JPH0459142U - - Google Patents

Info

Publication number
JPH0459142U
JPH0459142U JP1990077848U JP7784890U JPH0459142U JP H0459142 U JPH0459142 U JP H0459142U JP 1990077848 U JP1990077848 U JP 1990077848U JP 7784890 U JP7784890 U JP 7784890U JP H0459142 U JPH0459142 U JP H0459142U
Authority
JP
Japan
Prior art keywords
lead frame
presser member
vertical movement
movement mechanism
lowered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990077848U
Other languages
Japanese (ja)
Other versions
JPH0810191Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990077848U priority Critical patent/JPH0810191Y2/en
Publication of JPH0459142U publication Critical patent/JPH0459142U/ja
Application granted granted Critical
Publication of JPH0810191Y2 publication Critical patent/JPH0810191Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例の斜視図、第２図は従
来例の斜視図である。 １……リードフレーム、２……ガイドレール、
３……リードフレーム搬送装置、４，６……上下
動機構、５……ヒータプレート、７……ワーク押
え、８……ボンデイングヘツド、９……認識カメ
ラ、１０……認識装置、１１……リードフレーム
供給マガジン、１２，１３，１４……制御装置。 FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional example. 1...Lead frame, 2...Guide rail,
3... Lead frame conveyance device, 4, 6... Vertical movement mechanism, 5... Heater plate, 7... Work holder, 8... Bonding head, 9... Recognition camera, 10... Recognition device, 11... Lead frame supply magazine, 12, 13, 14...control device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレーム搬送装置と、上下動機構を有す
るリードフレーム加熱装置と、上下動機構を有す
るリードフレーム押え部材と、ボンデイングヘツ
ドと、リードフレーム認識装置とを備えたワイヤ
ボンデイング装置において、前記リードフレーム
加熱装置と押え部材の上下動機構をそれぞれ独立
に作動可能とする制御装置を設け、リードフレー
ムの加熱時間経過後に押え部材を下降させて認識
装置により送りずれを検知し、押え部材を上昇さ
せて補正し、この検知・補正を繰り返し、その後
、押え部材を下降させてボンデイングするように
したことを特徴とするワイヤボンデイング装置。 A wire bonding apparatus comprising a lead frame transport device, a lead frame heating device having a vertical movement mechanism, a lead frame holding member having a vertical movement mechanism, a bonding head, and a lead frame recognition device, wherein the lead frame heating device A control device is installed to enable the vertical movement mechanism of the presser member and the presser member to operate independently, and after the heating time of the lead frame has elapsed, the presser member is lowered, a recognition device detects the feed deviation, and the presser member is raised to correct it. A wire bonding apparatus characterized in that this detection and correction is repeated, and then the holding member is lowered to perform bonding.
JP1990077848U 1990-07-24 1990-07-24 Wire bonding equipment Expired - Fee Related JPH0810191Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990077848U JPH0810191Y2 (en) 1990-07-24 1990-07-24 Wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990077848U JPH0810191Y2 (en) 1990-07-24 1990-07-24 Wire bonding equipment

Publications (2)

Publication Number Publication Date
JPH0459142U true JPH0459142U (en) 1992-05-21
JPH0810191Y2 JPH0810191Y2 (en) 1996-03-27

Family

ID=31809537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990077848U Expired - Fee Related JPH0810191Y2 (en) 1990-07-24 1990-07-24 Wire bonding equipment

Country Status (1)

Country Link
JP (1) JPH0810191Y2 (en)

Also Published As

Publication number Publication date
JPH0810191Y2 (en) 1996-03-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees