JP2817080B2 - Bonding equipment - Google Patents
Bonding equipmentInfo
- Publication number
- JP2817080B2 JP2817080B2 JP33943492A JP33943492A JP2817080B2 JP 2817080 B2 JP2817080 B2 JP 2817080B2 JP 33943492 A JP33943492 A JP 33943492A JP 33943492 A JP33943492 A JP 33943492A JP 2817080 B2 JP2817080 B2 JP 2817080B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heater plate
- bonding
- work holder
- vertical movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体を製造するボン
ディング装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for manufacturing a semiconductor.
【０００２】[0002]
【従来の技術】従来、ワイヤボンディング装置として例
えば図３に示すものが知られている。このワイヤボンデ
ィング装置は、リードフレーム１の搬送を案内するガイ
ドレール２に沿って設けられリードフレーム１を把持し
て搬送するリードフレーム搬送装置３と、上下動機構４
により上下動可能とされリードフレーム１を下方から加
熱するヒータープレート５と、上下動機構６により上下
動可能とされリードフレーム１を上方から前記ヒーター
プレート５上面に押え付けるワーク押え７と、ボンディ
ングヘッド８とを備えて構成され、リードフレーム供給
マガジン１１からボンディング点Ｐに搬送されたリード
フレーム１を十分加熱した後、ボンディングヘッド８に
よりワイヤボンディングを行うようになっていた。しか
して、このワイヤボンディング装置では、リードフレー
ム１を特別な場合を除き１ピッチずつ搬送すると共に、
リードフレーム１の搬送時にはこれを妨害なく搬送可能
なようにヒータープレート５の下降動作およびワーク押
え７の上昇動作をしたのちボンディング点Ｐに搬送す
る。ボンディング点Ｐにおいてはヒータープレート５に
よってリードフレーム１の加熱が行われるが、この加熱
はヒータープレート５の上昇動作とワーク押え７の下降
動作を同時に行いリードフレーム１をヒータープレート
５に固定した状態で行うものであるため、リードフレー
ム１のアイランド及びリードの反り等の変形が発生し
て、ボンディング精度の向上や半導体装置の生産能力の
向上が難しいといった問題点があった。2. Description of the Related Art Conventionally, for example, a wire bonding apparatus shown in FIG. 3 is known. The wire bonding apparatus includes a lead frame transport device 3 provided along a guide rail 2 for guiding the transport of the lead frame 1 and gripping and transporting the lead frame 1;
A heater plate 5 that can be moved up and down and heats the lead frame 1 from below; a work holder 7 that can be moved up and down by an up and down movement mechanism 6 and presses the lead frame 1 against the upper surface of the heater plate 5; After the lead frame 1 transported from the lead frame supply magazine 11 to the bonding point P is sufficiently heated, the bonding head 8 performs wire bonding. In this wire bonding apparatus, the lead frame 1 is transported one pitch at a time except in special cases.
When the lead frame 1 is transported, the lowering operation of the heater plate 5 and the raising operation of the work holder 7 are performed so that the lead frame 1 can be transported without obstruction, and then the lead frame 1 is transported to the bonding point P. At the bonding point P, the heating of the lead frame 1 is performed by the heater plate 5, and this heating is performed while the raising operation of the heating plate 5 and the lowering operation of the work holder 7 are performed simultaneously and the lead frame 1 is fixed to the heating plate 5. Therefore, there is a problem that deformation such as warpage of the islands and leads of the lead frame 1 occurs and it is difficult to improve the bonding accuracy and the production capacity of the semiconductor device.
