JPH0810191Y2 - Wire bonding equipment - Google Patents
Wire bonding equipmentInfo
- Publication number
- JPH0810191Y2 JPH0810191Y2 JP1990077848U JP7784890U JPH0810191Y2 JP H0810191 Y2 JPH0810191 Y2 JP H0810191Y2 JP 1990077848 U JP1990077848 U JP 1990077848U JP 7784890 U JP7784890 U JP 7784890U JP H0810191 Y2 JPH0810191 Y2 JP H0810191Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- pressing member
- wire bonding
- bonding
- vertical movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、半導体装置を製造するためのワイヤボンデ
ィング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a wire bonding apparatus for manufacturing a semiconductor device.
従来、ワイヤボンディング装置として例えば第２図に
示すものが知られている。Conventionally, as a wire bonding apparatus, for example, one shown in FIG. 2 is known.
このワイヤボンディング装置は、リードフレーム１の
搬送を案内するガイドレール２に沿って設けられリード
フレーム１を把持して搬送するリードフレーム搬送装置
３と、上下動機構４により上下動可能とされリードフレ
ーム１を下方から加熱するヒータプレート５と、上下動
機構６により上下動可能とされリードフレーム１を上方
から前記ヒータプレート５上面に押え付けるワーク押え
７と、ボンディングヘッド８と、認識カメラ９によりリ
ードフレーム１の送り位置を検知，補正するリードフレ
ーム認識装置10と、前記リードフレーム搬送装置3,上下
動機構４および６の作動を制御する制御装置14とを備え
て構成され、リードフレーム供給マガジン11からボンデ
ィング点Ｐに搬送されたリードフレームを十分加熱した
後、認識カメラ９および認識装置10で検知・補正を行っ
てボンディングヘッド８によりワイヤボンディングを行
うようになっている。This wire bonding apparatus is provided along a guide rail 2 for guiding the conveyance of the lead frame 1, a lead frame conveying apparatus 3 for grasping and conveying the lead frame 1, and a lead frame moving mechanism 4 so that the lead frame can be moved up and down. A heater plate 5 that heats 1 from below, a work holder 7 that can be moved up and down by a vertical movement mechanism 6 and presses the lead frame 1 from above onto the upper surface of the heater plate 5, a bonding head 8, and a lead by a recognition camera 9. A lead frame recognition device 10 for detecting and correcting the feed position of the frame 1, and a control device 14 for controlling the operation of the lead frame transport device 3 and the vertical movement mechanisms 4 and 6 are provided. After sufficiently heating the lead frame conveyed from the bonding point P to the recognition camera 9 and So that the wire bonding by the bonding head 8 performs detection and correction by the recognition unit 10.
しかして、このワイヤボンディング装置では、リード
フレーム１を特別な場合を除き１ピッチずつ搬送すると
共に、リードフレーム１の搬送時にはこれを妨害なく搬
送可能なようにヒータプレート５の下降動作およびワー
ク押え７の上昇動作を同時に行い、ボンディング点Ｐの
１ピッチまたは２ピッチ手前でヒータプレート５により
予備加熱を行った後、ボンディング点Ｐにおいては、ヒ
ータプレート５の上昇動作およびワーク押え７の下降動
作を同時に行って、リードフレーム１をヒータプレート
５に固定して加熱（例えば鉄系あるいは銅系のリードフ
レームでは約200〜300℃に加熱する）した後、リードフ
レーム認識カメラ９および認識装置10によりリードフレ
ーム１の送り位置のずれ認識および、その補正を繰り返
した後、ボンディングヘッド８によりワイヤボンディン
グを開始していた。In this wire bonding apparatus, the lead frame 1 is conveyed by one pitch except for a special case, and when the lead frame 1 is conveyed, the lowering operation of the heater plate 5 and the work holder 7 are performed so that the lead frame 1 can be conveyed without obstruction. At the same time, the heater plate 5 is preheated by 1 pitch or 2 pitches before the bonding point P, and then at the bonding point P, the heater plate 5 is moved up and the work clamp 7 is moved down. After fixing the lead frame 1 to the heater plate 5 and heating (for example, heating to about 200 to 300 ° C. for an iron-based or copper-based lead frame), the lead frame is recognized by the lead frame recognition camera 9 and the recognition device 10. After repeating the recognition of the deviation of the feed position of 1 and the correction, the bonding It was the start of a wire bonding by the head 8.
