JPH0546985B2 - - Google Patents
Info
- Publication number
- JPH0546985B2 JPH0546985B2 JP14174286A JP14174286A JPH0546985B2 JP H0546985 B2 JPH0546985 B2 JP H0546985B2 JP 14174286 A JP14174286 A JP 14174286A JP 14174286 A JP14174286 A JP 14174286A JP H0546985 B2 JPH0546985 B2 JP H0546985B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- section
- heating
- heater
- heater blocks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 3
- 239000008188 pellet Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体製造工程におけるリードフレー
ムへの導電性接着剤（銀ペースト）による半導体
素子（ペレツト）接着後にその銀ペーストを焼き
しめる半導体集積回路のベーク装置に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit in which a semiconductor element (pellet) is bonded to a lead frame using a conductive adhesive (silver paste) in a semiconductor manufacturing process, and then the silver paste is baked. The present invention relates to a baking device.
従来、リードフレームへ接着されたペレツトの
接着材料である銀ペーストの焼きしめを行う方法
としては、リードフレームより小さく、温度の異
なつた複数のヒータブロツク上をリードフレーム
が接触しない様に、リードフレームの長手方向へ
移動させながら銀ペーストの焼きしめを行なつて
いた。
Conventionally, the method of baking the silver paste, which is the adhesive material for the pellets bonded to the lead frame, is to prevent the lead frame from coming into contact with multiple heater blocks that are smaller than the lead frame and have different temperatures. The silver paste was baked while moving in the longitudinal direction.
〔発明が解決しようとする問題点〕
上述した従来のリードフレームのベーク装置
は、リードフレームよりも小さなヒータブロツク
上を通過させてベークを行つているため、リード
フレーム全体が不均一な温度分布となり、その結
果リードフレームに熱膨張による不均一な変形を
生じ、冷却後原形へ戻らなかつたり、リードフレ
ーム上のペレツトに不均一な応力を生じさせると
いう問題があつた。[Problems to be Solved by the Invention] The conventional lead frame baking device described above performs baking by passing the lead frame over a heater block smaller than the lead frame, resulting in uneven temperature distribution over the entire lead frame. As a result, there were problems in that the lead frame was unevenly deformed due to thermal expansion and did not return to its original shape after cooling, and that uneven stress was generated on the pellets on the lead frame.
本発明の目的は、このような問題点を解決し、
リードフレームを均一に加熱することにより、リ
ードフレームの変形やペレツトへの応力をなくし
た半導体集積回路のベーク装置を提供することに
ある。 The purpose of the present invention is to solve these problems,
It is an object of the present invention to provide a baking device for semiconductor integrated circuits that eliminates deformation of the lead frame and stress on the pellet by uniformly heating the lead frame.
本発明の半導体集積回路のベーク装置の構成
は、半導体集積回路のリードフレームを移動して
供給するリードフレーム供給部と、この供給部か
ら入つたリードフレームをこのリードフレームよ
り大きな板面にそれぞれ載置して焼きしめを行う
と共にこれら板面をそれぞれ異つた加熱温度に設
定できる複数のヒータブロツクからなる加熱部
と、この加熱部上のリードフレームを前記各ヒー
タブロツクに接触させずにこれらヒータブロツク
上を順次移動させる搬送手段と、この搬送手段に
より移送され前記加熱部によりベーキング完了し
たリードフレームを収納する収納部とを備えるこ
とを特徴とする。
The semiconductor integrated circuit baking apparatus of the present invention has a structure including a lead frame supply section that moves and supplies lead frames for semiconductor integrated circuits, and a lead frame that is received from this supply section and is placed on a board larger than the lead frame. A heating section is made up of a plurality of heater blocks that can be placed and baked and set to different heating temperatures for each of the plate surfaces, and a lead frame on this heating section can be heated without contacting each of the heater blocks. The lead frame is characterized in that it includes a conveying means for sequentially moving the lead frame, and a storage section for storing the lead frame that has been conveyed by the conveying means and has been baked by the heating section.
