JPH02244646A - リードワイヤボンディング装置及び方法 - Google Patents

リードワイヤボンディング装置及び方法

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Publication number
JPH02244646A
JPH02244646A JP63102848A JP10284888A JPH02244646A JP H02244646 A JPH02244646 A JP H02244646A JP 63102848 A JP63102848 A JP 63102848A JP 10284888 A JP10284888 A JP 10284888A JP H02244646 A JPH02244646 A JP H02244646A
Authority
JP
Japan
Prior art keywords
vacuum
tape
bonding
chuck
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63102848A
Other languages
English (en)
Other versions
JP2581748B2 (ja
Inventor
Jon Long
ジョン　ロング
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LSI Corp
Original Assignee
LSI Corp
LSI Logic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LSI Corp, LSI Logic Corp filed Critical LSI Corp
Publication of JPH02244646A publication Critical patent/JPH02244646A/ja
Application granted granted Critical
Publication of JP2581748B2 publication Critical patent/JP2581748B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 鼓」すＬ」 本発明は集積回路（ＩＣ）装置の製造に関するものであ
って、更に詳細には電気的信号経路を与える為にリード
ワイヤをＩＣヘボンデイングさせる方法に関するもので
ある。
本顆出願人へ譲渡されている１９８７年１月２８日に出
願された発明者Ｖ、　Ｋ、　５ａｈａｋｉａｎ　ｅｔ　
ａｌ。
の「集積回路用の支持組立体（Ｓｕｐｐｏｒｔ　Ａｓｓ
ｅｍｂｌｙｆｏｒ　Ｉｎｔｅｇｒａｔｅｄ　Ｃ１ｒｃｕ
ｉｔｓ）Ｊという名称の特許出願には、集積回路支持組
立体が開示されている。
この米国特許出願は、ＩＣポンディングパッド及び外部
回路へ接続させる為の内側及び外側リードフィンガを持
った薄い可撓性テープ状構成体と剛性のリードフレーム
とを具備する複合支持組立体を有する集積回路パッケー
ジを記載している。本発明は、上掲した米国特許出願、
に開示されている構成体に適用することが可能なもので
ある。
従来１夏 ＩＣ装置を製造する典型的なプロセスにおいて、その表
面上に形成されているＩＣ論理回路を持つたＩＣダイを
リードフレームのダイ取付はパッドへ取付ける。リード
フレームは、ＩＣ回路のコンタクトポイント即ち接触点
又はボンディングパッドヘボンドされるリードワイヤに
よってＩＣ回路へ接続される多数の導電性の要素乃至は
フィンガーを持っている。多数のワイヤを比較的小さな
寸法のＩＣダイ表面及び取付はパッドヘボンドさせるこ
とが必要である。高速且つ低コストでのＩＣ装置の大量
生産の為の現在のアプローチでは、マイクロコンピュー
タの制御下にある自動化したボンディング装置が使用さ
れる。ワイヤボンディングプロセスを有効に実施する為
には、ワイヤボンディングの点が正確に所定の位置に固
定され、電気的な回路短絡や又はＩＣ要素への誤った接
続がないことが必要である。
ＩＣダイを、例えば上掲した米国特許出願に開示されて
いる様な可撓性テープ状構成体へ取付けた場合、該可撓
性構成体はフロートし且つ震動する傾向となり、従って
ワイヤボンディングプロセス中に、該構成体と共に形成
される導電性要素の正確な固定的位置決めは困難である
。リードフレームへのワイヤボンディングの為の従来の
アプローチは、リードフレームと関連する導電性要素と
を固定した位置に固定する為のウィンドウクランプを使
用する。然し乍ら、可撓性構成体の周辺部へ取付けられ
るウィンドウクランプは、該構成体の内側部分が振動し
たり又は基準面から変位されたりすることを効果的に防
止することはない。従って、空間が制限されており且つ
高速での製造が高度に望まれるＩＣ組立体へワイヤリー
ドをポインディングすることは、効果的な解決法を必要
とする問題を提起する。
且−血 本発明は、以上の点に鑑みなされたものであった、上述
した如き従来技術の欠点を解消し、ワイヤボンディング
プロセスの間にＩＣ装置及びそれの関連した導電性要素
を固定した位置に維持する為の方法及び装置を提供する
ことを目的とする。
且−双 本発明によれば、ＩＣダイ取付はパッドとじて機能する
可撓性テープ状構成体を組み込んだＩＣ装置へリードワ
イヤをポインディングする方法は、該テープ状構成体を
固定した位置に実効的に保持する為の真空手段を使用す