そして、上記ボンディング点Ｐにおいてはヒータプレ
ート５の上昇動作およびワーク押え７の下降動作を同時
に行ってリードフレーム１を保持し、認識カメラ９を介
して認識装置10により送り位置を検知し、送りずれが発
生している場合には、ヒータプレート５の下降動作およ
びワーク押え７の上昇動作を同時に行って前記保持を解
除しリードフレーム搬送装置３で送りずれを補正してい
た。At the bonding point P, the heater plate 5 is moved up and the work clamp 7 is moved down at the same time to hold the lead frame 1, and the recognition position is detected by the recognition device 10 via the recognition camera 9 and the feed deviation occurs. In the case of occurrence of the above, the lowering operation of the heater plate 5 and the raising operation of the work pressing member 7 are simultaneously performed to release the holding, and the lead frame transport device 3 corrects the feed deviation.
このように、上記従来のワイヤボンディング装置は、
前記ヒータプレート５の上昇動作とワーク押え７の下降
動作、およびヒータプレート５の下降動作とワーク押え
７の上昇動作を同時に行うものであるため、以下のよう
な問題点があった。Thus, the conventional wire bonding apparatus described above,
Since the raising operation of the heater plate 5 and the lowering operation of the work retainer 7 and the lowering operation of the heater plate 5 and the raising operation of the work retainer 7 are performed at the same time, there are the following problems.
すなわち、一般にリードフレーム１はヒータプレート
５による加熱で熱膨張あるいは熱変形するため、十分な
加熱を行ってこの熱膨張あるいは熱変形を飽和させた状
態でボンディングを行う必要があるにも拘らず、リード
フレーム１の送り位置を補正するときに上記のように一
時的にヒータプレート５がリードフレーム１から離れる
ためリードフレーム１が放熱して萎縮し、該補正後ボン
ディング点Ｐにおいてヒータプレート５の上昇動作とワ
ーク押え７の下降動作を同時に行いリードフレーム１を
ヒータプレート５に固定した状態で加熱を行うため、リ
ードフレーム１が再度熱膨張したり、これに熱変形が発
生する。このように上記従来装置では、前記補正送り時
にリードフレーム１の伸縮が繰り返されるため、正確，
迅速な補正が困難であった。That is, since the lead frame 1 generally undergoes thermal expansion or thermal deformation due to heating by the heater plate 5, it is necessary to perform sufficient heating to perform bonding while the thermal expansion or thermal deformation is saturated. When the feed position of the lead frame 1 is corrected, since the heater plate 5 is temporarily separated from the lead frame 1 as described above, the lead frame 1 dissipates heat and shrinks, and the heater plate 5 rises at the corrected bonding point P. The lead frame 1 is heated while the lead frame 1 is fixed to the heater plate 5 by simultaneously performing the operation and the lowering operation of the work clamp 7, so that the lead frame 1 is again thermally expanded or thermally deformed. As described above, in the above-described conventional device, since the lead frame 1 is repeatedly expanded and contracted during the correction feed,
It was difficult to make a quick correction.
本考案は、リードフレーム加熱装置，リードフレーム
押え部材をそれぞれ独立に上下動可能とすることによ
り、上記問題点を解決したものである。The present invention solves the above-mentioned problems by allowing the lead frame heating device and the lead frame pressing member to move up and down independently.
本考案は、リードフレーム搬送装置と、上下動機構を
有するリードフレーム加熱装置と、上下動機構を有する
リードフレーム押え部材と、ボンディングヘッドと、リ
ードフレーム認識装置とを備えたワイヤボンディング装
置において、前記リードフレーム加熱装置と押え部材の
上下動機構をそれぞれ独立に作動可能とする制御装置を
設け、リードフレームの加熱時間経過後に押え部材を下
降させて認識装置により送りずれを検知し、押え部材を
上昇させて補正し、この検知・補正を繰り返し、その
後、押え部材を下降させてボンディングするようにした
ことを特徴とするワイヤボンディング装置である。The present invention provides a wire bonding apparatus including a lead frame carrying device, a lead frame heating device having a vertical movement mechanism, a lead frame pressing member having a vertical movement mechanism, a bonding head, and a lead frame recognition device. Provided with a control device that enables the lead frame heating device and the vertical movement mechanism of the pressing member to operate independently, lowers the pressing member after the lead frame heating time elapses, and detects misalignment with the recognition device and raises the pressing member. The wire bonding apparatus is characterized in that the correction is performed, the detection and correction are repeated, and then the pressing member is lowered to perform the bonding.
