JPS60120518A - 導体層の形成方法 - Google Patents

導体層の形成方法

Info

Publication number
JPS60120518A
JPS60120518A JP58227918A JP22791883A JPS60120518A JP S60120518 A JPS60120518 A JP S60120518A JP 58227918 A JP58227918 A JP 58227918A JP 22791883 A JP22791883 A JP 22791883A JP S60120518 A JPS60120518 A JP S60120518A
Authority
JP
Japan
Prior art keywords
pattern
layer
film
thick
metallo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58227918A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0213948B2 (enExample
Inventor
Chikao Ikeda
周穂 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP58227918A priority Critical patent/JPS60120518A/ja
Publication of JPS60120518A publication Critical patent/JPS60120518A/ja
Publication of JPH0213948B2 publication Critical patent/JPH0213948B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10D64/011—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP58227918A 1983-12-02 1983-12-02 導体層の形成方法 Granted JPS60120518A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58227918A JPS60120518A (ja) 1983-12-02 1983-12-02 導体層の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58227918A JPS60120518A (ja) 1983-12-02 1983-12-02 導体層の形成方法

Publications (2)

Publication Number Publication Date
JPS60120518A true JPS60120518A (ja) 1985-06-28
JPH0213948B2 JPH0213948B2 (enExample) 1990-04-05

Family

ID=16868335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58227918A Granted JPS60120518A (ja) 1983-12-02 1983-12-02 導体層の形成方法

Country Status (1)

Country Link
JP (1) JPS60120518A (enExample)

Also Published As

Publication number Publication date
JPH0213948B2 (enExample) 1990-04-05

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