〔実施例〕 次に本発明について図面を参照して説明する。〔Example〕 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の構成を模式的に示
した斜視図、第２図から第６図は本実施例の使用
時を工程順に示した斜視図である。図において、
１はリードフレーム２を送つて装置に入れる搬送
レール、３は搬送ワイヤー、４はヒーター６を実
装したヒータブロツク、５はリードフレーム２を
収納するトレーである。第１図において、リード
フレーム２は、搬送レール１によりベーク部へと
搬送され、第２図の搬送ワイヤー３の位置までリ
ードフレーム２を移動させる。この搬送ワイヤー
３によつてヒータブロツク４へとリードフレーム
２を移動させ、第３図、第４図と順次ヒータブロ
ツク４上でリードフレーム２のベークを行なう。
リードフレーム２が第５図のヒータブロツク４の
終りの位置へと到着した時、リードフレームは第
６図の様にトレー５へ収納される。 FIG. 1 is a perspective view schematically showing the structure of an embodiment of the present invention, and FIGS. 2 to 6 are perspective views showing the use of this embodiment in the order of steps. In the figure,
Reference numeral 1 designates a transport rail for transporting the lead frame 2 into the apparatus, 3 a transport wire, 4 a heater block on which a heater 6 is mounted, and 5 a tray for storing the lead frame 2. In FIG. 1, a lead frame 2 is conveyed to a baking section by a conveyance rail 1, and the lead frame 2 is moved to the position of a conveyance wire 3 in FIG. The lead frame 2 is moved to the heater block 4 by the conveyor wire 3, and baked on the heater block 4 in sequence as shown in FIGS. 3 and 4.
When the lead frame 2 reaches the end position of the heater block 4 shown in FIG. 5, the lead frame is stored in the tray 5 as shown in FIG.
これら各ヒータブロツク４はヒーター６によつ
てそれぞれ所定温度に温度設定が行われ、リード
フレーム２より大きいものとする。また、このベ
ーク部全体は窒素雰囲気中におかれ、リードフレ
ーム２の酸化を防止している。 Each of these heater blocks 4 is set to a predetermined temperature by a heater 6, and is larger than the lead frame 2. Further, the entire baking section is placed in a nitrogen atmosphere to prevent the lead frame 2 from being oxidized.
以上説明した様に、本発明は、ヒータブロツク
上でリードフレーム全体を一様に加熱することに
より、リードフレームの熱膨張により変形を防止
することができる。また、ペレツトが異常の応力
を受けるのを防止することができる。
As described above, the present invention can prevent deformation of the lead frame due to thermal expansion by uniformly heating the entire lead frame on the heater block. Furthermore, it is possible to prevent the pellets from being subjected to abnormal stress.
第１図から第６図は本発明の一実施例の使用時
を順次示した斜視図である。
１……リードフレーム搬送レール、２……リー
ドフレーム、３……リードフレーム搬送ワイヤ
ー、４……ヒータブロツク、５……収納トレー、
６……ヒーター。
1 to 6 are perspective views sequentially showing one embodiment of the present invention in use. 1... Lead frame transport rail, 2... Lead frame, 3... Lead frame transport wire, 4... Heater block, 5... Storage tray,
6...Heater.
Claims (1)
供給するリードフレーム供給部と、この供給部か
ら入つたリードフレームをこのリードフレームよ
り大きな板面にそれぞれ載置して焼きしめを行う
と共にこれら板面をそれぞれ異つた加熱温度に設
定できる複数のヒータブロツクからなる加熱部
と、この加熱部上のリードフレームを前記各ヒー
タブロツクに接触させずにこれらヒータブロツク
上を順次移動させる搬送手段と、この搬送手段に
より移送され前記加熱部によりベーキング完了し
たリードフレームを収納する収納部とを備えるこ
とを特徴とする半導体集積回路のベーク装置。1. A lead frame supply section that moves and supplies lead frames for semiconductor integrated circuits, and a lead frame supplied from this supply section that is placed on a board surface larger than the lead frame and heat-tightened, and these board surfaces are A heating section consisting of a plurality of heater blocks each of which can be set to a different heating temperature, a conveying means for sequentially moving the lead frame on the heating section over these heater blocks without contacting each of the heater blocks, and this conveying means. a storage section for storing a lead frame transferred by the heating section and baked by the heating section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14174286A JPS62296539A (en) | 1986-06-17 | 1986-06-17 | Apparatus for baking semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14174286A JPS62296539A (en) | 1986-06-17 | 1986-06-17 | Apparatus for baking semiconductor integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62296539A JPS62296539A (en) | 1987-12-23 |
| JPH0546985B2 true JPH0546985B2 (en) | 1993-07-15 |
Family
ID=15299145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14174286A Granted JPS62296539A (en) | 1986-06-17 | 1986-06-17 | Apparatus for baking semiconductor integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62296539A (en) |
-
1986
- 1986-06-17 JP JP14174286A patent/JPS62296539A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62296539A (en) | 1987-12-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
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|
| S111 | Request for change of ownership or part of ownership |
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| S531 | Written request for registration of change of domicile |
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| R350 | Written notification of registration of transfer |
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| EXPY | Cancellation because of completion of term |