JPH06104316A - Film carrier tape - Google Patents

Abstract

PURPOSE:To detect short-circuiting defects by setting a lead terminal set at, at least, every second lead terminal of a plurality of lead terminals and commonly providing a pad for electric selection to the terminal set. CONSTITUTION:Of a plurality of lead terminals, those 16A are formed in a comb-like shape and the parts of the terminals 16A used as lead terminals are set in branch sections protruded from the stem sections 17 of the comb. The other lead terminals 16B are formed in such a way that, for example, each one of them is inserted between each one of the terminals 16A. The lead probes 22 of a tester are respectively brought into contact with pads 18a and 18B for electric selection. The tester supplies prescribed inspecting signals to the terminals 16A and 16B through fixed cards 24 and probes 22. Therefore, an inexpensive film carrier can be realized by using a narrow insulating film.

Description

Detailed Description of the Invention

[0001]

This invention relates to a film carrier tape.
Tape carrier bonding (TA
It relates to a film carrier tape used in B).

[0002]

2. Description of the Related Art FIG. 5 is a schematic plan view of a conventional film carrier tape. On both sides of the insulating film 100, sprocket wheels 102 for carrying and positioning are formed. Further, a semiconductor chip opening 104 is formed in the center of the insulating film. A plurality of lead terminals 106 are formed on the film 100 so as to project one end into the opening 104.
Electrically (screening) pads 108 are provided on the other ends of the lead terminals 106, respectively.

The number of input / output terminals (bonding pads) of a semiconductor chip has been increased due to the recent increase in integration and function of semiconductor devices, and the number of lead terminals 106 has also been increased accordingly. . Therefore, the pitch between the lead terminals 106 is becoming narrower. In the film carrier tape in which the pitch is narrower than the minimum pitch required to provide the electrical selection pad 108, for example, the one shown in FIG. 6 is used.
That is, the pad electrodes 108 are arranged in a staggered arrangement.

However, when the semiconductor chip is mounted on the film 100, the film 100 is cut off along the line III-III in the figure. Therefore, even if the pads 108 are arranged in a zigzag pattern, if the number of lead terminals 106 is further increased, the area where the pads 108 are provided in the film 100 becomes wider. That is, the film 100 has many unnecessary portions, which causes an increase in production cost. Along with this, the increase in the number of pads 108 is due to the increase of the number of pads in the tester.
This causes a new problem that the number of probes (measurement terminals) cannot be supported. to solve this problem,
A film carrier tape as shown in FIG. 7 has been devised. That is, the pad 108 is connected to several lead terminals 106.
Share on. The film carrier tape having such pads 108 can suppress the increase in the pads 108 even if the number of lead terminals 106 increases.

Therefore, as shown in FIG. 8, it is possible to reduce the unnecessary portion of the film 100 which is cut off along the line IV-IV. Moreover, since the number of pads 108 can be suppressed, the number of pads 108 can be matched with the number of terminals of the existing tester.

[0006]

However, in the film carrier tape shown in FIG. 8, some lead terminals 1 are used.
Since the pad 108 is shared by 06, there is a problem in that a short circuit defect occurring between the adjacent lead terminals 106 cannot be detected.

The present invention has been made in view of the above points, and an object thereof is to suppress the increase in the number of electrical selection pads even if the number of lead terminals is increased, and to provide the electrical selection. It is an object of the present invention to provide a film carrier tape capable of detecting a short circuit defect occurring between adjacent lead terminals at the time of selection.

[0008]

A film carrier tape according to the present invention is provided on an insulating film and the insulating film, one end of which serves as a connecting portion to a pad of a semiconductor chip, and the other end of which is electrically connected. A plurality of lead terminals provided with a selection pad, and among the plurality of lead terminals, a lead terminal set is set at least every one or more lead terminals,
The electrical selection pad is commonly provided in the terminal group.

[0009]

According to the above film carrier tape, the lead terminal group among the plurality of lead terminals is set at least every one or more lead terminals. An electric selection pad is commonly provided. As a result, even if the number of lead terminals is increased, the number of electrical selection pads is suppressed. Moreover, since at least one or more terminal sets are provided in common with the electrical selection pads, it is possible to detect a short circuit between adjacent lead terminals.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the accompanying drawings. In this description, common parts are denoted by common reference symbols throughout the drawings, and redundant description will be avoided. FIG. 1 is a plan view of a film carrier tape according to the first embodiment.

