JPH0216234B2 - - Google Patents
Info
- Publication number
- JPH0216234B2 JPH0216234B2 JP57160220A JP16022082A JPH0216234B2 JP H0216234 B2 JPH0216234 B2 JP H0216234B2 JP 57160220 A JP57160220 A JP 57160220A JP 16022082 A JP16022082 A JP 16022082A JP H0216234 B2 JPH0216234 B2 JP H0216234B2
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- base material
- adhesive
- card base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000002313 adhesive film Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 239000004593 Epoxy Substances 0.000 description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000004382 potting Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57160220A JPS5948984A (ja) | 1982-09-13 | 1982-09-13 | Ｉｃカ−ドの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57160220A JPS5948984A (ja) | 1982-09-13 | 1982-09-13 | Ｉｃカ−ドの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948984A JPS5948984A (ja) | 1984-03-21 |
| JPH0216234B2 true JPH0216234B2 (fr) | 1990-04-16 |
Family
ID=15710316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57160220A Granted JPS5948984A (ja) | 1982-09-13 | 1982-09-13 | Ｉｃカ−ドの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948984A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6913057B2 (en) | 2001-10-19 | 2005-07-05 | Nissei Plastic Industrial Co., Ltd. | IC-card manufacturing apparatus |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6175986A (ja) * | 1984-09-21 | 1986-04-18 | Tokyo Jiki Insatsu Kk | 集積回路素子装着媒体 |
| JPS62201296A (ja) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Ｉｃカ−ドおよびその製造方法 |
| JPS62201295A (ja) * | 1986-02-28 | 1987-09-04 | 松下電器産業株式会社 | Ｉｃカ−ドおよびその製造方法 |
| JPH07123182B2 (ja) * | 1986-05-20 | 1995-12-25 | 日立マクセル株式会社 | 半導体装置 |
| JP2562476B2 (ja) * | 1987-06-11 | 1996-12-11 | 大日本印刷株式会社 | １ｃカードの製造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54145506A (en) * | 1978-05-08 | 1979-11-13 | Tokyo Jiki Insatsu Kk | Method of fabricating magnetic card |
| JPS5556639A (en) * | 1978-10-19 | 1980-04-25 | Cii | Strip for carrying device for processing electric signal and method of manufacturing same |
| JPS5580831A (en) * | 1978-12-11 | 1980-06-18 | Tokyo Jiki Insatsu Kk | Manufacture of magnetic card |
| JPS5752977A (en) * | 1980-08-07 | 1982-03-29 | Gao Ges Automation Org | Identifying card and method of producing same |
-
1982
- 1982-09-13 JP JP57160220A patent/JPS5948984A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54145506A (en) * | 1978-05-08 | 1979-11-13 | Tokyo Jiki Insatsu Kk | Method of fabricating magnetic card |
| JPS5556639A (en) * | 1978-10-19 | 1980-04-25 | Cii | Strip for carrying device for processing electric signal and method of manufacturing same |
| JPS5580831A (en) * | 1978-12-11 | 1980-06-18 | Tokyo Jiki Insatsu Kk | Manufacture of magnetic card |
| JPS5752977A (en) * | 1980-08-07 | 1982-03-29 | Gao Ges Automation Org | Identifying card and method of producing same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6913057B2 (en) | 2001-10-19 | 2005-07-05 | Nissei Plastic Industrial Co., Ltd. | IC-card manufacturing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5948984A (ja) | 1984-03-21 |
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