【０００３】このような問題点を解決するために、実開
平４−５９１４１号公報にも示されるように、ヒーター
プレート５とワーク押え７の上下動機構４，６の各作動
を制御する制御装置１２，１３により上下動機構４，６
を独立に作動可能とし、ヒータープレート５の上昇によ
りリードフレーム１の十分な加熱を行った後にワーク押
え７を下降させてボンディングを行っていた。即ち、図
４に示すタイミングチャートのように、ヒータープレー
ト５とワーク押え７の動作を行わせ、一時的にヒーター
プレート５の上昇タイミングに対しワーク押さえ７の下
降タイミングを遅らせており、ボンディング時と搬送時
のそれぞれの位置ではこれらを停止させていた。また、
ボンディングが終了し、リードフレーム１の１ピッチ送
り、あるいはリードフレーム１のリードフレーム搬送装
置３からの排出を行う場合には、図４のように、ワーク
押え７の上昇タイミングに対しヒータープレート５の下
降タイミングを遅らせる動作により、リードフレーム１
を開放して搬送を行っていた。In order to solve such problems, as shown in Japanese Utility Model Laid-Open No. 4-59141, a control device for controlling the operations of the heater plate 5 and the vertical movement mechanisms 4 and 6 of the work holder 7 is disclosed. Vertical movement mechanisms 4, 6 by 12, 13
Can be operated independently, and after the lead frame 1 is sufficiently heated by raising the heater plate 5, the work holder 7 is lowered to perform bonding. That is, as shown in the timing chart of FIG. 4, the operation of the heater plate 5 and the work holder 7 is performed, and the lowering timing of the work holder 7 is temporarily delayed with respect to the rising timing of the heater plate 5, so that the time of bonding and These were stopped at each position during transport. Also,
When the bonding is completed and the lead frame 1 is fed by one pitch or the lead frame 1 is discharged from the lead frame transport device 3, as shown in FIG. The operation of delaying the falling timing causes the lead frame 1
Was opened and transported.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来のヒータープレート５とワーク押え７の動作の制御手
段では次のような問題が生じていた。 １．ワーク押え５の上昇後ヒータープレート５が下降す
るため、ヒータープレート５の下降によってリードフレ
ーム１は搬送方向両側のガイドレール２で支えられるこ
とになり、リードフレーム１は宙吊りの状態となるた
め、ヒータープレート５の下降と同時にリードフレーム
１に上下方向の振動が発生する。この振動は、幅の広い
リードフレーム，厚さの薄いリードフレーム，リードフ
レームを構成するリードが細くて曲げ強度の弱いリード
フレーム等では大きなものとなる。また、通常ボンディ
ングはリードフレームの中央で行われるため、前記振動
によってボンディングしたワイヤのループが破壊され、
良好なボンディング状態を保つことができず、信頼性，
生産性向上の弊害となっていた。 ２．ヒータープレート５およびワーク押え７の停止位置
が固定されているために、リードフレーム１の搬送時に
おけるボンディング点での加熱が十分でない状態でワー
ク押え７が下降してリードフレーム１が把持される可能
性があり、その時にはリードフレームの変形によって認
識ズレによるボンディングの位置ズレ等が発生し、良好
なボンディングが行えず、信頼性，生産性向上の弊害と
なっていた。本発明は、上記従来の問題点を解決し、信
頼性，生産性の高いボンディング装置を提供しようとす
るものである。However, the above-described conventional control means for controlling the operation of the heater plate 5 and the work holder 7 has the following problems. 1. Since the heater plate 5 is lowered after the work holder 5 is raised, the lead frame 1 is supported by the guide rails 2 on both sides in the transport direction by the lowering of the heater plate 5, and the lead frame 1 is suspended in the air. A vertical vibration is generated in the lead frame 1 simultaneously with the lowering of the plate 5. This vibration is large in a lead frame having a wide width, a lead frame having a small thickness, a lead frame having thin leads constituting a lead frame and a weak bending strength, and the like. Also, since the bonding is usually performed at the center of the lead frame, the loop of the bonded wire is broken by the vibration,
Good bonding condition cannot be maintained,
This has been a negative effect on productivity. 2. Since the stop positions of the heater plate 5 and the work holder 7 are fixed, the work holder 7 can be lowered and the lead frame 1 can be gripped in a state where the heating at the bonding point during the transfer of the lead frame 1 is not sufficient. In such a case, the displacement of the lead frame causes a displacement of the bonding position due to the recognition deviation, so that good bonding cannot be performed, which is an adverse effect on reliability and productivity. An object of the present invention is to solve the above-mentioned conventional problems and to provide a bonding device having high reliability and high productivity.
