JPH0231800Y2 - - Google Patents
Info
- Publication number
- JPH0231800Y2 JPH0231800Y2 JP1983040887U JP4088783U JPH0231800Y2 JP H0231800 Y2 JPH0231800 Y2 JP H0231800Y2 JP 1983040887 U JP1983040887 U JP 1983040887U JP 4088783 U JP4088783 U JP 4088783U JP H0231800 Y2 JPH0231800 Y2 JP H0231800Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- power supply
- ground
- terminal
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4088783U JPS59146986U (ja) | 1983-03-22 | 1983-03-22 | 多層プリント板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4088783U JPS59146986U (ja) | 1983-03-22 | 1983-03-22 | 多層プリント板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59146986U JPS59146986U (ja) | 1984-10-01 |
| JPH0231800Y2 true JPH0231800Y2 (da) | 1990-08-28 |
Family
ID=30171490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4088783U Granted JPS59146986U (ja) | 1983-03-22 | 1983-03-22 | 多層プリント板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59146986U (da) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136596A (ja) * | 1986-11-27 | 1988-06-08 | イビデン株式会社 | 多層プリント配線板 |
| JP6288910B2 (ja) * | 2012-11-29 | 2018-03-07 | 三菱電機株式会社 | 多層基板、回路基板、情報処理装置、センサー装置、および通信装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5368870A (en) * | 1976-12-01 | 1978-06-19 | Oki Electric Ind Co Ltd | Multilayer board |
| JPS5738199U (da) * | 1980-08-12 | 1982-03-01 |
-
1983
- 1983-03-22 JP JP4088783U patent/JPS59146986U/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5368870A (en) * | 1976-12-01 | 1978-06-19 | Oki Electric Ind Co Ltd | Multilayer board |
| JPS5738199U (da) * | 1980-08-12 | 1982-03-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59146986U (ja) | 1984-10-01 |
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