JPH02163947A - Definite-pitch conveyance apparatus - Google Patents
Definite-pitch conveyance apparatusInfo
- Publication number
- JPH02163947A JPH02163947A JP63318214A JP31821488A JPH02163947A JP H02163947 A JPH02163947 A JP H02163947A JP 63318214 A JP63318214 A JP 63318214A JP 31821488 A JP31821488 A JP 31821488A JP H02163947 A JPH02163947 A JP H02163947A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- feed lever
- treated
- pitch
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000032258 transport Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 18
- 230000007246 mechanism Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 208000028659 discharge Diseases 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Die Bonding (AREA)
- Automatic Assembly (AREA)
- Reciprocating Conveyors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、定ピッチ搬送装置に関するものであり、これ
は例えばワイヤボンディング工程においてプリント基板
を作業位置へ搬送し位置決めする装置として使用される
。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a constant pitch conveying device, which is used, for example, as a device for conveying and positioning a printed circuit board to a working position in a wire bonding process.
〈従来の技術〉
第２図はワイヤボンディング工程において使用されるこ
の種の定ピッチ搬送装置の構造を示している。図中、１
はグイチップ、２はプリント基板、３は基板搬送レール
、４はヒートブロック、５はヒーター、６は基板ホルダ
ー、７は位置決めビンである。<Prior Art> FIG. 2 shows the structure of this type of constant pitch conveying device used in the wire bonding process. In the figure, 1
1 is a guide chip, 2 is a printed circuit board, 3 is a board transport rail, 4 is a heat block, 5 is a heater, 6 is a board holder, and 7 is a positioning bin.
この定ピッチ搬送装置は、搬入ステージＡ、予備加熱ス
テージＢ、ワイヤボンドステージＣ１排出ステージＤの
４つのステージからなる。各ステージに処理対象である
プリント基板２が置かれ、各ステージで処理が完了する
ごとに、送りレバー８が矢印方向へステージ間ピッチに
相当する距離だけ各プリント基板２を押すことにより、
各プリント基板２は基板搬送レール３に沿って次のステ
ージへ搬送される。送りレバー８は図示しない駆動源に
より駆動される。This fixed-pitch conveyance device consists of four stages: a carry-in stage A, a preheating stage B, a wire bonding stage C, and a discharge stage D. A printed circuit board 2 to be processed is placed on each stage, and each time the processing is completed on each stage, the feed lever 8 pushes each printed circuit board 2 in the direction of the arrow by a distance corresponding to the pitch between stages.
Each printed circuit board 2 is transported to the next stage along a board transport rail 3. The feed lever 8 is driven by a drive source (not shown).
ヒートブロック４は、ヒーター５が埋め込まれており、
図示しない駆動源により上昇駆動され、予備加熱ステー
ジＢとワイヤボンドステージＣにあるプリント基板２と
接触してこれらのプリント基板２を加熱する。基板ホル
ダー６は、図示しない駆動源により下降駆動され、予備
加熱ステージＢとワイヤボンドステージＣにあるプリン
ト基板２をヒートブロック４上へ押し付ける。位置決め
ピン７は、図示しない駆動源により上昇駆動され、ワイ
ヤボンドステージＣに搬送されたプリント基板２の位置
決め穴２ａを貫通することにより、ワイヤボンディング
のためにプリント基板２を位置決めする。The heat block 4 has a heater 5 embedded therein.
It is driven upward by a drive source (not shown) and comes into contact with the printed circuit boards 2 on the preheating stage B and the wire bonding stage C to heat these printed circuit boards 2. The substrate holder 6 is driven downward by a drive source (not shown), and presses the printed circuit board 2 on the preheating stage B and the wire bonding stage C onto the heat block 4 . The positioning pin 7 is driven upward by a drive source (not shown) and passes through the positioning hole 2a of the printed circuit board 2 transferred to the wire bonding stage C, thereby positioning the printed circuit board 2 for wire bonding.
第３図は従来の定ピッチ搬送装置の動作を段階的に示し
ており、以下、この図にしたがって各段階順に説明する
。FIG. 3 shows the operation of the conventional constant pitch conveying device step by step, and each step will be explained in order according to this drawing.