【０００５】[0005]
【課題を解決するための手段】本発明は、リードフレー
ム搬送装置と、上下動機構を有しリードフレームを下方
から加熱するヒータプレートと、上下動機構を有しリー
ドフレームを上方から前記ヒータプレート上面に押さえ
るワーク押さえと、ボンディングヘッドとを備えたボン
ディング装置において、前記ヒータプレートとワーク押
さえの各上下動機構にそれぞれカム機構を連動せしめ、
これらのカム機構を正転、逆転、停止自在で回転速度可
変の単一の駆動モータに連結し、前記カム機構の逆回転
により、ボンディング後のリードフレーム搬送に際して
は前記ヒータプレートを下降させて所定時間経過後に前
記ワーク押さえを上昇させ、リードフレームのボンディ
ングに際しては前記ヒータプレートを上昇させて所定時
間経過後に前記ワーク押さえを下降させるとともに、前
記駆動モータを前記ワーク押さえの上昇直前および下降
直前に一時停止させることを特徴とするボンディング装
置である。SUMMARY OF THE INVENTION The present invention relates to a lead frame transport device, a heater plate having a vertical movement mechanism for heating a lead frame from below, and a heater plate having a vertical movement mechanism for moving the lead frame from above. In a bonding apparatus provided with a work holder that holds down the upper surface and a bonding head, a cam mechanism is interlocked with each of the vertical movement mechanisms of the heater plate and the work holder,
These cam mechanisms are connected to a single drive motor that can rotate forward, reverse, and stop freely and have a variable rotation speed, and the reverse rotation of the cam mechanism lowers the heater plate when transporting the lead frame after bonding. After a lapse of time, the work holder is raised, and at the time of lead frame bonding, the heater plate is raised to lower the work holder after a predetermined time has elapsed, and the drive motor is temporarily moved immediately before the work holder is raised and immediately before the work holder is lowered. This is a bonding device that is stopped.
【０００６】[0006]
【作用】まず、ボンディング終了後のリードフレーム搬
送時には、ワーク押さえを作動させずヒータプレートを
下降させる。即ち、ワーク押さえがリードフレームに接
触している状態でヒータプレートが下降するため、リー
ドフレームの振動が抑制される。ここで、ワーク押さえ
が上昇する直前に駆動モータを一時停止させるため、残
留振動が収束してからのリードフレーム搬送が可能とな
る。また、ボンディング時には、ヒータプレートを先に
上昇させてリードフレームと接触させ、十分な加熱を行
ってリードフレームの熱膨張あるいは熱変形を飽和させ
た後ワーク押さえを下降させてリードフレームを押さえ
ることによって、リードフレームの変形は生ずることな
くボンディングを行うことができる。そして、ワーク押
さえが下降する直前に駆動モータを一時停止させるた
め、ヒータプレートの上昇後に十分な加熱時間が確保さ
れ、熱膨張をより十分に飽和させることができる。First, when the lead frame is conveyed after the bonding is completed, the heater plate is lowered without operating the work holder. That is, since the heater plate descends while the work holder is in contact with the lead frame, vibration of the lead frame is suppressed. Here, since the drive motor is temporarily stopped immediately before the work holder rises, the lead frame can be conveyed after the residual vibration has converged. Also, at the time of bonding, the heater plate is raised first to make contact with the lead frame, sufficient heating is performed to saturate the thermal expansion or thermal deformation of the lead frame, and then the work holder is lowered to hold the lead frame. The bonding can be performed without causing deformation of the lead frame. Since the drive motor is temporarily stopped immediately before the work holder is lowered, a sufficient heating time is secured after the heater plate is raised, and the thermal expansion can be more sufficiently saturated.
