JPH0219976B2 - - Google Patents

Info

Publication number
JPH0219976B2
JPH0219976B2 JP56185357A JP18535781A JPH0219976B2 JP H0219976 B2 JPH0219976 B2 JP H0219976B2 JP 56185357 A JP56185357 A JP 56185357A JP 18535781 A JP18535781 A JP 18535781A JP H0219976 B2 JPH0219976 B2 JP H0219976B2
Authority
JP
Japan
Prior art keywords
pattern
patterns
recognition mark
substrate
position recognition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56185357A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5887838A (ja
Inventor
Kunio Kobayashi
Koichi Yokobori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd filed Critical Hitachi Ltd
Priority to JP56185357A priority Critical patent/JPS5887838A/ja
Publication of JPS5887838A publication Critical patent/JPS5887838A/ja
Publication of JPH0219976B2 publication Critical patent/JPH0219976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H10W46/301—
    • H10W46/607—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/754—

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Control Of Position Or Direction (AREA)
JP56185357A 1981-11-20 1981-11-20 位置認識方法 Granted JPS5887838A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56185357A JPS5887838A (ja) 1981-11-20 1981-11-20 位置認識方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56185357A JPS5887838A (ja) 1981-11-20 1981-11-20 位置認識方法

Publications (2)

Publication Number Publication Date
JPS5887838A JPS5887838A (ja) 1983-05-25
JPH0219976B2 true JPH0219976B2 (index.php) 1990-05-07

Family

ID=16169367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56185357A Granted JPS5887838A (ja) 1981-11-20 1981-11-20 位置認識方法

Country Status (1)

Country Link
JP (1) JPS5887838A (index.php)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770551B2 (ja) * 1986-02-20 1995-07-31 ロ−ム株式会社 半導体チツプのダイボンデイング位置確認方法
JPS63155733A (ja) * 1986-12-19 1988-06-28 Fujitsu General Ltd 半導体チツプの装填方法
JP2512827B2 (ja) * 1990-08-31 1996-07-03 松下電器産業株式会社 プリント基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146242A (en) * 1980-04-16 1981-11-13 Hitachi Ltd Positioning method of bonding position at fixed position on substrate

Also Published As

Publication number Publication date
JPS5887838A (ja) 1983-05-25

Similar Documents

Publication Publication Date Title
JPH0219976B2 (index.php)
JPH09162510A (ja) 印刷回路基板および検査方法
JP2871696B2 (ja) 集積回路装置
JPH05335438A (ja) リードレスチップキャリア
JPWO1997050121A1 (ja) フィルムキャリアへの導体パターンの転写方法及びそれに用いるマスク並びにフィルムキャリア
JPH0770856B2 (ja) 混成集積回路基板の位置検出方法
JPH065729A (ja) プリント配線板および半導体素子の位置合わせ方法
JPH02122590A (ja) 部品の位置決め装置
JPH0687472B2 (ja) フィルムキャリアテープ
JPH09214079A (ja) 配線基板
JP2002280681A (ja) 部品実装基板の製造方法、およびプリント配線板
JPS6155931A (ja) 厚膜混成集積回路装置の製造方法
JP2645516B2 (ja) アイマークを備えたプリント配線板及びその製造方法
JPH05291735A (ja) プリント配線基板
JPH06326446A (ja) 基板の製造方法及び基板
JP3119222B2 (ja) Ｔｃｐ用テープ及びその製造方法並びにそのｔｃｐ用テープを用いた半導体装置
JPS60121793A (ja) 厚膜混成集積回路基板の製造方法
JPH0613741A (ja) 表面実装部品用回路基板
JPH0119396Y2 (index.php)
JPS63164291A (ja) フレキシブルプリント配線板
JPH11191598A (ja) 半導体装置及びその製造方法
JPH0964495A (ja) 位置認識マーク付配線基板および配線基板の位置認識方法
CN120085495A (zh) 一种阵列基板、显示面板及显示装置
JP3528366B2 (ja) 集積回路装置
JPH08255969A (ja) プリント基板装置