（ａｌ ヒートブロック４と位置決めピン７とが下降
し、基板ホルダー６が上昇し、各従動端が原位置にくる
。その後、搬入ステージＡにグイチップ１がボンディン
グされている基板２が投入されると、ｆｂｌ 送りレ
バー８が上界し、
ｆｃｌ 送りレバー８が上昇し終わると、送りレバー
８は図中右方向の搬送方向へ移動し、各基板２を押すこ
とにより次のステージへ搬送する。(al) The heat block 4 and the positioning pins 7 descend, the substrate holder 6 rises, and each driven end comes to its original position. After that, the substrate 2 to which the Gui chip 1 is bonded is loaded onto the loading stage A. , fbl When the feed lever 8 is raised and the fcl feed lever 8 has finished rising, the feed lever 8 moves in the right direction in the figure in the conveyance direction and pushes each substrate 2 to convey it to the next stage.
（ｄ＋ 一定ピンチの搬送により、各基板２が次のス
テージに到達すると、ヒートブロック４と位置決めピン
７が上昇し、基板ホルダー６と送りレバー８は下降し、
基板ホルダー６により予備加熱ステージＢにある基板２
を固定し、ワイヤボンドステージＣにある基板２を位置
決め及び固定する。その後、予備加熱ステージＢ及びワ
イヤボンドステージＣにある基板２を加熱する。(d+ When each substrate 2 reaches the next stage by constant pinch conveyance, the heat block 4 and positioning pin 7 rise, the substrate holder 6 and the feed lever 8 descend,
The substrate 2 on the preheating stage B by the substrate holder 6
is fixed, and the substrate 2 on the wire bonding stage C is positioned and fixed. Thereafter, the substrate 2 on the preheating stage B and the wire bonding stage C is heated.
（ｅｌ ワイヤボンドステージＣ上の基板２に対する
ワイヤボンディング処理を行う。このワイヤボンディン
グが行われている間に、送りレバー８を後退させ、搬入
ステージ八へ未処理の基板２を投入し、排出ステージＤ
からワイヤボンディングが完了した基板２を排出する。(el Wire bonding processing is performed on the substrate 2 on the wire bonding stage C. While this wire bonding is being performed, the feed lever 8 is moved backward, the unprocessed substrate 2 is loaded into the carry-in stage 8, and the unprocessed substrate 2 is placed on the ejection stage D
The board 2 on which wire bonding has been completed is discharged.
以上で工程サイクルを終了する。This completes the process cycle.
〈発明が解決しようとする課題〉
上記の従来の装置においては、送りレバー８がプリント
基板２を押すときと戻るときとで移動経路の高さが異な
るため、送りレバー８を上下動させる機構が必要である
。さらに、予備加熱ステージＢとワイヤボンドステージ
Ｃにおいてプリント基板２をヒートブロック４に押し付
けるために、基板ホルダー６を上下動させる機構が必要
である。<Problems to be Solved by the Invention> In the conventional device described above, the height of the moving path is different when the feed lever 8 pushes the printed circuit board 2 and when it returns, so the mechanism for moving the feed lever 8 up and down is difficult. is necessary. Furthermore, in order to press the printed circuit board 2 against the heat block 4 in the preheating stage B and the wire bonding stage C, a mechanism for vertically moving the board holder 6 is required.
従来では、プリント基板２の搬送及びワイヤボンディン
グのための機構に加えて、上記のような２種類の上下動
機構が必要であるため、装置が複雑化かつ大型化し、さ
らに高価になるという問題があった。また、保守が煩雑
であるという問題があった。Conventionally, in addition to the mechanism for transporting the printed circuit board 2 and the wire bonding, two types of vertical movement mechanisms as described above are required, which makes the device complicated, large, and expensive. there were. Another problem was that maintenance was complicated.
