JPH02100335A - Semiconductor wafer - Google Patents

Abstract

PURPOSE:To make it possible to test a state of electrical contact between a semiconductor wafer and an electrical testing probe without exchanging the semiconductor wafer by providing a region independent of a semiconductor chip by which region a contact position of the probe used in electrical testing of the semiconductor wafer is electrically short-circuited. CONSTITUTION:A semiconductor wafer 1 includes thereon a semiconductor chip 2 composed of a region 3 having a required function and formed of a semiconductor element and a conductor, and of a pad 4 for taking out said function to the outside, and a region 5 corresponding to one chip comprising a conductor for electrically short-circuiting a contact position of a whole probe used in electrical testing of the semiconductor wafer 1. The electrical test for testing the function of the region 3 of the semiconductor chip 2 is performed by bringing an electrical testing probe into contact with the pad 4 of each semiconductor chip. Thus, when there is tested an electrical contact state between the probe and the semiconductor wafer 1, all electrical testing probes are brought into contact with the region 5 without requiring any exchange of the semiconductor wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to semiconductor wafers, and more particularly to testing the electrical contact between all probes used in electrical testing of semiconductor wafers and the semiconductor wafer.

BACKGROUND OF THE INVENTION Conventional semiconductor wafers include a region 3 with a required function made up of semiconductor elements and a conductor, and a region 3 for extracting the function to the outside, as shown in a semiconductor wafer 7 in FIG. A region 2 (hereinafter referred to as a semiconductor chip) consisting of pads 4 is arranged over the entire surface.

Therefore, it is possible to test the required functions by bringing a probing probe into contact with the pads 4 of the individual semiconductor chips 2 on the semiconductor wafer 7. In other words, to test the electrical contact with the semiconductor wafer.

It is necessary to electrically short-circuit all the probes that are in contact with the semiconductor wafer, and this is not possible with the semiconductor wafer 7.

Therefore, conventionally, as shown in FIG. 3(b), a semiconductor wafer 8 whose entire surface is covered with a conductive material is used, and a probe for electrical testing is brought into contact with the conductive material of the semiconductor wafer 8. The electrical contact between the needle and the semiconductor wafer was being tested.

Problems that the invention aims to solve As mentioned above, in conventional semiconductor wafers.

A disadvantage is that when testing the electrical contact between a semiconductor wafer and an electrical test probe, a semiconductor wafer containing multiple semiconductor chips must be replaced with a semiconductor wafer whose entire surface is covered with a conductive material. There is.

The present invention has been made in view of the above-mentioned conventional situation,
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a novel semiconductor wafer which makes it possible to eliminate the above-mentioned drawbacks inherent in the conventional technology.

Differences between the invention and the prior art The present invention differs from the conventional semiconductor wafer described above.

It differs from the semiconductor chip in that it includes a region that electrically shorts the contact positions of all the probes on the semiconductor wafer used during electrical testing of the semiconductor wafer.

Means for Solving the Problems In order to achieve the above objects, the semiconductor wafer according to the present invention electrically adjusts the contact positions of all the probes on the semiconductor wafer, which are used during electrical testing of the semiconductor wafer, in addition to the semiconductor chips. The device is configured to include a region that is short-circuited.

EXAMPLES Next, preferred embodiments of the present invention will be specifically explained with reference to the drawings.

FIG. 1 is a plan view showing a first embodiment according to the present invention.

Referring to FIG. 1, on a semiconductor wafer 1.

A region 2 (semiconductor chip) consisting of a region 3 with a required function made up of a semiconductor element and a conductor, and a pad 4 for extracting the function to the outside, and all probes used during electrical testing of the semiconductor wafer 1. One chip's worth of regions 5 made of a conductor that electrically short-circuit the contact positions on the semiconductor wafer are arranged.

An electrical test for testing the function of the region 3 of the semiconductor chip 2 is performed by bringing an electrical testing probe into contact with the pad 4 of each semiconductor chip.

Furthermore, when testing the state of electrical contact between the electrical test probes and the semiconductor wafer 1, all the electrical test probes are brought into contact with the area 5.

FIG. 2 is a plan view showing a second embodiment of the present invention.

Referring to FIG. 2, the differences from the first embodiment are as follows.
The region 5 made of a conductor that electrically shorts the probe for electrical testing is provided for two chips. Therefore, in this second embodiment, the contact position between the probe and the region 5 can be changed when testing the electrical contact state between the semiconductor wafer 6 and the probe for electrical testing many times. Therefore, there is an advantage that the influence on the electrical contact state due to scratches on the area 5 that are formed when the probe comes into contact with the probe can be reduced.

DETAILED DESCRIPTION OF THE INVENTION According to one aspect of the present invention, in a semiconductor wafer including a plurality of semiconductor chips, the contact positions of all probes used during electrical testing of the semiconductor wafer on the semiconductor wafer are determined separately from the semiconductor chips. By including the region that is electrically short-circuited, it is possible to test the electrical contact state between the semiconductor wafer and the electrical test probe without replacing the semiconductor wafer.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention, and FIG.
The figure is a plan view showing a second embodiment of the present invention, and FIG. 3 is a plan view illustrating a conventional technique. 1.6.7. ,, semiconductor wafer, 210. semiconductor chip, 310. 4. A region having the required function and composed of a semiconductor element and a conductor; 4. ,,pad,501. 8. A region made of a conductor that electrically shorts all the probing probes. ,,a semiconductor wafer whose entire surface is covered with a conductor

Claims (1)

[Claims] A semiconductor wafer including a plurality of semiconductor chips, including a region separate from the semiconductor chips that electrically shorts the contact positions of all probes on the semiconductor wafer used during an electrical test of the semiconductor wafer. semiconductor wafers.