JPH0236024U - - Google Patents

Info

Publication number
JPH0236024U
JPH0236024U JP1988116248U JP11624888U JPH0236024U JP H0236024 U JPH0236024 U JP H0236024U JP 1988116248 U JP1988116248 U JP 1988116248U JP 11624888 U JP11624888 U JP 11624888U JP H0236024 U JPH0236024 U JP H0236024U
Authority
JP
Japan
Prior art keywords
layer
capacitor element
capacitor
metallcon
dipping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988116248U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988116248U priority Critical patent/JPH0236024U/ja
Priority to US07/400,874 priority patent/US4959652A/en
Publication of JPH0236024U publication Critical patent/JPH0236024U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【図面の簡単な説明】
第１図乃至第３図は本考案による面実装形金属
化フイルムコンデンサの製造工程を段階的に示す
図であり、第１図はメタリコン完了状態のコンデ
ンサ素子を示す正面図、第２図は樹脂コーテイン
グ後のコンデンサ素子を示す正面図、第３図は完
成品のコンデンサを示す正面図、第４図は第１図
の状態のコンデンサ素子の幅寸法Ｗ１の分布図、
第５図は第３図のコンデンサの幅寸法Ｗ３の分布
図、第６図は各工程の製品の耐湿放置特性を示す
特性図である。 １……素子、２……メタリコン層、３……リー
ド線、４……エポキシ樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属化フイルムを巻回または積層してコンデン
    サ素子を形成し、このコンデンサ素子の両端面の
    最外層に、融点が１８０℃以上の半田を溶射して
    厚さ０．２mm以上のメタリコン層を形成し、さら
    に、この素子に真空含浸またはデイツプにより樹
    脂をコーテイングし、この後、メタリコン層の表
    面を研磨して電極としたことを特徴とする面実装
    形金属化フイルムコンデンサ。
JP1988116248U 1988-09-02 1988-09-02 Pending JPH0236024U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988116248U JPH0236024U (ja) 1988-09-02 1988-09-02
US07/400,874 US4959652A (en) 1988-09-02 1989-08-30 Metalized film capacitor and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988116248U JPH0236024U (ja) 1988-09-02 1988-09-02

Publications (1)

Publication Number Publication Date
JPH0236024U true JPH0236024U (ja) 1990-03-08

Family

ID=14682438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988116248U Pending JPH0236024U (ja) 1988-09-02 1988-09-02

Country Status (2)

Country Link
US (1) US4959652A (ja)
JP (1) JPH0236024U (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5357399A (en) * 1992-09-25 1994-10-18 Avx Corporation Mass production method for the manufacture of surface mount solid state capacitor and resulting capacitor
US5912796A (en) * 1996-11-15 1999-06-15 Illinois Tool Works, Inc. Metallized film capacitor and manufacturing process
SE515930C2 (sv) * 2000-01-26 2001-10-29 Abb Ab Kondensator och förfarande för att vid ett kondensatorelement elektriskt sammanbinda elektrodskikt med en anslutningspunkt
US20070084043A1 (en) * 2005-10-14 2007-04-19 Sb Electronics Conductive Adhesive Attachment of Capacitor Terminals
US20100177493A1 (en) * 2009-01-14 2010-07-15 Ming-Hsi Tsou Method for providing a protective film over a capacitor
JP5664574B2 (ja) 2011-03-18 2015-02-04 株式会社村田製作所 積層セラミックコンデンサ
EP3279909B1 (en) * 2015-03-30 2021-08-18 Nippon Chemi-Con Corporation Capacitor and method for manufacturing same
DE102019217976B4 (de) * 2019-08-26 2021-09-02 Wolfgang Westermann Folienkondensator für Leistungselektronik
JP7408975B2 (ja) * 2019-09-19 2024-01-09 Tdk株式会社 セラミック電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753922A (ja) * 1980-09-17 1982-03-31 Nissei Electric Chitsupukondensanoseizohoho
JPS62183105A (ja) * 1986-02-06 1987-08-11 岡谷電機産業株式会社 チツプ型フイルムコンデンサの製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2940161A (en) * 1955-10-11 1960-06-14 Western Electric Co Methods of making encapsulated electrical devices
US3452257A (en) * 1968-03-28 1969-06-24 Vitramon Inc Electrical capacitor
US4102021A (en) * 1975-10-06 1978-07-25 Matsushita Electric Industrial Co., Ltd. Method for making capacitors with plated terminals
US4168520A (en) * 1978-01-06 1979-09-18 Sprague Electric Company, Inc. Monolithic ceramic capacitor with free-flowed protective coating and method for making same
JPS59143314A (ja) * 1983-02-03 1984-08-16 松下電器産業株式会社 フイルムコンデンサ
JPS6037235A (ja) * 1983-08-09 1985-02-26 Mitsubishi Heavy Ind Ltd 中空部品の押し出し加工方法
JPS60192432A (ja) * 1984-03-14 1985-09-30 Sumitomo Electric Ind Ltd 光送信装置
JPS6127223A (ja) * 1984-07-18 1986-02-06 Bridgestone Corp 加硫ゴム製品の製造方法
US4648006A (en) * 1985-03-26 1987-03-03 Illinois Tool Works Inc. Plastic chip capacitor for surface mounting
JPS6230324A (ja) * 1985-07-31 1987-02-09 Toshiba Corp ドライエツチング方法及びドライエツチング装置
JPS62180926A (ja) * 1986-02-03 1987-08-08 三菱電機株式会社 電磁接触器
JPS63107012A (ja) * 1986-10-23 1988-05-12 マルコン電子株式会社 電子部品

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753922A (ja) * 1980-09-17 1982-03-31 Nissei Electric Chitsupukondensanoseizohoho
JPS62183105A (ja) * 1986-02-06 1987-08-11 岡谷電機産業株式会社 チツプ型フイルムコンデンサの製造方法

Also Published As

Publication number Publication date
US4959652A (en) 1990-09-25

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