JP4116713B2 - Substrate support device for mounting machine - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting machine that mounts electronic components and the like on a substrate, and more particularly to a substrate support device that supports a substrate conveyed by a conveyor at a predetermined mounting position.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a mounting machine that automatically mounts electronic components has been provided with a substrate transfer line, and a substrate support device is provided on the transfer line.
[0003]
As shown in FIG. 4, the substrate support device is for supporting the substrate P conveyed by the conveyors 50 and 50 at a predetermined mounting position, and waits below the conveyors 50 and 50 when the substrate P is conveyed. An elevating mechanism is provided so as to rise when the substrate P reaches the mounting position. The lifting mechanism is generally composed of a movable plate 52 arranged in parallel with the substrate P, and an air cylinder 53 for raising and lowering the movable plate 52, and various substrate support members are arranged on the movable plate 52. It is installed.
[0004]
As a specific example of the substrate support member, a pressing pin 56 that corrects the warp of the substrate P by pressing the substrate P from below is shown.
[0005]
In FIG. 4, reference numeral 57 denotes a sleeve for guiding a rod that is expanded and contracted from the air cylinder 53. Reference numeral 58 denotes a restricting plate that is disposed on both sides of the movable plate 52 so as to face each other in a bowl shape and restricts the upper limit of the movable plate 52. A compression coil spring 59 is disposed between the regulating plate 58 and the upper surface of the elevating plate 52.
[0006]
According to the substrate support apparatus, the movable plate 52 can be lifted so that the pressing pin 56 is brought into contact with the back surface of the substrate P, and the substrate P can be supported at a predetermined mounting position.
[0007]
[Problems to be solved by the invention]
However, in the above-described substrate support apparatus, even if there is an error in the thickness of the substrate P, the error can be absorbed by the compression coil spring 59, but the movable plate 52 has a standby position and a positioning position. Since the reciprocating operation is merely performed between them, there is a problem that the mounting process in which the thickness of the substrate is different for each lot cannot be sufficiently handled. Specifically, when the conventional substrate support apparatus is applied to the substrates P having different thicknesses, the distance between the substrate P and the movable plate 52 changes for each substrate. As a result, the pressing force of the pressing pin 56 against the substrate P increases or decreases. When the pressing force is excessively applied, the substrate P is warped to cause defective mounting of electronic components. When the pressing force is insufficient, the warp of the substrate P cannot be corrected. .
[0008]
The present invention has been made in view of the problems in the conventional substrate support apparatus as described above, and can mount electronic components stably even when substrates having different thicknesses are supplied to a transport line. A substrate support apparatus is provided.
[0009]
[Means for Solving the Problems]
In the present invention, a substrate supporting member is provided on a movable frame that can be moved up and down, and the movable frame is lowered when the substrate is transported. In a substrate support apparatus that supports a substrate by contacting, a frame lifting mechanism that can move the movable frame up and down and adjust the movable frame lifting position, a thickness determination unit that determines the thickness of the substrate, and a thickness determination Control means for controlling the frame elevating mechanism to keep the distance between the substrate and the movable frame constant according to the thickness of the substrate determined by the means, and a plurality of the frame elevating mechanisms are vertically suspended from the movable frame. The ball screw is moved in the axial direction by rotating each nut body at a fixed position by rotating the nut body at a fixed position. A substrate supporting device constructed mounter and a drive unit.
[0010]
In the present invention, each fitted with a wheel to each nut to be screwed to a plurality of said ball screw, the drive unit is a belt looped around the respective wheels, it is composed of one drive motor for circulating the belt preferable.
[0011]
Moreover, it is preferable that the board | substrate support member in this invention has a press part which contact | abuts the lower surface of a board | substrate and corrects the curvature of a board | substrate.
[0012]
According to the present invention, when transporting the substrate, the thickness determining unit determines the thickness of the substrate, and when the substrate reaches a predetermined mounting position, the control unit determines whether the substrate is in accordance with the determined substrate thickness. The frame lifting mechanism is controlled so that the distance between the movable frame and the movable frame is constant. Thereby, even if it is a case where the board | substrate from which thickness differs is supplied to the conveyance line of a mounting machine, a board | substrate can be supported correctly.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on the embodiments shown in the drawings.
[0014]
FIG. 1 is a plan view showing a mounting machine to which a substrate supporting apparatus of the present invention is applied.
[0015]
First, in the figure, a conveyor 2 is arranged on a base 1, and a substrate P is transported by the conveyor 2 and supported by a substrate support device 3 described later.
[0016]
A first component supply unit 4 is disposed on the front side of the conveyor 2 and a second component supply unit 5 is disposed on the back side thereof.
[0017]
A number of tape feeders 4a are arranged in the first component supply unit 4, and each tape feeder 4a holds small chip components such as ICs, transistors, capacitors and the like at predetermined intervals. And is derived from a reel (not shown).
[0018]
The second component feeder 5 is provided with two tray feeders 6 and 7 having the same configuration, and the first tray feeder 6 and the second tray feeder 7 are provided with tray storage portions 8 and 9. . In these tray storage units 8 and 9, trays 10 on which relatively large electronic components such as QFP and PLCC are placed side by side are stored in multiple stages.
[0019]
The first tray feeder 6 will be described as a representative. The tray storage unit 8 has a built-in lifting mechanism that lifts and lowers the multistage tray, and the multistage tray can be lifted and lowered within the tray storage unit 8. Yes.
[0020]
On the base 1 in front of the tray storage portion 8 (lower side in FIG. 1), a fixed rail 11 is arranged in the Y-axis direction and extends to the vicinity of the conveyor 2, and the tray 10 is gripped on the fixed rail 11. A chuck member 12 for sliding is slid. Reference numerals 13 and 13 denote a pair of tray guides arranged above the fixed rail 11 in parallel with the fixed rail 11, and guide the tray 10 when the tray 10 is pulled out or stored. Yes.
[0021]
With the above configuration, when the lifting mechanism in the tray storage unit 8 is operated, the desired tray 10 can be positioned at a height corresponding to the tray guide 13, and the positioned tray 10 is further gripped by the chuck member 12. Then, it is pulled out from the tray storage unit 8, moved to the vicinity of the conveyor 2, and set at the electronic component supply position.
[0022]
Further, a head unit 16 for mounting electronic components is provided above the base 1 and can move in the X-axis direction (conveyor movement direction) and the Y-axis direction (direction orthogonal to the conveyor movement direction). It is like that.
[0023]
Specifically, a pair of fixed rails 17 are arranged in parallel on the base 1 along the Y-axis direction, and a head unit support member 18 is installed on both the fixed rails 17 and 17. The head unit support member 18 has a female screw portion 19 formed in the Y-axis direction, and a ball screw shaft 20 is screwed into the female screw portion 19.
[0024]
The ball screw shaft 20 is connected to the rotation shaft of the Y-axis servo motor 21. Therefore, when the Y-axis servo motor 21 is rotated forward or reverse, the head unit support member 18 moves in the Y-axis direction.
[0025]
Further, an X-axis servo motor 22 is attached to the head unit support member 18, and when the X-axis servo motor 22 is rotated forward or backward, it is screwed with a ball screw shaft 23 connected to the rotation shaft. The head unit 16 is moved in the X-axis direction.
[0026]
The head unit 16 includes one or more suction heads (not shown) for sucking electronic components. Each suction head can be lowered or raised with respect to the substrate from the frame of the head unit 16 using a Z-axis servomotor (not shown) as a drive source, and can be rotated using an R-axis servomotor (not shown) as a drive source. It can be done. In addition, an electronic component suction nozzle is provided at the lower end of each suction head so that the electronic component is sucked by a suction force by a negative pressure generating means (not shown).
[0027]
Next, the configuration of the substrate support apparatus 3 will be described with reference to FIGS.
[0028]
FIG. 2 shows the configuration of the drive unit in the substrate support device 3.
