JPH0638424Y2 - Frame guide device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to a bonding apparatus, and more particularly, after aligning the center of an island of a frame such as a lead frame with the center of a bonding stage, the frame can be easily mounted on the loader and unloader sides. The present invention relates to a frame guide device capable of aligning the centers of islands.

BACKGROUND ART Conventionally, in a device of this type, a lead frame for wire bonding, in which a plurality of IC chips (semiconductors) are arranged in the longitudinal direction, is intermittently fed one pitch at a time by a transfer means that moves in the longitudinal direction. The sent lead frame is transferred onto the bonding stage heated by the heat block, and then the IC chips arranged on the lead frame are connected to the surrounding leads by wires. A conventional guide device for preventing meandering of the lead frame transferred by the transfer means is composed of a first guide rail provided on one end side of the lead frame and a second guide rail provided on the other end side. Has been done. Since the first and second guide rails are detachably fixed to the base of the bonding apparatus with bolts or the like, the spacing between the guide rails can be adjusted by loosening the bolts. Since the length differs depending on the type of semiconductor to be provided, it is necessary to loosen the bolts fixing the guide rails and adjust the interval between the guide rails each time a lead frame having a different width is transferred. However, this gap adjustment is troublesome because it is necessary to keep the gap between the guide rails and the lead frame constant, and a lot of time is spent on the gap adjustment.

Therefore, in order to solve the above-mentioned problem, the applicant has been in fact
The device disclosed in Japanese Patent No. 56233 is proposed.

In this apparatus, as shown in FIG. 4, width direction moving means 55, which is movable in the width direction, is provided on each of the first guide rail 50 and the second guide rail 51, and the first and second guide rails 50 are provided. A width detection sensor that detects the width of the lead frame 52 is provided on the terminals 51 and 51. The width direction moving means 55 is a U-shaped frame base fixed to the base of the bonding apparatus.
56, a control motor 57 such as a pulse motor fixed to the base of the frame base 56, and a screw rod 58 connected to the output shaft of the control motor 57.

In the device configured as described above, first, a command is issued from the computer to the control motor 57, and based on this command, the amount of rotation of the control motor 57 is converted into the amount of advance / retreat of a slider (not shown) screwed with the screw rod 58. Then, the slider slides along the guide surface in the direction of increasing the width to the maximum position, moves the first and second guide rails 50 and 51, and stops. Next, since the center of the IC chip (island 52a) formed on the lead frame 52 needs to be aligned with the bonding origin on the XY table, it is provided on the heater plate 62 shown in FIG. 5 (a). After aligning the centers of the IC chips (islands) with a plurality of protrusions (not shown) indicating the center of the lead frame, the lead frame retainer 63 is pressed from above and the lead frame retainer 63 is aligned by the opening 63a. This allows the leadframe 52 island
Since the center of 52a is aligned with the center of the bonding stage 59, after the changed lead frame 52 is set, the control motor is rotated in the opposite direction by the computer command, and the first and second guide rails are rotated. 50 and 51 move in a direction in which the width becomes narrower and the first and second guide rails are moved.
An optimum amount of space is secured between the regulation surface of 50, 51 and the end surface of the lead frame 52.

However, even if the first and second guide rails 50 and 51 are moved to automatically adjust the distance after the center of the island 52a of the lead frame 52 is aligned with the center position of the bonding stage 59, the first frame is actually adjusted to the first position. As shown in FIG. 8, since the widths of the frame ends where the leads 60 of the lead frame 52 are held are not the same, the center of the IC chip (island) 61 arranged at the center of the frame is deviated by ΔA. Only the component of the deviation amount of ΔA is the first and second guide rails.
50 and 51 are also positioned with a distance from the center of the bonding stage 59.