【０００７】[0007]
【実施例】本発明の一実施例を図１に基づいて説明する
が、ボンディング装置の全体構造は前記図３の従来装置
と同様であり、要部以外は省略してある。さて、ヒータ
ープレート５の上下動機構４はカムフォロアー１４1 を
介してヒータープレート上下カム１４の回転によって上
下動し、またワーク押え７の上下動機構６はカムフォロ
アー１６1 を介してワーク押え上下カム１６の回転によ
って上下動するようにし、これらのヒータープレート上
下カム１４とワーク押え上下カム１６は単一の駆動モー
タ１７によって駆動される。これらのカムの形状は、図
２のタイミングチャートに示すように設定し、駆動モー
タ１７は任意の位置に停止させることが可能であり、正
転，逆転を任意に行えることが可能であり、回転速度を
任意に設定することが可能であるような、例えばパルス
モータ等を使用する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIG. 1. The overall structure of the bonding apparatus is the same as that of the conventional apparatus shown in FIG. Now, vertical movement mechanism 4 of the heater plate 5 is moved up and down by the rotation of the heater plate vertically cam 14 via a cam follower 14 1, also vertical movement mechanism 6 of the workpiece holding 7 work holding vertically through the cam follower 16 1 The heater 16 is moved up and down by the rotation of the cam 16, and the heater plate up and down cam 14 and the work holding up and down cam 16 are driven by a single drive motor 17. The shapes of these cams are set as shown in the timing chart of FIG. 2, and the drive motor 17 can be stopped at an arbitrary position, and can rotate arbitrarily forward and reverse. For example, a pulse motor or the like that can set the speed arbitrarily is used.
【０００８】しかして、ボンディング終了後リードフレ
ーム搬送時におけるリードフレームの上下方向の振動を
防止するためには、駆動モータ１７を図２のタイミング
チャートにおける０°から逆の２７０°方向へ逆転さ
せ、ワーク押え７は下降したままリードフレームと接触
している状態でヒータープレート５が下降するため、リ
ードフレームの振動は抑制され、またヒータープレート
５の下降速度を下げることによってリードフレームの振
動抑制効果は増大する。さらに、ワーク押え７が上昇す
直前に一時停止点Ｂを設定することにより、残留振動が
収束してからのリードフレーム搬送が可能となり、前記
残留振動とリードフレーム搬送時の振動の相乗を避ける
ことができる。また、リードフレームの振動を考慮しな
くてよいような厚さ，形状のリードフレームに対して
は、駆動モータ１７の回転方向を０°から正の方向へ正
転させ、かつ高速で行うことが可能となる。次に、リー
ドフレーム搬送時において、次のボンディング部へ移送
するに際には１８０°から逆の９０°方向へ進み、まず
ヒータープレート５が上昇しリードフレームに接触して
加熱が行われ、リードフレームの熱膨張が飽和状態とな
った後ワーク押え７を下降させることによって熱による
リードフレームの変形を防止する。また、ワーク押え７
が下降する直前に一時停止点Ａを設定することにより、
ヒータープレート５の上昇後十分な加熱時間が設けられ
熱膨張の飽和をより十分に行うことができる。なお、前
記一時停止点Ａ，Ｂにおける停止時間は、リードフレー
ムの厚さ、形状等に応じて適宜決める。さらに、駆動モ
ータ１７の回転速度を制御することにより、ヒータープ
レート５およびワーク押え７の各上下移動速度を制御
し、リードフレームに対する衝撃等を緩和することがで
きる。例えば、リードフレーム搬送後、ヒータープレー
ト５が上昇してからワーク押え７の下降速度を遅くする
ことにより、リードフレームを把持する際の衝撃を緩和
する。In order to prevent the lead frame from vibrating in the vertical direction when the lead frame is conveyed after the bonding is completed, the drive motor 17 is rotated in the reverse direction from 0 ° in the timing chart of FIG. Since the heater plate 5 descends while the work retainer 7 is in contact with the lead frame while descending, the vibration of the lead frame is suppressed, and the vibration suppressing effect of the lead frame is reduced by lowering the descending speed of the heater plate 5. Increase. Further, by setting the temporary stop point B immediately before the work holder 7 is lifted, the lead frame can be conveyed after the residual vibration has converged, and the synergism between the residual vibration and the vibration during lead frame conveyance can be avoided. Can be. Further, for a lead frame having a thickness and a shape that does