JPH02129734U - - Google Patents

Info

Publication number
JPH02129734U
JPH02129734U JP1989038080U JP3808089U JPH02129734U JP H02129734 U JPH02129734 U JP H02129734U JP 1989038080 U JP1989038080 U JP 1989038080U JP 3808089 U JP3808089 U JP 3808089U JP H02129734 U JPH02129734 U JP H02129734U
Authority
JP
Japan
Prior art keywords
dielectric substrate
main plane
heat sink
bonded
taken along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989038080U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989038080U priority Critical patent/JPH02129734U/ja
Publication of JPH02129734U publication Critical patent/JPH02129734U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Description

【図面の簡単な説明】
第１図ａ〜ｃは本考案による第１の実施例を示
し、そのうちａは平面図、ｂはａのＡ−Ａ′線に
沿つて切断し矢印の方向に見た断面図、ｃはａの
Ｂ−Ｂ′線に沿つて切断し矢印の方向に見た断面
図、第２図ａ〜ｃは本考案による第２の実施例を
示し、そのうちａは平面図、ｂはａのＡ−Ａ′線
に沿つて切断し矢印の方向に見た断面図、ｃはａ
のＢ−Ｂ′線に沿つて切断し矢印の方向に見た断
面図、第３図ａ〜ｃは本考案による第３の実施例
を示し、そのうちａは平面図、ｂはａのＡ−Ａ′
線に沿つて切断し矢印の方向に見た断面図、ｃは
ａのＢ−Ｂ′線に沿つて切断し矢印の方向に見た
断面図、第４図ａ，ｂは従来の構造を示し、その
うちａは平面図、ｂはａのＣ−Ｃ′線に沿つて切
断し矢印の方向に見た断面図である。 １……金属製放熱体、２……膜回路基板、３…
…高熱伝導度を有する誘電体基板、４……外部引
出リード、５……半導体素子、６……金属細線（
半導体素子電極と外部引出電極とを接続）、７…
…金属片、８……メタライズ層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 誘電体基板の第１の主平面上に半導体素子が搭
    載され、前記誘電体基板の第２の主平面が放熱体
    に接着され、且つ前記誘電体基板の第１の主平面
    と前記放熱体との間に放熱用金属片が介在するこ
    とを特徴とする半導体装置。
JP1989038080U 1989-03-31 1989-03-31 Pending JPH02129734U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989038080U JPH02129734U (ja) 1989-03-31 1989-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989038080U JPH02129734U (ja) 1989-03-31 1989-03-31

Publications (1)

Publication Number Publication Date
JPH02129734U true JPH02129734U (ja) 1990-10-25

Family

ID=31545766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989038080U Pending JPH02129734U (ja) 1989-03-31 1989-03-31

Country Status (1)

Country Link
JP (1) JPH02129734U (ja)

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