However, in the bonding apparatus, it is actually shown in FIG.
First, on the side of the loader 64 as shown in FIG. 7, the center of the island of the lead frames 52 placed in the magazine 66 is made to coincide with the center of the bonding stage 59. That is, the first and second guide rails 50 and 51 and the magazine 66.
Of the lead frame 52 so that the lead frame 52 can be smoothly supplied to the bonding stage 59 side. This adjustment is performed by an elevating mechanism 67 vertically supported by an elevating mechanism base 68 fixed to the main body of the bonding apparatus shown in FIG. This lifting mechanism 67
Is a control motor 69, an elevating shaft 70 connected to the shaft of the motor 69, a nut 71 screwed with the elevating shaft 70, a magazine receiver 72 that is coupled and held with the nut 71, and moves integrally. And a chuck 73 having a spring property for pressing a magazine 66 placed on the magazine receiver 72.

The magazine 66 can accommodate a plurality of lead frames 52. However, as shown in FIG. 5B, when the lead frame 52 has different widths and lengths, the size of the magazine 66 also changes. A large distance is set in advance between the chuck 73 and the restricting surface 71a that restricts the magazine 66. Therefore, in order to fix the magazine 66 without rattling, a spacer 74 is inserted and fixed between the restriction surface 71a and the end surface of the magazine 66. Plural spacers 74 are prepared according to the size of the magazine.

The above is described on the side of the loader 64, but the same method as this is performed on the side of the unloader 65.

[Problems to be Solved by the Invention] However, in the conventional frame guide device, since the spacer 74 is changed every time the type of the lead frame 52 is changed and the alignment operation is performed with the center of the bonding stage 59, this alignment work is troublesome. There is a drawback in that accurate adjustment cannot be performed.

Further, as shown in FIG. 7, the conventional device has a drawback that various errors occur during product type exchange. Looking at the components of this error, ΔA: Deviation between the bonding stage (center of the heater plate) and the center of the island (IC chip) ΔB: Error in mounting the lifting mechanism ΔC: Machining spacer error ΔD: Lead frame deviation in the magazine ΔE : Lead frame magazine gap ΔF: Magazine accuracy Δθ: Lifting mechanism installation error.

As described above, the deviation amount ΔA can be adjusted by adjusting the first and second guide rails 50 and 51, but the conventional guide device cannot adjust the deviation amounts ΔB to Δθ. is there. These errors cannot be ignored especially when the lead frame has a narrow width and a long length. This is because the error of the magazine spacer has a great influence on the narrow width, and the shift of the lead frame in the magazine and the lead frame magazine gap have a great influence on the long length. In addition, in the conventional apparatus, the spacer 74 must be changed every time the frame width changes, so that there is a drawback in that a plurality of spacers 74 must be prepared.
The plurality of spacers 74 have a drawback in that it is necessary to improve processing accuracy in order to eliminate the above-mentioned error, and the cost required for them is also high. In addition, there is a drawback that it takes a lot of time to install the spacer 74 when exchanging it.

In addition, in the conventional device, as shown in FIG.
Since the load P uses the spacer 74, the component of the distance 1 with respect to the elevating shaft 70 has a greater effect as the width of the spacer 74 increases, so that the balance is deteriorated and vibration is not preferable.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and a frame guide device that can always and easily align the center of the island of the frame with the center position of the bonding stage without using a spacer even when replacing the frame type. The purpose is to provide.

[Means for Solving the Problems] A frame guide device of the present invention is a magazine that can store a plurality of frames, and a magazine that regulates the magazine and can move in a direction that supplies or stores the frames that are stored in the magazine. And a base provided with the elevating and lowering means, and a base provided with the elevating and lowering means. Is configured so that the frame stored in the magazine can be moved in a direction intersecting with the supply or storage direction.

[Embodiment] Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic view showing the structure of a frame guide device according to the present invention. It should be noted that detailed description of those having the same functions and configurations as those of the conventional configuration will be omitted.