本発明は、上記事情に鑑みてなされたものであり、その
目的は、送りレバーと基板ホルダーの上下動機構を不要
とした定ピッチ搬送装置を提供することである。The present invention has been made in view of the above circumstances, and an object thereof is to provide a constant pitch conveyance device that does not require a vertical movement mechanism for a feed lever and a substrate holder.
〈課題を解決するための手段〉
上記目的を達成するために、本発明による定ピッチ搬送
装置においては、一連の処理ステージの各ステージに置
かれた処理対象物を次ステージの方向へ押すための複数
のレバーをステージ間ピッチに対応した間晒で備えた往
復動自在である送りレバーと、所定の処理ステージで処
理対象物を搬送面より高い作業面へ持ち上げて支持する
支持部材とを備えたことを特徴としている。<Means for Solving the Problems> In order to achieve the above object, the constant pitch conveying device according to the present invention has a mechanism for pushing the processing object placed on each stage of a series of processing stages in the direction of the next stage. Equipped with a reciprocating feed lever that has a plurality of levers spaced apart corresponding to the pitch between stages, and a support member that lifts and supports the object to be processed at a predetermined processing stage to a work surface higher than the transport surface. It is characterized by
〈作用〉
本発明による定ピッチ搬送装置は、送りレバーの往動に
より処理対象物を処理ステージへ搬送した後、支持部材
により処理対象物を搬送面より高い作業面へ持ち上げる
とともに、固定部材へ処理対象物を押し付ける。この状
態で処理を行い、この処理の間に送りレバーは往動と同
じ経路を復動して元の位置へ戻る。したがって、送りレ
バーの上下動と固定部材の上下動は不要である。<Function> The constant pitch conveyance device according to the present invention conveys the object to be processed to the processing stage by forward movement of the feed lever, and then lifts the object to be processed to a work surface higher than the conveyance surface using the support member, and transfers the object to the fixed member for processing. Press the object. Processing is performed in this state, and during this processing, the feed lever moves back along the same path as the forward movement and returns to its original position. Therefore, vertical movement of the feed lever and vertical movement of the fixing member are unnecessary.
〈実施例〉
この実施例における定ピッチ搬送装置の従動端の構成は
第２図に示す従来の構成とほぼ同様である。<Example> The configuration of the driven end of the constant pitch conveying device in this example is almost the same as the conventional configuration shown in FIG.
送りレバー８は、搬入ステージＡ、予備加熱ステージＢ
、ワイヤボンドステージＣ１排出ステージＤの４つのス
テージの間のピッチに対応した間隔で並んだ３本のレバ
ーから構成され、４つの各ステージへ向かって処理対象
物であるプリント基板２を基板搬送レール３に沿って押
す。ヒートブロック４は、ヒーター５が埋め込まれてお
り、予熱ステージＢとワイヤボンドステージＣにあるブ
ノント基板２を加熱する。基板ホルダー６は、予熱ステ
ージＢとワイヤボンドステージＣにあるプリント基板２
を固定する。位置決めビン７は、ワイヤボンドステージ
Ｃにおいてプリント基板２を位置決めする。The feed lever 8 is used for loading stage A and preheating stage B.
, consists of three levers lined up at intervals corresponding to the pitch between the four stages of the wire bond stage C1 and the discharge stage D, and the printed circuit board 2, which is the object to be processed, is moved toward each of the four stages by the board transport rail. Press along 3. The heat block 4 has a heater 5 embedded therein and heats the Bunont substrate 2 on the preheating stage B and the wire bonding stage C. The board holder 6 holds the printed circuit board 2 in the preheating stage B and the wire bonding stage C.
to be fixed. The positioning bin 7 positions the printed circuit board 2 on the wire bonding stage C.
従来と異なるのは、ヒートブロック４がプリント基板２
を搬送面すなわち基板搬送レール３上のプリント基板２
の位置より高い作業面まで持ち上げる点と、この作業面
上に基板ホルダー６が予め固定されている点である。The difference from the conventional one is that the heat block 4 is attached to the printed circuit board 2.
The printed circuit board 2 on the transport surface, that is, the board transport rail 3
The two points are that the substrate holder 6 is lifted up to a work surface higher than the position of , and that the substrate holder 6 is fixed in advance on this work surface.
