JPH0228261B2 - - Google Patents
Info
- Publication number
- JPH0228261B2 JPH0228261B2 JP59013719A JP1371984A JPH0228261B2 JP H0228261 B2 JPH0228261 B2 JP H0228261B2 JP 59013719 A JP59013719 A JP 59013719A JP 1371984 A JP1371984 A JP 1371984A JP H0228261 B2 JPH0228261 B2 JP H0228261B2
- Authority
- JP
- Japan
- Prior art keywords
- outer container
- external terminals
- semiconductor device
- insulating substrate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1371984A JPS60157243A (ja) | 1984-01-25 | 1984-01-25 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1371984A JPS60157243A (ja) | 1984-01-25 | 1984-01-25 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60157243A JPS60157243A (ja) | 1985-08-17 |
JPH0228261B2 true JPH0228261B2 (fi) | 1990-06-22 |
Family
ID=11841048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1371984A Granted JPS60157243A (ja) | 1984-01-25 | 1984-01-25 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60157243A (fi) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0342685Y2 (fi) * | 1984-10-12 | 1991-09-06 | ||
JPH0611537Y2 (ja) * | 1989-03-03 | 1994-03-23 | 新電元工業株式会社 | 樹脂封止型電子回路装置 |
JPH0783080B2 (ja) * | 1990-01-18 | 1995-09-06 | 株式会社東芝 | 半導体装置用部品 |
US5285106A (en) * | 1990-01-18 | 1994-02-08 | Kabushiki Kaisha Toshiba | Semiconductor device parts |
DE19719703C5 (de) * | 1997-05-09 | 2005-11-17 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Leistungshalbleitermodul mit Keramiksubstrat |
WO2009081723A1 (ja) | 2007-12-20 | 2009-07-02 | Fuji Electric Device Technology Co., Ltd. | 半導体装置およびその製造方法 |
JP6028592B2 (ja) * | 2013-01-25 | 2016-11-16 | 三菱電機株式会社 | 半導体装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5192064A (fi) * | 1975-02-11 | 1976-08-12 | ||
JPS5412386A (en) * | 1977-06-28 | 1979-01-30 | Teijin Ltd | Isocarbostyril derivative |
JPS5435666A (en) * | 1977-08-25 | 1979-03-15 | Fujitsu Ltd | Timing extraction system |
JPS57177547A (en) * | 1981-04-08 | 1982-11-01 | Thomson Csf | Case for middle output semiconductor element and method of producing same |
JPS587346A (ja) * | 1981-07-07 | 1983-01-17 | 株式会社東海理化電機製作所 | プラスチツク積層体 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56145850U (fi) * | 1980-04-02 | 1981-11-04 |
-
1984
- 1984-01-25 JP JP1371984A patent/JPS60157243A/ja active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5192064A (fi) * | 1975-02-11 | 1976-08-12 | ||
JPS5412386A (en) * | 1977-06-28 | 1979-01-30 | Teijin Ltd | Isocarbostyril derivative |
JPS5435666A (en) * | 1977-08-25 | 1979-03-15 | Fujitsu Ltd | Timing extraction system |
JPS57177547A (en) * | 1981-04-08 | 1982-11-01 | Thomson Csf | Case for middle output semiconductor element and method of producing same |
JPS587346A (ja) * | 1981-07-07 | 1983-01-17 | 株式会社東海理化電機製作所 | プラスチツク積層体 |
Also Published As
Publication number | Publication date |
---|---|
JPS60157243A (ja) | 1985-08-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7122401B2 (en) | Area array type semiconductor package fabrication method | |
US6261865B1 (en) | Multi chip semiconductor package and method of construction | |
US5521429A (en) | Surface-mount flat package semiconductor device | |
JP3425202B2 (ja) | 電子装置パッケージ・アセンブリー | |
TWI272705B (en) | Heat spreader and package structure utilizing the same | |
JP2895920B2 (ja) | 半導体装置及びその製造方法 | |
JPS62202548A (ja) | 半導体装置 | |
JPH0228261B2 (fi) | ||
JPH10335577A (ja) | 半導体装置及びその製造方法 | |
JPH0418694B2 (fi) | ||
JPH0661372A (ja) | ハイブリッドic | |
JPH07176664A (ja) | 半導体装置およびその製造方法 | |
JP3670371B2 (ja) | 半導体装置およびその製造方法 | |
JPH10335366A (ja) | 半導体装置 | |
KR101008534B1 (ko) | 전력용 반도체모듈패키지 및 그 제조방법 | |
JP3295987B2 (ja) | 半導体装置の製造方法 | |
JPH08153826A (ja) | 半導体集積回路装置 | |
KR102371636B1 (ko) | 양면 기판 반도체 제조 방법 | |
JP2975782B2 (ja) | 混成集積回路装置およびこれに用いるケース材 | |
KR900001744B1 (ko) | 반도체장치 | |
JPS6219063B2 (fi) | ||
JPH11260850A (ja) | 半導体装置およびその製造方法 | |
KR20030054066A (ko) | 적층 패키지 및 그 제조 방법 | |
JP4123131B2 (ja) | 半導体装置 | |
JPH0543485Y2 (fi) |