JPH0225245Y2 - - Google Patents
Info
- Publication number
- JPH0225245Y2 JPH0225245Y2 JP1983100322U JP10032283U JPH0225245Y2 JP H0225245 Y2 JPH0225245 Y2 JP H0225245Y2 JP 1983100322 U JP1983100322 U JP 1983100322U JP 10032283 U JP10032283 U JP 10032283U JP H0225245 Y2 JPH0225245 Y2 JP H0225245Y2
- Authority
- JP
- Japan
- Prior art keywords
- portions
- film
- intermediate portion
- hard
- hard substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 30
- 239000010408 film Substances 0.000 description 34
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000007788 liquid Substances 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000013039 cover film Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10032283U JPS609259U (ja) | 1983-06-28 | 1983-06-28 | 印刷配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10032283U JPS609259U (ja) | 1983-06-28 | 1983-06-28 | 印刷配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS609259U JPS609259U (ja) | 1985-01-22 |
| JPH0225245Y2 true JPH0225245Y2 (no) | 1990-07-11 |
Family
ID=30237372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10032283U Granted JPS609259U (ja) | 1983-06-28 | 1983-06-28 | 印刷配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609259U (no) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115083U (no) * | 1979-02-08 | 1980-08-13 | ||
| JPS56154079U (no) * | 1980-04-11 | 1981-11-18 |
-
1983
- 1983-06-28 JP JP10032283U patent/JPS609259U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS609259U (ja) | 1985-01-22 |
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