第１図はこの実施例の定ピンチ搬送装置の動作を段階的
に示しており、以下この図にしたがって各段階順に説明
する。FIG. 1 shows the operation of the constant pinch conveying device of this embodiment step by step, and each step will be explained in order according to this drawing.
（ａ） ヒートブロック４と位置決めビン７が下降し
、各従動端が原位置にくる。その後、グイチップ１がボ
ンディングされているプリント基板２が搬入ステージＡ
に投入される。(a) The heat block 4 and the positioning bin 7 are lowered, and each driven end comes to its original position. After that, the printed circuit board 2 to which the Gui chip 1 is bonded is transferred to stage A.
will be put into the
（ｂｌ 送りレバー８が図示しない駆動源により矢印
で示す搬送方向へ駆動され、各ステージにあるプリント
基板２を送りレバー８により押し、搬送レール３上をそ
れぞれ次のステージへ搬送する。(bl) The feed lever 8 is driven by a drive source (not shown) in the transport direction indicated by the arrow, and the print board 2 on each stage is pushed by the feed lever 8 and transported on the transport rail 3 to the next stage.
（Ｃ１定ピッチ搬送が終了すると、ヒートブロック４と
位置決めビン７が図示しない駆動源の駆動により上昇す
る。ヒートブロック４は、予熱ステージＢとワイヤボン
ドステージＣにある２枚のプリント基板２を搬送面ｈ１
より高い位置にある作業面ｈ２まで押し上げる。位置決
めビン７は、ワイヤボンドステージＣ上のプリント基板
２の位置決め穴２ａを貫通する。この位置決めビン７の
貫通によって、プリント基板２はワイヤボンドステージ
Ｃ上の所定位置へ位置決めされる。(When C1 constant pitch conveyance is completed, the heat block 4 and the positioning bin 7 are raised by the drive of a drive source (not shown). The heat block 4 conveys the two printed circuit boards 2 on the preheating stage B and the wire bonding stage C. Surface h1
Push up to the higher work surface h2. The positioning pin 7 passes through the positioning hole 2a of the printed circuit board 2 on the wire bonding stage C. The printed circuit board 2 is positioned at a predetermined position on the wire bonding stage C by the penetration of the positioning pin 7.
ヒートブロック４がプリント基板２を作業面ｈ２まで押
し上げた状態で、２枚のプリント基板２は基板ホルダー
６に当接し、この基板ホルダー６に押し付けられる。し
たがって、２枚のプリント基板２は、作業面ｈ２上で固
定される。２枚のプリント基板２の固定が完了すると、
ヒートブロック４により２枚のプリント基板２を加熱す
る。With the heat block 4 pushing up the printed circuit boards 2 to the work surface h2, the two printed circuit boards 2 come into contact with the board holder 6 and are pressed against the board holder 6. Therefore, the two printed circuit boards 2 are fixed on the work surface h2. When the fixing of the two printed circuit boards 2 is completed,
Two printed circuit boards 2 are heated by a heat block 4.
（ｄ） ワイヤボンドステージＣにあるプリント基板
２のグイチップ１に対してワイヤボンディングを行う。(d) Wire bonding is performed to the Gui chip 1 of the printed circuit board 2 on the wire bonding stage C.
このワイヤボンディング処理の間に、送りレバー８が後
退する。この場合、プリント基板２が搬送面ｈ１より高
い位置にあるので、送りレバー８はプリント基板２によ
って邪魔されることなく搬送面ｂｌ上をそのまま後退す
る。During this wire bonding process, the feed lever 8 is retracted. In this case, since the printed circuit board 2 is located at a higher position than the conveyance surface h1, the feed lever 8 moves back on the conveyance surface bl without being obstructed by the printed circuit board 2.
（ｅｌ 送りレバー８の後退の後、搬入ステージＡへ
未処理のプリント基板２を投入し、排出ステージＤから
処理済のプリント基板２を排出する。(el) After the feed lever 8 is moved back, the unprocessed printed circuit board 2 is loaded into the carry-in stage A, and the processed printed circuit board 2 is discharged from the discharge stage D.