In FIG. 1, a bonding head 1 includes a camera head, a camera having a lens and an illuminating lamp, and is mounted on an XY table drive mechanism that is movable in the X and Y directions. An image of an IC chip (island) that is a component to be bonded on the bonding stage 4 is picked up by the bonding head 1. The lead frame on which the IC chip imaged by the bonding head 1 is arranged is positioned by the first guide rail 2 and the second guide rail 3 at the optimum spacing position. In this embodiment, the distance between the first and second guide rails 2 and 3 and both ends of the lead frame is set to about 0.1 mm. The first and second guide rails 2 and 3 are configured to be movable in the directions of arrows A and A ', respectively. The first and second guide rails are L-shaped in cross section and are separately driven by a control motor (not shown) such as a pulse motor. If the control of the control motor is driven by synchronizing the guide rails of FIGS. 1 and 2, the first and second guide rails 2 and 3 are relatively driven and controlled as indicated by an arrow B. You can also Further, the bonding stage 4 for performing the bonding work is provided on the heater plate 5, and the heater plate 5 is arranged along the longitudinal direction of the guide rails 2 and 3 so that the center of the heater plate 5 coincides with the center of the bonding stage 4. It is set up. The heater plate 5 heats an incoming lead frame to an optimum heating temperature for bonding, and the bonding head 1 is mounted at the center of the heater plate 5.
A plurality of protrusions (not shown), which serve as marks to match the origin of the XY table coordinates, are arranged at predetermined intervals in the longitudinal direction.
The lead frame detection sensor 6 is arranged near the loader 7 side, which is the lead frame feeding side, and is arranged between the heater plate 5 and the second guide rail 3. The lead frame detection sensor 6 is an optical sensor including a light emitting device and a light receiving device, and is arranged so as to emit light from the light emitting device in the vertical direction of FIG.
When the lead frame arrives above, the light receiver detects the reflected light reflected by the lower surface of the lead frame.

Further, a loader 7 and an unloader 7'for sending out or accommodating the lead frame are fixed on both ends of the first and second guide rails 2 and 3 in the longitudinal direction on an apparatus main body (not shown).

The loader 7 is a device that sends the lead frame onto the bonding stage 4. This loader 7 includes an elevating mechanism base 8 and the elevating mechanism base 8 indicated by an arrow C in FIG.
It is composed of an adjusting means 9 for moving and adjusting in a direction and an elevating mechanism 10.

The elevating mechanism base 8 is configured to be movable in the direction of arrow C by the adjusting means 9, and the adjusting means 9 has a second position.
As shown in FIG. 3A, a nut 11 having a female screw is fixed to the end of the lifting mechanism base 8.
And a threaded rod 12 formed with a male screw are screwed together. The threaded rod 12 is screwed to a bearing 13 fixed to the main body 14 of the apparatus, and a knob 15 is attached to the end portion. By rotating this knob 15, the lifting mechanism base 8 can be moved in the direction of arrow C in FIG.
If a control motor composed of a pulse motor is used instead of the knob 15, the moving amount of the lifting mechanism base 8 can be automatically digitally controlled. The lifting mechanism base 8 is configured to be slidable with its both ends regulated by fixed guides 16a, 16b shown in FIG. 1 supported by the apparatus main body 14, guide bearings 17, and an eccentric guide 18. The guide bearing 17 and the eccentric guide 18 are used to adjust and adjust the lifting mechanism base 8 in the direction orthogonal to the longitudinal direction of the guide rails 2 and 3, so that the mounting error of the lifting mechanism 10 fixed on the lifting mechanism base 8 is eliminated. Can be corrected.

Next, in the lifting mechanism 10, as shown in FIG. 2A, the lower end portion of the lifting shaft 19 formed with the male screw has the lower end of the lifting mechanism base 8.
Is rotatably supported by the bearing portion 8a, and its upper end portion is coupled to the control motor 20 which is a pulse motor (which may be indirectly driven by a gear, a pulley or the like). An elevating member 21 formed with an internal thread is screwed to the elevating shaft 19, and the elevating member 21 can be moved up and down by rotating the control motor 20 in the forward and reverse directions. The amount of movement of the elevating member 21 is controlled by control means (not shown) such as a microcomputer. An upper sensor 22 and a lower sensor 23 that detect the upper and lower limit positions of the elevating member 21 are attached to predetermined positions of the elevating mechanism 10.
Optical sensors are used for these sensors 22 and 23. The elevating member 21 is provided with a magazine receiving portion 25 which has a substantially L-shaped cross section and receives the lower end portion of the magazine 24. A chuck 26 that holds and holds the end of the magazine 24 is slidably attached to the free end of the magazine receiving portion 25, and the other end of the chuck 26 is arranged along the elevating shaft 19. The cam surface of the cam 19a is abuttable. As shown in FIG. 2 (b), this cam 19a has a lifting shaft 19
Are formed on the cam surface of the cam 19a when the magazine receiving portion 25 is raised to receive and hold the magazine 24 or when the magazine receiving portion 25 is lowered to eject the magazine 24. It is configured to be pushed forward and projected by the convex portion.