ボンディング点に搬送されたリードフレームについて
リードフレーム加熱装置により十分な加熱を行って、リ
ードフレームの熱膨張あるいは熱変形を飽和させたのち
ワーク押え部材を下降させて認識装置によりリードフレ
ームの送りずれを検知し、押え部材を上昇させて該送り
ずれを補正し、この検知・補正を繰り返し、その後、押
え部材を下降させてボンディングするようにしたから、
該検知・補正がリードフレームを加熱しつつ行われるこ
ととなってリードフレームの放熱や、放熱後の再加熱が
なく、また、リードフレーム加熱装置によるリードフレ
ームの加熱が十分となり、その熱膨張あるいは熱変形が
飽和した状態の下で前記検知・補正を行うことができ、
ボンディング精度が向上するうえ、ワイヤボンディング
に要する時間が短縮されて半導体装置の生産能力が向上
できるものである。The lead frame conveyed to the bonding point is sufficiently heated by the lead frame heating device to saturate the thermal expansion or thermal deformation of the lead frame, then the work holding member is lowered and the lead frame is misaligned by the recognition device. It is detected, the presser member is raised to correct the feed deviation, this detection and correction is repeated, and then the presser member is lowered to perform bonding.
Since the detection / correction is performed while heating the lead frame, there is no heat dissipation of the lead frame or reheating after the heat dissipation, and the lead frame heating device sufficiently heats the lead frame to cause thermal expansion or The detection and correction can be performed under the condition that the thermal deformation is saturated,
In addition to improving the bonding accuracy, the time required for wire bonding can be shortened and the production capacity of semiconductor devices can be improved.
さらに、ボンディング点Ｐに送り込まれるリードフレ
ームに対し、リードフレーム加熱装置を離すことなく、
その搬送を行うことができ、効率のよい加熱が可能であ
る。Further, without separating the lead frame heating device from the lead frame fed to the bonding point P,
The transfer can be performed, and efficient heating is possible.
本考案の実施例を第１図に基づいて説明すると、ワイ
ヤボンディング装置の全体構造は上記従来装置と同様で
あるが、ヒータプレート５の上下動機構４の作動を制御
する制御装置12と、ワーク押え７の上下動機構６の作動
を制御する制御装置13を設け、これら制御装置12,13に
より上下動機構4,6を独立に作動可能に構成したもので
ある。An embodiment of the present invention will be described with reference to FIG. 1. The overall structure of the wire bonding apparatus is the same as that of the conventional apparatus described above, but a control device 12 for controlling the operation of the vertical movement mechanism 4 of the heater plate 5 and a work. A control device 13 for controlling the operation of the vertical movement mechanism 6 of the presser foot 7 is provided, and the vertical movement mechanisms 4 and 6 can be independently operated by these control devices 12 and 13.
しかして、リードフレーム１をリードフレーム搬送装
置３によりガイドレール２に沿って間欠的に１ピッチず
つ搬送し、ボンディング点Ｐの１ピッチ手前でヒータプ
レート５をリードフレーム１に当接させてこれを予備加
熱し、ヒータプレート５はそのままの状態で更に１ピッ
チ搬送してリードフレーム１がボンディング点Ｐに到着
すると、ワーク押え７はリードフレーム１から離れた状
態にあり、ヒータプレート５のみをリードフレーム１に
当接させ、該当接状態の下で認識装置10でリードフレー
ム１の送り位置の検知および補正を行い、次いでワーク
押え７によってリードフレーム１を固定してからボンデ
ィングヘッド８でワイヤボンディングを開始するもので
ある。Then, the lead frame 1 is intermittently conveyed by the lead frame conveying device 3 along the guide rail 2 one pitch at a time, and the heater plate 5 is brought into contact with the lead frame 1 one pitch before the bonding point P to move it. When the lead frame 1 arrives at the bonding point P after carrying out preheating and further carrying one pitch with the heater plate 5 as it is, the work retainer 7 is separated from the lead frame 1 and only the heater plate 5 is used as the lead frame. 1 and the recognition device 10 detects and corrects the feed position of the lead frame 1 under the corresponding contact state, then fixes the lead frame 1 with the work clamp 7 and then starts wire bonding with the bonding head 8. To do.
