JPH023266Y2 - - Google Patents
Info
- Publication number
- JPH023266Y2 JPH023266Y2 JP14514684U JP14514684U JPH023266Y2 JP H023266 Y2 JPH023266 Y2 JP H023266Y2 JP 14514684 U JP14514684 U JP 14514684U JP 14514684 U JP14514684 U JP 14514684U JP H023266 Y2 JPH023266 Y2 JP H023266Y2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- pins
- solder
- guide hole
- connecting pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14514684U JPH023266Y2 (enrdf_load_html_response) | 1984-09-26 | 1984-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14514684U JPH023266Y2 (enrdf_load_html_response) | 1984-09-26 | 1984-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6161773U JPS6161773U (enrdf_load_html_response) | 1986-04-25 |
| JPH023266Y2 true JPH023266Y2 (enrdf_load_html_response) | 1990-01-25 |
Family
ID=30703403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14514684U Expired JPH023266Y2 (enrdf_load_html_response) | 1984-09-26 | 1984-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH023266Y2 (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5024233B2 (ja) * | 2008-08-19 | 2012-09-12 | トヨタ自動車株式会社 | 電子部品内蔵型コネクタ |
-
1984
- 1984-09-26 JP JP14514684U patent/JPH023266Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6161773U (enrdf_load_html_response) | 1986-04-25 |
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