JPH0213948B2 - - Google Patents
Info
- Publication number
- JPH0213948B2 JPH0213948B2 JP58227918A JP22791883A JPH0213948B2 JP H0213948 B2 JPH0213948 B2 JP H0213948B2 JP 58227918 A JP58227918 A JP 58227918A JP 22791883 A JP22791883 A JP 22791883A JP H0213948 B2 JPH0213948 B2 JP H0213948B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- thick film
- layer
- forming
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10D64/011—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electrodes Of Semiconductors (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58227918A JPS60120518A (ja) | 1983-12-02 | 1983-12-02 | 導体層の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58227918A JPS60120518A (ja) | 1983-12-02 | 1983-12-02 | 導体層の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60120518A JPS60120518A (ja) | 1985-06-28 |
| JPH0213948B2 true JPH0213948B2 (enExample) | 1990-04-05 |
Family
ID=16868335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58227918A Granted JPS60120518A (ja) | 1983-12-02 | 1983-12-02 | 導体層の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60120518A (enExample) |
-
1983
- 1983-12-02 JP JP58227918A patent/JPS60120518A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60120518A (ja) | 1985-06-28 |
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