The details of the configuration of the magazine receiving portion 25 will be described with reference to FIG. 2B. A chuck 26 is fixed to the tip of the fixing member 25a, and the lower end of the fixing member 25a and the lower end of the holding table 25e are fixed. Are connected by a spring 25b, and the fixing member 25a is always
It is biased toward the e side. A starting member 25c is provided below the holding table 25e, and a sliding member 25d fixed to the fixing member 25a is guided by the starting member 25c to be slidable. A roller 25f is provided at the other end of the fixing member 25a, and the roller 25f moves along the cam surface of the cam 19a.

Now, as shown in FIG. 2B, the magazine 24 placed on the holding table 25e, that is, the roller 25f when the magazine is supplied.
Pushes the chuck 26 forward against the biasing force of the spring 25b by the convex portion of the cam 19a, so the magazine 24 and the chuck 26
There is a gap between and. When the elevating member 21 descends and is positioned in the concave portion of the cam surface of the cam 19a, that is, when the magazine is fixed, the chuck 26 moves the chuck 26 by the action of the spring 25b.
Hold 4 When it is further lowered, the chuck 26 again projects forward due to the convex portion of the cam surface to release the state in which the magazine 24 is held and the state in which the magazine 24 can be discharged.

The magazine 24 is held by a chuck 26, and a plurality of lead frames 29 are stored in the magazine 24. The lead frame 29 is sequentially pushed out toward the bonding stage 4 by the pusher 35 shown in FIG. 1 descending the lifting member 21 of the lifting mechanism 10. The pusher 35 is arranged substantially parallel to the bonding stage surface and is configured to be driven by an air cylinder (not shown).

The side surface of the magazine 24 is regulated by a stocker guide 27 formed in a substantially L shape as shown in FIG. 1, and the stocker guide 27 includes first guide plates 31a and 31b and a second guide plate. 32a and 32b are movably fixed. Since the first and second guide plates 31a, 31b and 32a, 32b are fixed to the restricting surface of the stocker guide 27, they can be expanded by moving the stocker guide 27 in the arrow E direction, and By moving the second guide plates 32a and 32b along the regulation surface of the stocker guide 27 in the direction perpendicular to the first and second guide rails 2 and 3, it is possible to move the second guide plates in the directions D and D '. it can. As a result, it is possible to deal with exchanging magazines 24 having different sizes. In the plurality of magazines 24 inserted from above between the first and second guide plates 31a, 31b and 32a, 32b as shown in FIG. 2 (a), the magazine receiving portion 25 is raised to a predetermined position. Since it is locked by the magazine pusher 30 until it is held, it is pressed and locked by the magazine pusher 30 toward the stocker guide 27 (first guide plates 31a, 31b) that serves as a reference surface. Therefore, with this configuration, the magazine 24 is reliably regulated by the regulation surfaces of the first guide plates 31a and 31b fixed to the stocker guide 27 as shown in FIG. 2 (a). The timing of turning on and off the magazine pusher 30 is controlled by a control means (not shown), but as shown in FIG. 2 (a), the magazine pusher 30 is turned on until the elevating member 21 is lifted and holds the magazine 24. It is turned off when held by the receiving portion 25. Then, when the elevating member 21 descends and the magazine 24 is ejected, the magazine 24 is turned on again to lock the next magazine 24 (a portion indicated by a broken line in the drawing), and the elevating member 21 is controlled to wait until it elevates. ing. The magazine pusher 30 is driven by an air cylinder (not shown).

The above is the configuration of the loader 7, but since the lifting mechanism 10, the lifting mechanism base 8 and the adjusting means 9 of the unloader 7'are the same as the configuration of the loader 7, description thereof will be omitted.

Next, FIG. 3 shows another embodiment of the present invention.