not need to consider the vibration of the lead frame, the rotation direction of the drive motor 17 can be rotated forward from 0 ° to a positive direction and the rotation can be performed at high speed. It becomes possible. Next, at the time of transporting the lead frame, when transporting to the next bonding portion, the process proceeds from 180 ° to the opposite 90 ° direction. First, the heater plate 5 rises and comes into contact with the lead frame, and heating is performed. By lowering the work holder 7 after the thermal expansion of the frame is saturated, deformation of the lead frame due to heat is prevented. Also, work holder 7
By setting the pause point A just before
Sufficient heating time is provided after the heater plate 5 is raised, so that the thermal expansion can be sufficiently saturated. The stop time at the temporary stop points A and B is appropriately determined according to the thickness and shape of the lead frame. Further, by controlling the rotation speed of the drive motor 17, the vertical movement speed of each of the heater plate 5 and the work holder 7 can be controlled, and the impact on the lead frame can be reduced. For example, after the lead frame is conveyed, by lowering the lowering speed of the work holder 7 after the heater plate 5 rises, the impact when gripping the lead frame is reduced.
【０００９】[0009]
【発明の効果】以上述べたように本発明によれば、ヒー
タプレートおよびワーク押さえの上下動をカム制御とモ
ータの正転、逆転、停止とを組み合わせて制御するた
め、搬送時におけるヒータプレートの下降によるリード
フレームの振動を抑制してボンディング後のワイヤある
いはループの破壊若しくは変形を防止し、リードフレー
ムの熱変形による認識ズレ、ボンディング位置ズレ等を
防止し、信頼性、生産性が向上し、また、ヒータプレー
ト、ワーク押さえの各上下動作を一つの駆動モータで行
い、構造簡単で組み立て、調整工数が低減し、部品点数
も少なく原価低減が可能となる等の極めて有益なる効果
を奏する。また、リードフレームの振動等を考慮しなく
てよいときはモータ正転により高速ボンディングが可能
となる。このように本願発明は、リードフレームの厚
さ、形状等に応じてボンディング作業を適宜選択できる
ものである。As described above, according to the present invention, the vertical movement of the heater plate and the work holder is controlled by a combination of the cam control and the forward rotation, reverse rotation, and stop of the motor. Suppress the vibration of the lead frame due to the descent, prevent the breakage or deformation of the wire or loop after bonding, prevent misalignment due to thermal deformation of the lead frame, misalignment of the bonding position, etc., improve reliability and productivity, In addition, the up and down operations of the heater plate and the work holder are performed by a single drive motor, so that the structure is simple, the number of adjustment steps is reduced, the number of parts is reduced, and the cost is reduced. In addition, when it is not necessary to consider the vibration of the lead frame, high-speed bonding can be performed by forward rotation of the motor. As described above, according to the present invention, the bonding operation can be appropriately selected according to the thickness, shape, and the like of the lead frame.
【図１】本発明の実施例を示す要部の説明図。FIG. 1 is an explanatory view of a main part showing an embodiment of the present invention.
【図２】図１のタイミングチャート。FIG. 2 is a timing chart of FIG.