る。該真空手段は、該可撓性テープの表面に渡って実質
的に一様な真空を与え、従って該テープは画定した面に
おいて実質的に精密な位置に保持される。好適実施形態
においては、該真空手段は、該可撓性テープに隣接して
位置されている複数個の一様に分布された真空空洞が形
成されている真空チャックを有している。この様に、リ
ードワイヤの自動化ボンディングを高速且つ低コストで
且つ接続エラー又は電気的短絡の問題も事実上発生させ
ること無しに、実施することが可能である。
来皇負 以下、添付の図面を参考に、本発明の具体的実施の態様
に付いて詳細に説明する。
可撓性テープ状構成体１０は、ダイ取付はバッド１２を
支持しており、その上に集積回路（Ｉ　Ｃ）１３が形成
されている。ボンドワイヤ１４はボンドパッド１５へ電
気的に接続されており、該パッドはＩＣ装置の露出表面
上に形成されている。又、ボンドワイヤ１４はテープ状
構成体上に形成されている内側リードフィンガー１６へ
電気的に接続されている。内側リードフィンガー１６は
、結合用リードボンドと接触すべく延在している外側リ
ードフィンガーへ接続されており、その際に集積回路か
ら外部パッケージリードへの連続的な導電性経路を与え
ている。
非常に密接した状態で離隔されている接続用リードワイ
ヤ１４のボンディングの間、該可撓性構成体は、実質的
に剛性で且つ静止して維持することが必要である０本発
明によれば、第２図に示した如き真空チャック１８を有
する真空組立体が、下部テープ表面に隣接し且つボンド
パッドが位置されている表面に対向して位置されている
。該真空チャックは、支持用ボンド棚３０として機能す
る外側リングによって取り囲まれている中央に位置され
た空洞を持っている。該棚支持体３０はチャンネル２４
によって囲繞されている。真空源２２はチャンネル２４
によって取り囲まれている。
真空源２２は、該真空チャックの本体を介して、中央空
洞２０及びチャンネル２４へ接続されており、従って、
可撓性テープ状構成体が該チャックに対して位置される
場合、該構成体はしっかりと所定の位置に維持される。
テープ状構成体が該真空チャックの表面に平行な実質的
に平担な配向状態で固定されることを確保する為に、複
数個の支持用支柱２８が空洞２０内に設けられている。
支柱２８は、可撓性テープが空洞２０内に引き込まれる
ことを防止している。
支柱２８と、棚３０と、真空チャック１８の面乃至は表
面は、実質的に同一面にあり、従って該可撓性テープは
該真空チャックの表面に渡って平坦に当接する。
ボンディングプロセスの間、真空源２２は部分真空、例
えば２２インチＨｇ　（５５、８８ｃ　ｍ　Ｈｇ）を空
洞２０及びチャンネル２４を介して与え、その際に該テ
ープを剛性的に所定の位置に保持する吸引力を与える。
真空チャックへ隣接して配設されているヒータ２６は金
属チャック１８を加熱する為に使用され、従って熱が導
通されてワイヤをボンドパッド及びリードフィンガーへ
溶接することを可能としている。該熱は、金ワイヤをボ
ンディングの為に使用する場合に使用され、一方アルミ
ニウムを使用する場合には、加熱は必要ではない、該加
熱要素は、好適には、真空チャックとの共通ハウジング
内に配設されているが、効率的な熱交換の為に真空チャ
ックへ隣接して別々に組み立てることも可能である。
好適には自動化されており且つマイクロコンピュータに
よって制御されるポンディングパッド３２は、真空を可
撓性テープ状構成体へ付与される場合に、ボンディング
プロセス中にＩＣダイ上及びテープ状構成体上の精密な
所定の位置にワイヤ１４をボンドさせるべく機能する。
該ボンディング工具はボンド接触点と相対的に移動され
て、ワイヤ１４の端部をリードフィンガーへ又ＩＣ装置
ヘボンドさせる。ワイヤボンディングの完了と共に、真
空を取り除き、テープ及びＩＣｉみ立ての爾後の処理及
びパッケージングを行なうことを可能とする。
本明細書に開示した真空装置は、従来技術のウィンドウ
クランプの場合に発生していた様なＩＣポンディングパ
ッドが位置されているテープ状構成体がワイヤボンディ
ングの間に移動したり又はシフトしたりしないことを確
保している。該クランプは、テープ構成体に対して一様
な分布した保持力を与えるものではなく、従って該構成
体はボンディングプロセスの間に、遊動したり移動した
りする傾向があった。更に、本真空装置は、従来技術の
クランプの場合には必要とされていた如き、手作業の組
み立て及び分解を排除しており、その際に労賃を節約す
ることを可能としている。このタイプのＩＣ組立体の大
量生産の為には、このワイヤボンディングのアプローチ
で歩留は著しく改善される。
以上、本発明の具体的実施の態様に付いて詳細に説明し
たが１本発明はこれら具体例にのみ限定されるべきもの
では無く、本発明の技術的範囲を逸脱すること無しに種
々の変形が可能であることは勿論である。
【図面の簡単な説明】
第１図は集積回路が位置されている可撓性テープ状構成
体の概略図、第２図は適切なワイヤボンディングを行な
わせる為に可撓性テープ状構成体をしっかりと支える為
の本発明において使用される如き真空手段を示した説明
図、である。 （符号の説明） １０：可撓性テープ状構成体 １２：ダイ取付はパッド １３：ＩＣ １４：ボンドワイヤ １５：ボンドパッド １６：内側リードフィンガー １８：真空チャック ２０：中央空度 ２２：真空源 ２４：チャンネル ２８：支持用支柱 ３０：支持用ボンド棚