The difference from the embodiment shown in FIG. 1 is that the adjusting means 9 of the embodiment of FIG. 1 is arranged below the elevating mechanism base 8, whereas in this embodiment it is arranged in a plane. The difference is. That is, the adjusting means 40 is configured to be connected to the lifting mechanism base 8 via the support member 41, and the lifting mechanism base 8 can be moved back and forth by rotating the knob 42.

The operation of this embodiment having the above configuration will be described.

First, the center of the IC chip (island) arranged on the lead frame 29 is fixed to the heater plate 5 with the first and second guide rails 2 and 3 slid to the maximum position and stopped. With the projections provided at intervals as easy as possible, the lead frame holder is aligned on the bonding stage 4 so that the center position of the lead frame 29 is aligned with the center position of the bonding stage 4, and then the control means by the computer controls the motor. Is controlled to move the first and second guide rails 2 and 3 to guide both ends of the lead frame. Next, on the loader side, the first and second guide plates 31a, 31b and 32a, 32b are attached to the arrow E,
The magazine 24 is fixed by moving it in the E'and D, D'directions.
Then, the knob 15 of the adjusting means 9 is rotated to align the center of the IC chip (island) of the lead frame 29 with the protrusion provided at the center of the heater plate 5.

The above adjustment is also performed on the unloader side.

If the type of the lead frame 29 changes, the above adjustment may be performed again.

In the present invention, the guide plates 31a and 31b and the stocker guide 2 are
Although 7 and 7 are configured by different members, they may be configured integrally.

[Advantage of the Invention] As described above, according to the present invention, there is an effect that the center of the lead frame island can always be easily adjusted to the center of the bonding stage by adjusting the adjusting means. Further, according to the present invention, it is sufficient to adjust the guide plate when exchanging the lead frame type, so that the exchanging work of the magazine can be efficiently performed. Further, according to the present invention,
Even if the frame width is changed, it is possible to easily deal with it, so that the error can be suppressed to a small level, and it is not necessary to use a plurality of spacers as in the conventional case, so that the cost can be reduced. Furthermore, in the present invention, since the load of the magazine has little influence on the lifting shaft, the balance is improved,
There is also an effect that it is preferable in terms of vibration.

[Brief description of drawings]

FIG. 1 is an embodiment of the present invention. FIG. 1 is a plan view showing the outline of the constitution of the device of the present invention, and FIG. 2 (a) shows the outline of the constitution of the lifting mechanism shown in FIG. 2B is an explanatory view for explaining the structure of the chuck and the magazine receiving portion of FIG. 2A, FIG. 3 is a view showing another embodiment of the present invention, and FIG. 5 (a) and 5 (b) are plan views showing the structure of a conventional frame guide device, FIG. 6 is a schematic sectional view of a conventional elevating mechanism, and FIG. 7 is a conventional frame guide device. And FIG. 8 is an explanatory view showing the structure of the lead frame. 1 ... Bonding head, 2 ... First guide rail, 3 ... Second guide rail, 4 ... Bonding stage, 5 ... Heater plate, 6 ... Lead frame detection sensor, 7, 7 '... Loader, 8 ... Lifting mechanism base, 9 ... Adjusting means, 10 ... Lifting mechanism, 16a, 16b ... Fixed guide, 17 ... Guide bearing, 18 ... Eccentric guide, 19 ... Lifting shaft, 21 ... Lifting member, 24 …… Magazine,
25 …… Magazine receiving part, 26 …… Chuck, 27 …… Stocker guide, 29 …… Lead frame, 30 …… Magazine pusher, 31a, 31b …… First guide plate, 32a, 32b …… Second guide Board.

Claims (2)

[Scope of utility model registration request] 1. A magazine capable of accommodating a plurality of frames, a guide means configured to regulate the magazine and be movable in a direction of supplying or accommodating a frame accommodated in the magazine, and the guide means. And a base provided with the elevating means, and the base supplies or stores a frame accommodated in the magazine. A frame guide device, characterized in that it can be moved in a direction intersecting with the direction. 2. The frame guide device according to claim 1, wherein the base is provided with an adjusting means for adjusting a positional deviation with respect to a direction in which the frame accommodated in the magazine is supplied or accommodated.