JPH023544B2 - - Google Patents

Info

Publication number
JPH023544B2
JPH023544B2 JP56138911A JP13891181A JPH023544B2 JP H023544 B2 JPH023544 B2 JP H023544B2 JP 56138911 A JP56138911 A JP 56138911A JP 13891181 A JP13891181 A JP 13891181A JP H023544 B2 JPH023544 B2 JP H023544B2
Authority
JP
Japan
Prior art keywords
probing needle
pellet
pad
incomplete
probing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56138911A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5840836A (ja
Inventor
Nobuo Hashizume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP13891181A priority Critical patent/JPS5840836A/ja
Publication of JPS5840836A publication Critical patent/JPS5840836A/ja
Publication of JPH023544B2 publication Critical patent/JPH023544B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP13891181A 1981-09-03 1981-09-03 半導体装置の製造方法 Granted JPS5840836A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13891181A JPS5840836A (ja) 1981-09-03 1981-09-03 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13891181A JPS5840836A (ja) 1981-09-03 1981-09-03 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5840836A JPS5840836A (ja) 1983-03-09
JPH023544B2 true JPH023544B2 (cs) 1990-01-24

Family

ID=15233017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13891181A Granted JPS5840836A (ja) 1981-09-03 1981-09-03 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5840836A (cs)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758312B2 (ja) * 1987-05-29 1995-06-21 東京エレクトロン株式会社 ウエハプロ−バ
JP4574302B2 (ja) * 2004-09-15 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4615283B2 (ja) * 2004-10-18 2011-01-19 三菱電機株式会社 半導体デバイスの特性測定方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324267A (en) * 1976-08-18 1978-03-06 Nec Corp Production of beam lead type sem iconductor device

Also Published As

Publication number Publication date
JPS5840836A (ja) 1983-03-09

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