JPH0234176B2 - - Google Patents

Info

Publication number
JPH0234176B2
JPH0234176B2 JP59276295A JP27629584A JPH0234176B2 JP H0234176 B2 JPH0234176 B2 JP H0234176B2 JP 59276295 A JP59276295 A JP 59276295A JP 27629584 A JP27629584 A JP 27629584A JP H0234176 B2 JPH0234176 B2 JP H0234176B2
Authority
JP
Japan
Prior art keywords
wafer
cassette
camera
comb
push
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59276295A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61154140A (ja
Inventor
Hidekazu Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP27629584A priority Critical patent/JPS61154140A/ja
Publication of JPS61154140A publication Critical patent/JPS61154140A/ja
Publication of JPH0234176B2 publication Critical patent/JPH0234176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP27629584A 1984-12-27 1984-12-27 ウエハロツト読取機 Granted JPS61154140A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27629584A JPS61154140A (ja) 1984-12-27 1984-12-27 ウエハロツト読取機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27629584A JPS61154140A (ja) 1984-12-27 1984-12-27 ウエハロツト読取機

Publications (2)

Publication Number Publication Date
JPS61154140A JPS61154140A (ja) 1986-07-12
JPH0234176B2 true JPH0234176B2 (zh) 1990-08-01

Family

ID=17567455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27629584A Granted JPS61154140A (ja) 1984-12-27 1984-12-27 ウエハロツト読取機

Country Status (1)

Country Link
JP (1) JPS61154140A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0591357U (ja) * 1992-05-15 1993-12-14 道夫 竹迫 フィッシングチェア

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100758691B1 (ko) * 2006-04-20 2007-09-14 세메스 주식회사 웨이퍼 정렬 시스템 및 정렬 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54984A (en) * 1977-06-06 1979-01-06 Nec Corp Containing tool for semiconductor wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54984A (en) * 1977-06-06 1979-01-06 Nec Corp Containing tool for semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0591357U (ja) * 1992-05-15 1993-12-14 道夫 竹迫 フィッシングチェア

Also Published As

Publication number Publication date
JPS61154140A (ja) 1986-07-12

Similar Documents

Publication Publication Date Title
KR900004442B1 (ko) 웨이퍼를 옮겨싣는 장치
EP1028455A2 (en) Cutting-and-transferring system and pellet transferring apparatus
KR20000069465A (ko) 웨이퍼 반송 장치
TW414934B (en) Transfer apparatus and vertical heat-processing system using the same
US7434856B2 (en) Gripper and method of operating the same
JPH0234176B2 (zh)
JPS62195143A (ja) 基板の高速変換装置及び方法
JP3687389B2 (ja) 基板処理装置
JPH06140492A (ja) クラスタ装置
JP4564695B2 (ja) ウェーハカセット並びに半導体ウェーハの搬入方法及び搬出方法
JP2002319559A (ja) 研削装置
JP2945837B2 (ja) 板状体の搬送機構および搬送方法
CN218867064U (zh) 一种用于晶圆存取的存片机
JP2000156391A (ja) 半導体ウェーハ検査装置
JPS6386448A (ja) 半導体ウエハの搬送装置
JP3434014B2 (ja) スタッカロボット
JPH0328559Y2 (zh)
JPH0432343Y2 (zh)
JPH0530022Y2 (zh)
JPH11255324A (ja) トレーへのレンズ装着装置
JPH0538761U (ja) 基板検出装置
JPH0424915A (ja) 搬送装置
JPS61230849A (ja) 研削盤におけるウエハの安定型移送ア−ム
JPH07169817A (ja) 半導体ウエハ搬送装置
JPH01244634A (ja) 半導体ウエハの製造装置