JPH0234185B2 - - Google Patents

Info

Publication number
JPH0234185B2
JPH0234185B2 JP56099695A JP9969581A JPH0234185B2 JP H0234185 B2 JPH0234185 B2 JP H0234185B2 JP 56099695 A JP56099695 A JP 56099695A JP 9969581 A JP9969581 A JP 9969581A JP H0234185 B2 JPH0234185 B2 JP H0234185B2
Authority
JP
Japan
Prior art keywords
wiring
chip
lands
connection
finger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56099695A
Other languages
English (en)
Japanese (ja)
Other versions
JPS582037A (ja
Inventor
Takeaki Nakada
Takeo Yoda
Susumu Shibata
Toshuki Iwabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP9969581A priority Critical patent/JPS582037A/ja
Publication of JPS582037A publication Critical patent/JPS582037A/ja
Publication of JPH0234185B2 publication Critical patent/JPH0234185B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP9969581A 1981-06-29 1981-06-29 Ｉｃ等の実装方法 Granted JPS582037A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9969581A JPS582037A (ja) 1981-06-29 1981-06-29 Ｉｃ等の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9969581A JPS582037A (ja) 1981-06-29 1981-06-29 Ｉｃ等の実装方法

Publications (2)

Publication Number Publication Date
JPS582037A JPS582037A (ja) 1983-01-07
JPH0234185B2 true JPH0234185B2 (xx) 1990-08-01

Family

ID=14254178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9969581A Granted JPS582037A (ja) 1981-06-29 1981-06-29 Ｉｃ等の実装方法

Country Status (1)

Country Link
JP (1) JPS582037A (xx)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6034023A (ja) * 1983-08-04 1985-02-21 Oki Electric Ind Co Ltd 半導体チップの基板への実装方法
JPH01201989A (ja) * 1988-02-05 1989-08-14 Semiconductor Energy Lab Co Ltd 絶縁基板上の配線形成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5628110B2 (xx) * 1971-12-28 1981-06-29

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6023853Y2 (ja) * 1979-08-10 1985-07-16 松下電器産業株式会社 ジヤンパ−ケ−ブル

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5628110B2 (xx) * 1971-12-28 1981-06-29

Also Published As

Publication number Publication date
JPS582037A (ja) 1983-01-07

Similar Documents

Publication Publication Date Title
US4254445A (en) Discretionary fly wire chip interconnection
US4150421A (en) Multi-layer printed circuit board
EP0226433B1 (en) High density printed wiring board
JPH0214537A (ja) 注文応等回路、相互接続装置及びその製造方法
JPH01165134A (ja) 注文応答回路
US5095407A (en) Double-sided memory board
KR100443906B1 (ko) 칩 스케일 패키지, 인쇄 회로 기판, 및 인쇄 회로 기판의설계 방법
US7525817B2 (en) Wiring layout of auxiliary wiring package and printed circuit wiring board
US6091089A (en) Semiconductor integrated circuit device
JP2005093575A (ja) 半導体集積回路装置と配線レイアウト方法
US20020003309A1 (en) Semiconductor chip having pads with plural different junction type
US5345098A (en) Master slice integrated circuit device
JPH0234185B2 (xx)
US4746965A (en) Integrated semiconductor circuit device
JPS63161638A (ja) 半導体集積回路の電源配線方法
JPH06326214A (ja) 多層配線構造及びその形成方法
JPH0644122Y2 (ja) ユニバーサル基板
JP4397628B2 (ja) 印刷回路配線板の配線レイアウト構造
JPS5915500Y2 (ja) 半導体記憶装置
JPH02189944A (ja) 半導体集積回路装置
KR101035594B1 (ko) 콘택홀 간을 연결하는 연결부와 비아홀 간을 연결하는연결부가 서로 수직하게 배치된 반도체 집적 소자
JPH0260148A (ja) 半導体集積回路装置
JPH01204374A (ja) プリント配線板の接続部の構造
JPS6260235A (ja) 半導体集積回路装置
JPS6355781B2 (xx)