ that has undergone wire bonding as described above is unclamped thereon, and is then conveyed and stored in the magazine 2 ₂ on the receiving side B by the rollers 10 without stopping.

In this way, in this embodiment, the lead frame is not conveyed in pitches, but is conveyed continuously by the rollers 10, so there is no risk of mistakes occurring in the feed, and the level of automation can be improved. Furthermore, the time required for feeding can be shortened, and bonding efficiency can be improved in manufacturing devices with a small number of wires.
Furthermore, since there is no need to wait for the temperature of the frame to equilibrate with the temperature of the heater, bonding efficiency can be further improved.

(Effects of the invention) As described above, according to the wire bonder of the invention,
Since wire bonding is performed in lead frame units using a continuous transfer mechanism, there are no errors in feeding the lead frame, and the time required for the feeding can be shortened.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a wire bonder according to an embodiment of the present invention, and FIG. 2 is a block diagram of a conventional wire bonder. 1 ₁ ... Lead frame before wire bonding, 1 ₂ ... Lead frame after wire bonding, 2 ₁ , 2 ₂ ... Magazine, 3 ... Pusher,
4...Heater, 5...Carrier, 5a...Claw, 6
...bonding head.

Claims (1)

[Scope of Claim for Utility Model Registration] The lead frame with pellets bonded thereto is transferred from the supply side magazine to the wire bonding position, each pellet is wire bonded, and the lead frame after the wire bonding is stored in the receiving side magazine. The wire bonder includes a continuous transfer mechanism that transfers the lead frame from the supply side magazine toward the receiving side magazine, and a bonding head that is movable over a distance approximately corresponding to the length of the lead frame. A wire bonder characterized in that the wire bonder is configured to perform wire bonding on all pellets of the lead frame that have been transferred, positioned and clamped to a bonding position by the continuous transfer mechanism.