[0029]
In the drawing, reference numerals 30, 31, 32, and 33 denote ball screw shafts, and nuts (nut bodies) 30a, 31a, 32a, and 33a are screwed to the respective ball screw shafts, and the nuts 30a to 30d are respectively engaged. The driven wheels 30b, 31b, 32b, 33b are fixed respectively.
[0030]
A drive wheel 34a is fixed to the rotating shaft of the servo motor 34, and a timing belt 35 is stretched around the drive wheel 34a and the driven wheels 30b, 31b, 32b, 33b. Reference numeral 36 denotes a tension roller for applying tension to the timing belt 35. When the servo motor 34 is rotated forward or backward, the timing belt 35 travels in the direction of arrow A or B. In the figure, CH is a drive portion of the chuck member 12 in the tray feeder, and the movable frame 37 supported by the ball screw shafts 30 to 33 is provided with notches 37b and 37b so as to avoid the drive portion CH. It has been.
[0031]
FIG. 3 is a front view showing a main part of the substrate support device 3. In the following description, the ball screw shaft 30 will be described as a representative.
[0032]
A ball screw shaft 30 is vertically provided through the frame 1 a fixed to the inner wall of the base 1, and a cylindrical nut 30 a as a nut body is screwed to the ball screw shaft 30. A flange portion 30c is formed in a bowl shape on the upper portion of the cylindrical nut 30a, and a wheel 30b is integrally attached via a bolt 30d so as to cover the flange portion 30c.
[0033]
The cylindrical nut 30a is accommodated in a cylindrical receiving seat 30e fixed to the frame 1a, and a bearing 30f is inserted into an annular gap between the cylindrical nut 30a and the cylindrical receiving seat 30e.
[0034]
Further, a cylindrical cap 30h having a plate-like collar portion 30g is attached to the upper end of the ball screw shaft 30, and a cylindrical latch that can engage with the bottom surface of the plate-like collar portion 30g is attached to the lower surface of the movable frame 37. The part 30i is attached. When the lower surface of the dish-shaped collar portion 30g and the cylindrical locking portion 30i come into contact with each other, a slight gap is formed between the upper end of the cylindrical cap 30h and the lower surface of the movable frame 37. A compression coil spring 30j is mounted in the cylindrical cap 30h.
[0035]
The lower surface of the dish-shaped flange 30g is formed in an arc shape, and the cylindrical locking portion 30i can be slightly swung while being in contact with a part of the arc-shaped lower surface. Inclination is allowed.
[0036]
A rod-like stopper 38 is suspended from the lower surface of the movable frame 37 so as to regulate the lower limit of movement of the movable frame 37. Further, on the upper surface of the movable frame 37, a pressing pin (pressing portion) 42 that protrudes from the lower side to press the substrate P to correct the warp of the substrate P is provided.
[0037]
The servo motor (drive motor) 34 is controlled in rotation speed by a pulse signal output from a controller (control means) 39. When the substrate thickness discriminating section (thickness discriminating means) 39a of the controller 39 discriminates the thickness of the substrate, the servo motor 34 is controlled so that the distance between the substrate and the movable frame 37 is constant. If the distance between the substrate and the movable frame 37 is made constant, the substrate can be held in a state where the appropriate pressing force is always applied to the substrate and the warp is corrected.
[0038]
The memory 39b of the controller 39 stores the specifications of the components used in each of a plurality of types of mounting processes, and the board thickness is stored as one of the board size data. Further, the conversion table 39c of the controller 39 stores the relationship between the board thickness and the movable frame rising amount for each mounting process, and given the board thickness, the movable table corresponding to the board thickness is provided. The amount of frame rise can be read out. Reference numeral 40 denotes an input unit for inputting various data and control commands.
[0039]
Next, the operation of the substrate support apparatus having the above configuration will be described.