【図３】従来例の斜視図。FIG. 3 is a perspective view of a conventional example.
【図４】図３のタイミングチャート。FIG. 4 is a timing chart of FIG. 3;
１ リードフレーム ２ ガイドレール ３ リードフレーム搬送装置 ４ 上下動機構 ５ ヒータープレート ６ 上下動機構 ７ ワーク押え ８ ボンディングヘッド １１ リードフレーム供給マガジン １４ ヒータープレート上下カム １４1 カムフォロアー １６ ワーク押え上下カム １６1 カムフォロアー １７ 駆動モータDESCRIPTION OF SYMBOLS 1 Lead frame 2 Guide rail 3 Lead frame conveyance device 4 Vertical movement mechanism 5 Heater plate 6 Vertical movement mechanism 7 Work holding 8 Bonding head 11 Lead frame supply magazine 14 Heater plate vertical cam 14 1 Cam follower 16 Work holding vertical cam 16 1 cam Follower 17 Drive motor
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 21/60 301──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 21/60 301
Claims (1)
を有しリードフレームを下方から加熱するヒータプレー
トと、上下動機構を有しリードフレームを上方から前記
ヒータプレート上面に押さえるワーク押さえと、ボンデ
ィングヘッドとを備えたボンディング装置において、 前記ヒータプレートとワーク押さえの各上下動機構にそ
れぞれカム機構を連動せしめ、これらのカム機構を正
転、逆転、停止自在で回転速度可変の単一の駆動モータ
に連結し、前記カム機構の逆回転により、ボンディング
後のリードフレーム搬送に際しては前記ヒータプレート
を下降させて所定時間経過後に前記ワーク押さえを上昇
させ、リードフレームのボンディングに際しては前記ヒ
ータプレートを上昇させて所定時間経過後に前記ワーク
押さえを下降させるとともに、前記駆動モータを前記ワ
ーク押さえの上昇直前および下降直前に一時停止させる
ことを特徴とするボンディング装置。1. A lead frame transport device, a heater plate having a vertical movement mechanism for heating the lead frame from below, a work holder having a vertical movement mechanism for pressing the lead frame from above onto the heater plate, and bonding. In a bonding apparatus including a head, a cam mechanism is linked to each of the vertical movement mechanisms of the heater plate and the work holder, and a single drive motor that can rotate forward, reverse, and stop freely and has a variable rotation speed. By the reverse rotation of the cam mechanism, the heater plate is lowered when the lead frame is transported after bonding, the work holder is raised after a predetermined time has elapsed, and the heater plate is raised when the lead frame is bonded. When the work holder is lowered after a predetermined time Moni, bonding apparatus characterized by temporarily stopping the driving motor to increase just before and fall immediately before the workpiece retainer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33943492A JP2817080B2 (en) | 1992-11-27 | 1992-11-27 | Bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33943492A JP2817080B2 (en) | 1992-11-27 | 1992-11-27 | Bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06163626A JPH06163626A (en) | 1994-06-10 |
| JP2817080B2 true JP2817080B2 (en) | 1998-10-27 |
Family
ID=18327432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33943492A Expired - Fee Related JP2817080B2 (en) | 1992-11-27 | 1992-11-27 | Bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2817080B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100361010B1 (en) * | 1999-12-31 | 2002-11-18 | 주식회사 아큐텍반도체기술 | Apparatus for plating leadframe |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1233334B (en) * | 1989-05-12 | 1992-03-27 | Calco Cloth Srl | PROCEDURE FOR PRINTING IN PARTICULAR ON FABRICS, LEATHER AND SIMILAR |
| JP2513437Y2 (en) * | 1990-07-24 | 1996-10-09 | 株式会社カイジョー | Wire bonding equipment |
-
1992
- 1992-11-27 JP JP33943492A patent/JP2817080B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06163626A (en) | 1994-06-10 |
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