JPS60183789A - 半導体搭載用両面プリント配線基板の製造方法 - Google Patents
半導体搭載用両面プリント配線基板の製造方法Info
- Publication number
- JPS60183789A JPS60183789A JP3996684A JP3996684A JPS60183789A JP S60183789 A JPS60183789 A JP S60183789A JP 3996684 A JP3996684 A JP 3996684A JP 3996684 A JP3996684 A JP 3996684A JP S60183789 A JPS60183789 A JP S60183789A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- pattern
- gold plating
- gold
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 19
- 239000004065 semiconductor Substances 0.000 title description 5
- 238000007747 plating Methods 0.000 claims description 43
- 229910052737 gold Inorganic materials 0.000 claims description 33
- 239000010931 gold Substances 0.000 claims description 33
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 32
- 238000005530 etching Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 238000009835 boiling Methods 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000013461 design Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241000080590 Niso Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000037213 diet Effects 0.000 description 1
- 235000005911 diet Nutrition 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- -1 gold agate Chemical class 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3996684A JPS60183789A (ja) | 1984-03-01 | 1984-03-01 | 半導体搭載用両面プリント配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3996684A JPS60183789A (ja) | 1984-03-01 | 1984-03-01 | 半導体搭載用両面プリント配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60183789A true JPS60183789A (ja) | 1985-09-19 |
| JPH0231871B2 JPH0231871B2 (enrdf_load_stackoverflow) | 1990-07-17 |
Family
ID=12567692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3996684A Granted JPS60183789A (ja) | 1984-03-01 | 1984-03-01 | 半導体搭載用両面プリント配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60183789A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63174384A (ja) * | 1987-01-13 | 1988-07-18 | シャープ株式会社 | プリント基板の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57194598A (en) * | 1981-05-26 | 1982-11-30 | Tokyo Shibaura Electric Co | Method of producing printed circuit board |
-
1984
- 1984-03-01 JP JP3996684A patent/JPS60183789A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57194598A (en) * | 1981-05-26 | 1982-11-30 | Tokyo Shibaura Electric Co | Method of producing printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63174384A (ja) * | 1987-01-13 | 1988-07-18 | シャープ株式会社 | プリント基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231871B2 (enrdf_load_stackoverflow) | 1990-07-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |