JPH0231871B2 - - Google Patents

Info

Publication number
JPH0231871B2
JPH0231871B2 JP59039966A JP3996684A JPH0231871B2 JP H0231871 B2 JPH0231871 B2 JP H0231871B2 JP 59039966 A JP59039966 A JP 59039966A JP 3996684 A JP3996684 A JP 3996684A JP H0231871 B2 JPH0231871 B2 JP H0231871B2
Authority
JP
Japan
Prior art keywords
plating
pattern
gold
nickel
photosensitive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59039966A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60183789A (ja
Inventor
Hiromi Ogawa
Yoshiaki Nakagawa
Hitoshi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP3996684A priority Critical patent/JPS60183789A/ja
Publication of JPS60183789A publication Critical patent/JPS60183789A/ja
Publication of JPH0231871B2 publication Critical patent/JPH0231871B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP3996684A 1984-03-01 1984-03-01 半導体搭載用両面プリント配線基板の製造方法 Granted JPS60183789A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3996684A JPS60183789A (ja) 1984-03-01 1984-03-01 半導体搭載用両面プリント配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3996684A JPS60183789A (ja) 1984-03-01 1984-03-01 半導体搭載用両面プリント配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS60183789A JPS60183789A (ja) 1985-09-19
JPH0231871B2 true JPH0231871B2 (enrdf_load_stackoverflow) 1990-07-17

Family

ID=12567692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3996684A Granted JPS60183789A (ja) 1984-03-01 1984-03-01 半導体搭載用両面プリント配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS60183789A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63174384A (ja) * 1987-01-13 1988-07-18 シャープ株式会社 プリント基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5917998B2 (ja) * 1981-05-26 1984-04-24 株式会社東芝 印刷配線板の製造方法

Also Published As

Publication number Publication date
JPS60183789A (ja) 1985-09-19

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term