JPH0214810B2 - - Google Patents
Info
- Publication number
- JPH0214810B2 JPH0214810B2 JP57104639A JP10463982A JPH0214810B2 JP H0214810 B2 JPH0214810 B2 JP H0214810B2 JP 57104639 A JP57104639 A JP 57104639A JP 10463982 A JP10463982 A JP 10463982A JP H0214810 B2 JPH0214810 B2 JP H0214810B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- elements
- terminal
- terminals
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
- H01L27/013—Thick-film circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H5/00—One-port networks comprising only passive electrical elements as network components
- H03H5/02—One-port networks comprising only passive electrical elements as network components without voltage- or current-dependent elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1775—Parallel LC in shunt or branch path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57104639A JPS58220513A (ja) | 1982-06-16 | 1982-06-16 | 電子部品 |
US06/504,238 US4591814A (en) | 1982-06-16 | 1983-06-14 | Electronic component comprising printed circuit elements disposed on a folded tape and method of making such component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57104639A JPS58220513A (ja) | 1982-06-16 | 1982-06-16 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58220513A JPS58220513A (ja) | 1983-12-22 |
JPH0214810B2 true JPH0214810B2 (US20100223739A1-20100909-C00005.png) | 1990-04-10 |
Family
ID=14386015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57104639A Granted JPS58220513A (ja) | 1982-06-16 | 1982-06-16 | 電子部品 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4591814A (US20100223739A1-20100909-C00005.png) |
JP (1) | JPS58220513A (US20100223739A1-20100909-C00005.png) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4894629A (en) * | 1986-03-04 | 1990-01-16 | Murata Manufacturing Co., Ltd. | Bandpass filter having magnetically coupled resonators |
US4754242A (en) * | 1986-03-04 | 1988-06-28 | Murata Manufacturing Co., Ltd. | Resonator |
JPS62233913A (ja) * | 1986-04-03 | 1987-10-14 | Toko Inc | 遅延線 |
JPS62269509A (ja) * | 1986-05-19 | 1987-11-24 | Derufuai:Kk | 遅延線並びにその製造方法 |
CA1294117C (en) * | 1986-09-29 | 1992-01-14 | S. Eugene Benge | Method of making deactivatable tags |
US4717438A (en) * | 1986-09-29 | 1988-01-05 | Monarch Marking Systems, Inc. | Method of making tags |
JPS6427305A (en) * | 1987-07-22 | 1989-01-30 | Murata Manufacturing Co | Lc filter |
US4855872A (en) * | 1987-08-13 | 1989-08-08 | General Electric Company | Leadless ceramic chip carrier printed wiring board adapter |
JP2600918B2 (ja) * | 1989-08-16 | 1997-04-16 | 株式会社村田製作所 | バンドパスフィルタ |
US5345205A (en) * | 1990-04-05 | 1994-09-06 | General Electric Company | Compact high density interconnected microwave system |
JP2553752Y2 (ja) * | 1990-07-25 | 1997-11-12 | 株式会社タムラ製作所 | ノイズフィルタ |
US5126714A (en) * | 1990-12-20 | 1992-06-30 | The United States Of America As Represented By The Secretary Of The Navy | Integrated circuit transformer |
JP3073035B2 (ja) * | 1991-02-21 | 2000-08-07 | 毅 池田 | Lcノイズフィルタ |
US5231078A (en) * | 1991-09-05 | 1993-07-27 | Ael Defense Corp. | Thin film superconducting LC network |
AU4804493A (en) * | 1992-08-07 | 1994-03-03 | Thinking Machines Corporation | Massively parallel computer including auxiliary vector processor |
US5844451A (en) * | 1994-02-25 | 1998-12-01 | Murphy; Michael T. | Circuit element having at least two physically separated coil-layers |
US5494458A (en) * | 1994-02-25 | 1996-02-27 | The Whitaker Corporation | Ultra-low profile matable electrical connector assembly |
US6549176B2 (en) | 2001-08-15 | 2003-04-15 | Moore North America, Inc. | RFID tag having integral electrical bridge and method of assembling the same |
US7548138B2 (en) * | 2005-09-29 | 2009-06-16 | Intel Corporation | Compact integration of LC resonators |
US20080309431A1 (en) * | 2007-06-15 | 2008-12-18 | City University Of Hong Kong | Planar emi filter |
US8120445B2 (en) * | 2007-06-15 | 2012-02-21 | City University Of Hong Kong | Planar EMI filter comprising coreless spiral planar windings |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3002260A (en) * | 1961-10-03 | shortt etal | ||
US2874360A (en) * | 1959-02-17 | Eisler | ||
US2943966A (en) * | 1953-12-30 | 1960-07-05 | Int Standard Electric Corp | Printed electrical circuits |
US3560904A (en) * | 1968-04-19 | 1971-02-02 | Rolamite Technology Inc | Electric coils |
US3689684A (en) * | 1971-02-05 | 1972-09-05 | Du Pont | Lead frame connector and electronic packages containing same |
US4342143A (en) * | 1974-02-04 | 1982-08-03 | Jennings Thomas A | Method of making multiple electrical components in integrated microminiature form |
CH601960A5 (en) * | 1974-12-06 | 1978-07-14 | Siemens Ag | Terminal mounting for rectangular circuit substrate |
US4298848A (en) * | 1978-12-22 | 1981-11-03 | Jelmax Co., Ltd. | Feeding device for printed circuit board and feeding element |
NL7900244A (nl) * | 1979-01-12 | 1980-07-15 | Philips Nv | Vlakke tweelaags electrische spoel. |
NL7900245A (nl) * | 1979-01-12 | 1980-07-15 | Philips Nv | Tweelaags vlakke electrische spoel met aftakking. |
US4369557A (en) * | 1980-08-06 | 1983-01-25 | Jan Vandebult | Process for fabricating resonant tag circuit constructions |
-
1982
- 1982-06-16 JP JP57104639A patent/JPS58220513A/ja active Granted
-
1983
- 1983-06-14 US US06/504,238 patent/US4591814A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS58220513A (ja) | 1983-12-22 |
US4591814A (en) | 1986-05-27 |
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