Claims (1)

  1. 【特許請求の範囲】 １、集積回路装置のリードワイヤのボンディング装置に
    おいて、可撓テープ状構成体、前記テープ状構成体に取
    付けたダイの１表面上に形成した集積回路、前記集積回
    路及び前記テープ状構成体の電気的接触点へリードワイ
    ヤをボンディングする間に前記テープ状構成体を実質的
    に固定位置に維持する真空手段、を有することを特徴と
    する装置。 ２、特許請求の範囲第１項において、前記リードワイヤ
    を前記接触点へ接続する為のボンディング手段を有して
    おり、前記リードワイヤを画定した位置に精密にボンド
    させることを特徴とする装置。 ３、特許請求の範囲第１項において、前記真空手段は、
    真空チャックと、前記テープを固定位置に保持する為の
    前記チャックの１表面内の複数個の真空空洞とを有する
    ことを特徴とする装置。 ４、特許請求の範囲第３項において、前記真空チャック
    は、中央空洞と、前記中央空洞を取り囲む支持棚と、前
    記棚を包囲するチャンネルとによって構成されているこ
    とを特徴とする装置。 ５、特許請求の範囲第４項において、前記中央空洞内に
    配設されている支持支柱を有することを特徴とする装置
    。 ６、特許請求の範囲第５項において、前記支持支柱の上
    表面と、前記支持棚と、前記チャックの前記１表面とは
    実質的に同一面であることを特徴とする装置。 ７、特許請求の範囲第３項において、前記真空チャック
    と熱交換関係で配設されたヒータを有することを特徴と
    する装置。 ８、特許請求の範囲第１項において、前記真空手段は、
    前記真空チャックへ接続した真空源を有しており、且つ
    前記真空源はボンディングプロセス中に約２２インチＨ
    ｇの部分真空を与えることを特徴とする装置。 ９、特許請求の範囲第１項において、前記ボンディング
    手段を制御する為のマイクロプロセサを有することを特
    徴とする装置。 １０、可撓性テープ状構成体上に支持された集積回路装
    置のリードワイヤをボンディングする方法において、真
    空空洞と真空チャンネル及び前記空洞と前記チャンネル
    に隣接して配設された支持要素を持った真空チャックへ
    前記テープ状構成体を隣接して位置させ、前記テープ状
    構成体は実質的に平担な配向状態で固定的に保持される
    様に前記テープ状構成体の表面に渡って一様な吸引力を
    発生させる為に前記真空チャックへ部分真空を与える、
    上記各ステップを有することを特徴とする方法。 １１、特許請求の範囲第１０項において、前記集積回路
    装置へ金ワイヤをボンディングする為に前記真空チャッ
    クを加熱するステップを有することを特徴とする方法。
JP10284888A 1987-04-29 1988-04-27 リードワイヤボンディング装置及び方法 Expired - Lifetime JP2581748B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/043,894 US4790897A (en) 1987-04-29 1987-04-29 Device for bonding of lead wires for an integrated circuit device
US43,894 1987-04-29

Publications (2)

Publication Number Publication Date
JPH02244646A true JPH02244646A (ja) 1990-09-28
JP2581748B2 JP2581748B2 (ja) 1997-02-12

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Application Number Title Priority Date Filing Date
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US (1) US4790897A (ja)
EP (1) EP0289102B1 (ja)
JP (1) JP2581748B2 (ja)
KR (1) KR880013244A (ja)
DE (1) DE3887770T2 (ja)

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US8752751B2 (en) * 2012-07-13 2014-06-17 Asm Technology Singapore Pte Ltd Lead frame support plate and window clamp for wire bonding machines
EP3502806A1 (de) 2017-12-22 2019-06-26 Siemens Aktiengesellschaft Verfahren zum schutz der produktionsdaten zur herstellung eines produkts
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US7335529B2 (en) 2002-04-10 2008-02-26 Renesas Technology Corp. Manufacturing method of a semiconductor device utilizing a flexible adhesive tape

Also Published As

Publication number Publication date
DE3887770T2 (de) 1994-06-23
EP0289102A2 (en) 1988-11-02
US4790897A (en) 1988-12-13
JP2581748B2 (ja) 1997-02-12
EP0289102A3 (en) 1990-09-26
DE3887770D1 (de) 1994-03-24
EP0289102B1 (en) 1994-02-16
KR880013244A (ko) 1988-11-30

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