JPH022290B2 - - Google Patents

Info

Publication number
JPH022290B2
JPH022290B2 JP60250481A JP25048185A JPH022290B2 JP H022290 B2 JPH022290 B2 JP H022290B2 JP 60250481 A JP60250481 A JP 60250481A JP 25048185 A JP25048185 A JP 25048185A JP H022290 B2 JPH022290 B2 JP H022290B2
Authority
JP
Japan
Prior art keywords
circuit board
bonded
copper circuit
aln
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60250481A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62111452A (ja
Inventor
Masaru Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP60250481A priority Critical patent/JPS62111452A/ja
Publication of JPS62111452A publication Critical patent/JPS62111452A/ja
Publication of JPH022290B2 publication Critical patent/JPH022290B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP60250481A 1985-11-08 1985-11-08 半導体素子塔載用回路基板 Granted JPS62111452A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60250481A JPS62111452A (ja) 1985-11-08 1985-11-08 半導体素子塔載用回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60250481A JPS62111452A (ja) 1985-11-08 1985-11-08 半導体素子塔載用回路基板

Publications (2)

Publication Number Publication Date
JPS62111452A JPS62111452A (ja) 1987-05-22
JPH022290B2 true JPH022290B2 (enExample) 1990-01-17

Family

ID=17208495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60250481A Granted JPS62111452A (ja) 1985-11-08 1985-11-08 半導体素子塔載用回路基板

Country Status (1)

Country Link
JP (1) JPS62111452A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0174746B1 (ko) * 1989-06-26 1999-02-01 고스기 노부미쓰 반도체칩의 배선구조

Also Published As

Publication number Publication date
JPS62111452A (ja) 1987-05-22

Similar Documents

Publication Publication Date Title
US5902959A (en) Lead frame with waffled front and rear surfaces
JP3333409B2 (ja) 半導体モジュール
JPH0455339B2 (enExample)
JP4226200B2 (ja) 半導体装置およびその製造方法
JP2504610B2 (ja) 電力用半導体装置
JPS62128533A (ja) はんだプリフオ−ム及びその使用方法
JP2002009217A (ja) 樹脂封止型半導体装置
JP4219524B2 (ja) 半導体素子用パッケージ
JPH10144967A (ja) 冷却用熱電素子モジュール
JPH022290B2 (enExample)
JP2000277557A (ja) 半導体装置
JPH07105460B2 (ja) 半導体装置
US5998239A (en) Method of manufacturing a semiconductor device with a brazing mount
JPH0677631A (ja) チップ部品のアルミ基板への実装方法
JP2570626B2 (ja) 基板の接続構造及びその接続方法
JP6930317B2 (ja) 端子ピンの接合方法及び接合用冶具
JP2576531B2 (ja) ハイブリッドｉｃ
JPH1123656A (ja) フリップチップｉｃの検査方法及び検査用基板
CN115249620B (zh) 具复数功率元件电源模块的间隔加压结合法
JPH0226058A (ja) 混成集積回路用ヒートシンク
JPH0344414B2 (enExample)
JPH04152558A (ja) 圧接型半導体装置
JPH051079Y2 (enExample)
JP2007067349A (ja) 圧接型半導体装置
JP2001060606A (ja) フリップチップ実装構造