JPH021368B2 - - Google Patents

Info

Publication number
JPH021368B2
JPH021368B2 JP59039450A JP3945084A JPH021368B2 JP H021368 B2 JPH021368 B2 JP H021368B2 JP 59039450 A JP59039450 A JP 59039450A JP 3945084 A JP3945084 A JP 3945084A JP H021368 B2 JPH021368 B2 JP H021368B2
Authority
JP
Japan
Prior art keywords
lead
thin film
exterior
film
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59039450A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60182729A (ja
Inventor
Tetsuya Hojo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP59039450A priority Critical patent/JPS60182729A/ja
Publication of JPS60182729A publication Critical patent/JPS60182729A/ja
Publication of JPH021368B2 publication Critical patent/JPH021368B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59039450A 1984-02-29 1984-02-29 半導体パッケージ組立工程でのバリ除去兼外装処理方法 Granted JPS60182729A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59039450A JPS60182729A (ja) 1984-02-29 1984-02-29 半導体パッケージ組立工程でのバリ除去兼外装処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59039450A JPS60182729A (ja) 1984-02-29 1984-02-29 半導体パッケージ組立工程でのバリ除去兼外装処理方法

Publications (2)

Publication Number Publication Date
JPS60182729A JPS60182729A (ja) 1985-09-18
JPH021368B2 true JPH021368B2 (enExample) 1990-01-11

Family

ID=12553364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59039450A Granted JPS60182729A (ja) 1984-02-29 1984-02-29 半導体パッケージ組立工程でのバリ除去兼外装処理方法

Country Status (1)

Country Link
JP (1) JPS60182729A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
EP0654866A3 (en) * 1993-11-23 1997-08-20 Motorola Inc Carrier for connecting a semiconductor cube and manufacturing method.
JP6000519B2 (ja) * 2011-07-25 2016-09-28 アピックヤマダ株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS60182729A (ja) 1985-09-18

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