[0040]
When the operator selects a desired mounting process by operating the input unit 40, the board thickness determination unit 39a of the controller 39 stores the board thickness used in the selected mounting process in the board size data. Is read from the stored memory 39b and transferred to the conversion table 39c. In the conversion table 39c, the movable frame rising amount corresponding to the read substrate thickness is read.
[0041]
Next, the controller 39 converts the read moving frame rising amount into a pulse signal and outputs it to the servo motor 34.
[0042]
When the servo motor 34 rotates and the timing belt 35 travels in the B direction, the wheel 30b rotates and the nut body 30a rotates, and the ball screw shaft 30 is pushed upward. At this time, since the timing belt 35 is stretched around the ball screw shafts 30 to 33, the ball screw shafts 30 to 33 are pushed up in conjunction with each other, and the movable frame 37 supported by the ball screw shafts 30 to 33. To raise. As the movable frame 37 rises, the pressing pin 42 presses the lower side of the substrate P to correct the warp of the substrate P.
[0043]
In the above-described embodiment, the thickness determination unit according to the present invention is configured to read the substrate thickness from the memory 39b based on an instruction for the operator to select a mounting process. It is also possible to add an identification code to the substrate to be read, read the identification code with a reader, and read the substrate thickness from the memory 39b.
[0044]
In the above embodiment, the pressing portion of the present invention is configured by a pressing pin. However, the pressing portion is not limited to this, and any pressing member can be used as long as it can correct the warpage of the substrate, such as a pressing plate and a pressing roller. Means can be used.
[0045]
【The invention's effect】
As is apparent from the above description, according to the substrate support apparatus of the present invention, electronic components can be stably mounted even when substrates having different thicknesses are supplied to the transport line.
[0046]
If the frame elevating mechanism is composed of a plurality of ball screws suspended from the movable frame, a nut body screwed with the ball screw, and a drive unit that rotates each nut body at a fixed position, It has the advantage that the rising height can be precisely controlled.
[0047]
If a wheel is attached to the nut body, and the drive unit is composed of a belt spanning each wheel and one drive motor that circulates the belt, an air supply source is not required like an air cylinder, The lifting structure of the movable frame can be simplified.
[Brief description of the drawings]
FIG. 1 is a plan view of a substrate support apparatus according to the present invention.
FIG. 2 is a plan view of a principal part showing a configuration of a drive unit of the substrate support apparatus.
FIG. 3 is a front view of an essential part showing a lifting structure of a substrate support apparatus.
FIG. 4 is a main part front view showing a configuration of a conventional substrate support apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Base 2 Conveyor 3 Board | substrate support apparatus 30-33 Ball screw shaft 34 Servo motor 35 Timing belt 37 Movable frame 39 Controller 39a Board thickness discrimination | determination part 39b Memory 39c Conversion table 40 Input part P Board | substrate

Claims (3)

A substrate support member is provided on the movable frame that can be moved up and down, and the movable frame is lowered when the substrate is transported, and when the substrate reaches a predetermined mounting position, the movable frame is lifted to contact the substrate support member with the substrate. In a substrate support apparatus that contacts and supports the substrate, a frame elevating mechanism that elevates the movable frame and that can adjust the frame elevating position, a thickness determining unit that determines the thickness of the substrate, Control means for controlling the frame elevating mechanism so as to make the distance between the substrate and the movable frame constant according to the thickness of the substrate determined by the thickness determining means, and the frame elevating mechanism includes the frame elevating mechanism, A plurality of ball screws suspended from the movable frame, a nut body screwed to the ball screw, and each nut body by rotating each nut body at a fixed position, Substrate supporting device mounting apparatus, characterized in that consists of a drive unit for moving the ball screw in its axial direction. Each mounting a wheel to each nut to be screwed to a plurality of said ball screw, said drive unit includes a belt bridged to each wheel, according to claim 1, wherein comprised one drive motor for circulating the belt Substrate support device for mounting machines. The substrate supporting member mounter of the substrate supporting apparatus according to claim 1 or 2 having a pressing portion for correcting the warpage of the substrate in contact with the lower surface of the substrate.

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