本考案では、リードフレーム加熱装置と押え部材の上
下動機構をそれぞれ独立に作動可能とする制御装置を設
け、リードフレームの加熱時間経過後に押え部材を下降
させて認識装置により送りずれを検知し、押え部材を上
昇させて補正し、この検知・補正を繰り返し、その後、
押え部材を下降させてボンディングするようにしたか
ら、ボンディング点における認識装置によるリードフレ
ームの送り位置の検知および補正がリードフレーム加熱
装置でリードフレームを加熱しながら行うこととなり、
しがって、リードフレームは効率良く加熱されつつボン
ディング点に搬送され、また、銅系のリードフレーム等
のように熱膨張係数の大きいリードフレームや加熱時お
よび放熱時に変形を起こし易い厚さの薄いリードフレー
ムであっても放熱後ボンディング点での再加熱に起因す
るリードフレームの変形は発生せず、上記送り位置の検
知・補正を精確かつ迅速に行うことができると共に、ボ
ンディング精度が向上し、またワイヤボンディングに要
する時間が短縮されて半導体装置の生産能力が向上する
効果がある。In the present invention, a control device is provided which enables the lead frame heating device and the vertical movement mechanism of the pressing member to operate independently, and the pressing member is lowered after the lead frame heating time has elapsed, and the feed deviation is detected by the recognition device, The presser member is lifted and corrected, and this detection / correction is repeated, and then
Since the pressing member is lowered to perform bonding, the lead frame feeding device detects and corrects the lead frame feed position by the recognition device at the bonding point while heating the lead frame.
Therefore, the lead frame is efficiently heated and conveyed to the bonding point, and the lead frame having a large coefficient of thermal expansion such as a copper lead frame and the thickness which is likely to be deformed at the time of heating and heat radiation are used. Even with a thin lead frame, deformation of the lead frame due to reheating at the bonding point does not occur after heat dissipation, and the feed position can be detected and corrected accurately and quickly, and the bonding accuracy is improved. Further, there is an effect that the time required for wire bonding is shortened and the production capacity of the semiconductor device is improved.
第１図は本考案の実施例の斜視図、第２図は従来例の斜
視図である。 １……リードフレーム、２……ガイドレール、３……リ
ードフレーム搬送装置、4,6……上下動機構、５……ヒ
ータプレート、７……ワーク押え、８……ボンディング
ヘッド、９……認識カメラ、10……認識装置、11……リ
ードフレーム供給マガジン、12,13,14……制御装置。FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional example. 1 ... Lead frame, 2 ... Guide rail, 3 ... Lead frame transfer device, 4,6 ... Vertical movement mechanism, 5 ... Heater plate, 7 ... Work clamp, 8 ... Bonding head, 9 ... Recognition camera, 10 ... recognition device, 11 ... lead frame supply magazine, 12, 13, 14 ... control device.
Claims (1)
有するリードフレーム加熱装置と、上下動機構を有する
リードフレーム押え部材と、ボンディングヘッドと、リ
ードフレーム認識装置とを備えたワイヤボンディング装
置において、前記リードフレーム加熱装置と押え部材の
上下動機構をそれぞれ独立に作動可能とする制御装置を
設け、リードフレームの加熱時間経過後に押え部材を下
降させて認識装置により送りずれを検知し、押え部材を
上昇させて補正し、この検知・補正を繰り返し、その
後、押え部材を下降させてボンディングするようにした
ことを特徴とするワイヤボンディング装置。1. A wire bonding apparatus comprising a lead frame conveying device, a lead frame heating device having a vertical movement mechanism, a lead frame pressing member having a vertical movement mechanism, a bonding head, and a lead frame recognition device. A control device is provided which enables the lead frame heating device and the vertical movement mechanism of the pressing member to operate independently, and the pressing member is lowered after the lead frame heating time elapses, and the recognizing device detects the feed deviation and detects the pressing member. The wire bonding apparatus is characterized in that the wire is raised and corrected, the detection / correction is repeated, and then the pressing member is lowered to perform bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990077848U JPH0810191Y2 (en) | 1990-07-24 | 1990-07-24 | Wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990077848U JPH0810191Y2 (en) | 1990-07-24 | 1990-07-24 | Wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459142U JPH0459142U (en) | 1992-05-21 |
| JPH0810191Y2 true JPH0810191Y2 (en) | 1996-03-27 |
Family
ID=31809537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990077848U Expired - Fee Related JPH0810191Y2 (en) | 1990-07-24 | 1990-07-24 | Wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810191Y2 (en) |
-
1990
- 1990-07-24 JP JP1990077848U patent/JPH0810191Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0459142U (en) | 1992-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |