JPH0215632B2 - - Google Patents
Info
- Publication number
- JPH0215632B2 JPH0215632B2 JP58145089A JP14508983A JPH0215632B2 JP H0215632 B2 JPH0215632 B2 JP H0215632B2 JP 58145089 A JP58145089 A JP 58145089A JP 14508983 A JP14508983 A JP 14508983A JP H0215632 B2 JPH0215632 B2 JP H0215632B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- load lock
- substrate holder
- container
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 113
- 239000010409 thin film Substances 0.000 claims description 57
- 238000003860 storage Methods 0.000 claims description 24
- 238000012545 processing Methods 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 91
- 238000004544 sputter deposition Methods 0.000 description 17
- 238000003780 insertion Methods 0.000 description 15
- 230000037431 insertion Effects 0.000 description 15
- 239000000428 dust Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14508983A JPS6039162A (ja) | 1983-08-10 | 1983-08-10 | 薄膜処理真空装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14508983A JPS6039162A (ja) | 1983-08-10 | 1983-08-10 | 薄膜処理真空装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6039162A JPS6039162A (ja) | 1985-02-28 |
| JPH0215632B2 true JPH0215632B2 (ko) | 1990-04-12 |
Family
ID=15377122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14508983A Granted JPS6039162A (ja) | 1983-08-10 | 1983-08-10 | 薄膜処理真空装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6039162A (ko) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07105345B2 (ja) * | 1985-08-08 | 1995-11-13 | 日電アネルバ株式会社 | 基体処理装置 |
| US4647361A (en) * | 1985-09-03 | 1987-03-03 | International Business Machines Corporation | Sputtering apparatus |
| JPH064587Y2 (ja) * | 1987-01-29 | 1994-02-02 | 日電アネルバ株式会社 | 縦型バイアススパツタリング装置の基板ホルダ− |
| JPH0689442B2 (ja) * | 1987-06-05 | 1994-11-09 | 新明和工業株式会社 | 真空蒸着装置 |
| JPS6487768A (en) * | 1987-09-29 | 1989-03-31 | Hitachi Ltd | Multifunction vacuum plating device |
| GB9405442D0 (en) * | 1994-03-19 | 1994-05-04 | Applied Vision Ltd | Apparatus for coating substrates |
| GB0127251D0 (en) * | 2001-11-13 | 2002-01-02 | Nordiko Ltd | Apparatus |
| JP2006233275A (ja) * | 2005-02-24 | 2006-09-07 | Japan Science & Technology Agency | 薄膜形成装置 |
| JP5026715B2 (ja) * | 2006-03-17 | 2012-09-19 | 株式会社アルバック | 金属とＳｉＯ２の混合膜の成膜方法 |
| TWI638758B (zh) * | 2015-12-17 | 2018-10-21 | 日商愛發科股份有限公司 | 真空處理裝置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51111482A (en) * | 1975-03-26 | 1976-10-01 | Hitachi Ltd | Sample table for surface treatment apparatus |
-
1983
- 1983-08-10 JP JP14508983A patent/JPS6039162A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51111482A (en) * | 1975-03-26 | 1976-10-01 | Hitachi Ltd | Sample table for surface treatment apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6039162A (ja) | 1985-02-28 |
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