以上で工程サイクルを終了する。This completes the process cycle.
〈発明の効果〉
以上説明したように本発明においては、送りレバーによ
り処理対象物を搬送後、処理対象物を搬送面より高い作
業面へ持ち上げ、処理の間に送りレバーを戻すようにし
たので、送りレバーの上下動機構が不要となる。また、
処理対象物を作業面へ持ち上げた状態で固定部材へ押し
付けることにより処理対象物を固定するようにしたので
、固定部材の上下動機構が不要となる。したがって、定
ピッチ搬送装置を簡単化し、さらに、コストダウン及び
保守の簡略化が実現できる。<Effects of the Invention> As explained above, in the present invention, after the object to be processed is transported by the feed lever, the object to be processed is lifted to a work surface higher than the transport surface, and the feed lever is returned during processing. , there is no need for a vertical movement mechanism for the feed lever. Also,
Since the object to be processed is fixed by lifting it onto the work surface and pressing it against the fixing member, there is no need for a mechanism for moving the fixing member up and down. Therefore, the constant pitch conveying device can be simplified, and furthermore, cost reduction and maintenance can be simplified.
第１図は本発明実施例の動作を段階的に説明する図、
第２図は定ビ・７チ搬送装置の構造を示す図、第３図は
従来例の動作を段階的に説明する図である。
グイチップ
プリント基板
基板搬送レール
ヒートブロック
ヒーター
基板ホルダー
位置決めビン
・送りレバーFig. 1 is a diagram explaining step by step the operation of the embodiment of the present invention, Fig. 2 is a diagram showing the structure of a fixed-beam/7-chi transfer device, and Fig. 3 is a diagram explaining step-by-step the operation of the conventional example. It is. Guichip printed circuit board board transfer rail heat block heater board holder positioning bin/feeding lever
Claims (1)
を置き、各ステージにおいて処理が完了するごとに処理
対象物を一定ピッチで次ステージへ同時に搬送する定ピ
ッチ搬送装置において、各ステージに置かれた処理対象
物を次ステージの方向へ押すための複数のレバーを上記
ピッチに対応した間隔で備えた往復動自在である送りレ
バーと、所定の処理ステージにおいて処理対象物を搬送
面より高い作業面へ持ち上げて支持する支持部材とを備
え、送りレバーの往動により処理対象物を所定の処理ス
テージへ搬送し、支持部材により処理対象物を作業面へ
持ち上げた状態で送りレバーを復動することを特徴とす
る定ピッチ搬送装置。In a fixed-pitch conveyance device that places objects to be processed at each stage in a series of processing stages, and simultaneously transports the objects to the next stage at a constant pitch each time the processing is completed at each stage, the objects to be processed placed at each stage are A reciprocating feed lever is equipped with a plurality of levers at intervals corresponding to the above-mentioned pitch to push the object toward the next stage, and a reciprocating feed lever that lifts the object to be processed to a work surface higher than the conveyance surface at a predetermined processing stage. A support member is provided, and the object to be processed is transported to a predetermined processing stage by the forward movement of the feed lever, and the feed lever is moved back with the object to be processed being lifted onto the work surface by the support member. Constant pitch conveyor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63318214A JPH02163947A (en) | 1988-12-16 | 1988-12-16 | Definite-pitch conveyance apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63318214A JPH02163947A (en) | 1988-12-16 | 1988-12-16 | Definite-pitch conveyance apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02163947A true JPH02163947A (en) | 1990-06-25 |
Family
ID=18096707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63318214A Pending JPH02163947A (en) | 1988-12-16 | 1988-12-16 | Definite-pitch conveyance apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02163947A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06121952A (en) * | 1992-10-12 | 1994-05-06 | Seikosha Co Ltd | Dispenser device |
-
1988
- 1988-12-16 JP JP63318214A patent/JPH02163947A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06121952A (en) * | 1992-10-12 | 1994-05-06 | Seikosha Co Ltd | Dispenser device |
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