As shown in FIG. 1, sprocket wheels 12 for carrying and positioning are formed on both sides of the insulating film 10, respectively. An opening 14 for a semiconductor chip is formed in a substantially central portion of the film 10. A plurality of lead terminals 16A and 16B are formed on the film 10 so as to project one end into the opening portion 14.

Of the plurality of lead terminals, 16A is formed in a comb shape, and a portion serving as a lead terminal is set, for example, in a branch portion projecting from a comb-shaped trunk portion 17. The other lead terminal 16B is a lead terminal 1 extending like a branch.
It is formed so as to be inserted, for example, one by one between 6A. Electrically (screening) pads are provided at the other ends of the lead terminals 16A and 16B.

FIG. 2 shows the film carrier tape shown in FIG.
FIG. 4 is an enlarged view of a lead terminal portion of the battery. This figure shows the case where the lead probe (measurement terminal) of the tester is brought into contact with the electrical selection pad.

As shown in FIG. 2, an electrical sorting pad 1
A lead probe 22 of a tester (not shown) is brought into contact with 8A and 18B, and the tester fixes a predetermined inspection signal.
Lead terminals 16A, 16 through the probe 24 to the probe 22.
Supply to B.

At this time, a semiconductor chip (not shown) is placed in a region corresponding to the semiconductor chip opening 14, and desired input / output terminals (bonding pads) of the chip are mounted.
And the lead terminals 16A and 16B are electrically connected to one end. When the electrical sorting process is completed, the film 1
For example, 0 is cut out along the line I-I in the figure.

The semiconductor chip (not shown) mounted on the film carrier tape as described above should be a bonding pad, that is, an input / output terminal which can be in both an enable / disable state. Is desirable. An example of such a semiconductor chip is one in which the input / output terminals of the chip can be in both a high impedance state and a low impedance state. The electrical selection by such a semiconductor chip is performed as follows, for example.

First, the input / output terminals of a semiconductor chip (not shown) are connected to the lead terminals 16A. Then, the electrical selection pad 18A shared by the lead terminals 16A is connected to the professional
The contact 22 is made. Next, the input / output terminals of the chip (not shown) are set to the high impedance state, respectively, and the probe 2
2 is also in a high-impedance state. Then, the input / output terminals corresponding to the lead terminal 16A to be inspected are selectively brought into the low impedance state. In this way, the inspection signal from the tester (not shown) is transmitted only to the input / output terminals of the chip in the low impedance state. This kind of operation
This is sequentially performed for each of the commonly connected lead terminals 16A. FIG. 3 is a plan view of a film carrier tape according to the second embodiment.

As shown in FIG. 3, in the film carrier tape according to the second embodiment, one end of the lead terminal 16B is
It is connected to the conductive film 42 formed on the back surface of the insulating film 10 through the opening 40 formed in the insulating film 10. Since the lead terminals 16B are commonly connected by the conductive film 42, the number of electrical selection pads can be further suppressed as compared with the first embodiment. Figure 4
FIG. 4 is an enlarged view of a lead terminal portion of the film carrier tape shown in FIG. The figure shows when the terminals of the tester are touched.

As shown in FIG. 4, a conductive film 42 formed on the back surface of the insulating film 10 and an opening 40 formed to connect the conductive film 42 and the lead terminal 16B.
Is cut along the line II-II in the figure after completion of electrical selection. Therefore, the conductive film 42 and the opening 40
Can be removed from the insulating film 10 after the semiconductor device is completed.

The film carrier tape has, for example, a set of three lead terminals 16A and three lead terminals 16B.
And a set of are obtained. Moreover, each of these groups has one electrical sorting pad 18 shared by each group.
A and 18B are provided. Therefore, the width of the area of the insulating film 10 required to form the electrical selection pads 18A and 18B is, for example, 1/3 of that of the conventional film carrier tape in which the common pad is not formed. It can be reduced to a certain width. Of course, the area of the area itself is also reduced.

In the film carrier tapes according to the first and second embodiments described above, some lead terminals are connected in common, and the electrically connected pads are used to electrically select pads. To share. As a result, the number of electrical selection pads can be appropriately matched with the number of probes (measurement terminals) of the existing tester. With the increase in lead terminals
Needless to say, the shortage of the number of bugs will be prevented. