JPH0222822A - 半導体基板の製造方法 - Google Patents

半導体基板の製造方法

Info

Publication number
JPH0222822A
JPH0222822A JP63173145A JP17314588A JPH0222822A JP H0222822 A JPH0222822 A JP H0222822A JP 63173145 A JP63173145 A JP 63173145A JP 17314588 A JP17314588 A JP 17314588A JP H0222822 A JPH0222822 A JP H0222822A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor substrate
abrasive grains
sphere
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63173145A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0529307B2 (https=
Inventor
Sueo Sakata
坂田　季男
Yasunori Oka
岡　安則
Toshio Narutomi
成富　俊雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KYUSHU ELECTRON METAL CO Ltd
Osaka Titanium Co Ltd
Original Assignee
KYUSHU ELECTRON METAL CO Ltd
Osaka Titanium Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KYUSHU ELECTRON METAL CO Ltd, Osaka Titanium Co Ltd filed Critical KYUSHU ELECTRON METAL CO Ltd
Priority to JP63173145A priority Critical patent/JPH0222822A/ja
Priority to DE3922563A priority patent/DE3922563A1/de
Priority to US07/377,276 priority patent/US5051375A/en
Publication of JPH0222822A publication Critical patent/JPH0222822A/ja
Publication of JPH0529307B2 publication Critical patent/JPH0529307B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/124—Preparing bulk and homogeneous wafers by processing the backside of the wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/03—Gettering within semiconductor bodies within silicon bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/024—Defect control-gettering and annealing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/06—Gettering

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP63173145A 1988-07-11 1988-07-11 半導体基板の製造方法 Granted JPH0222822A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP63173145A JPH0222822A (ja) 1988-07-11 1988-07-11 半導体基板の製造方法
DE3922563A DE3922563A1 (de) 1988-07-11 1989-07-08 Verfahren zur herstellung eines halbleiter-wafers
US07/377,276 US5051375A (en) 1988-07-11 1989-07-10 Method of producing semiconductor wafer through gettering using spherical abrasives

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63173145A JPH0222822A (ja) 1988-07-11 1988-07-11 半導体基板の製造方法

Publications (2)

Publication Number Publication Date
JPH0222822A true JPH0222822A (ja) 1990-01-25
JPH0529307B2 JPH0529307B2 (https=) 1993-04-30

Family

ID=15954945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63173145A Granted JPH0222822A (ja) 1988-07-11 1988-07-11 半導体基板の製造方法

Country Status (3)

Country Link
US (1) US5051375A (https=)
JP (1) JPH0222822A (https=)
DE (1) DE3922563A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013235876A (ja) * 2012-05-02 2013-11-21 Disco Abrasive Syst Ltd ウエーハの加工方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401319A (en) * 1992-08-27 1995-03-28 Applied Materials, Inc. Lid and door for a vacuum chamber and pretreatment therefor
JP2719113B2 (ja) * 1994-05-24 1998-02-25 信越半導体株式会社 単結晶シリコンウェーハの歪付け方法
US5426061A (en) * 1994-09-06 1995-06-20 Midwest Research Institute Impurity gettering in semiconductors
JP3264367B2 (ja) * 1998-10-14 2002-03-11 信越半導体株式会社 サンドブラスト処理剤、それを用いて処理されたウェーハ及びその処理方法
US6406923B1 (en) * 2000-07-31 2002-06-18 Kobe Precision Inc. Process for reclaiming wafer substrates
CN119282926A (zh) * 2024-11-26 2025-01-10 浙江大学杭州国际科创中心 一种石英部件表面热性能的修复方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338593A (en) * 1976-09-13 1978-04-08 Katsuji Shimizu Feed for culturing fishes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038786A (en) * 1974-09-27 1977-08-02 Lockheed Aircraft Corporation Sandblasting with pellets of material capable of sublimation
US4525239A (en) * 1984-04-23 1985-06-25 Hewlett-Packard Company Extrinsic gettering of GaAs wafers for MESFETS and integrated circuits
DE3738344A1 (de) * 1986-11-14 1988-05-26 Mitsubishi Electric Corp Anlage zum einfuehren von gitterstoerstellen und verfahren dazu
DE3844649C2 (https=) * 1987-06-23 1992-04-23 Taiyo Sanso Co. Ltd., Osaka, Jp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5338593A (en) * 1976-09-13 1978-04-08 Katsuji Shimizu Feed for culturing fishes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013235876A (ja) * 2012-05-02 2013-11-21 Disco Abrasive Syst Ltd ウエーハの加工方法

Also Published As

Publication number Publication date
DE3922563A1 (de) 1990-01-18
DE3922563C2 (https=) 1991-11-07
JPH0529307B2 (https=) 1993-04-30
US5051375A (en) 1991-09-24

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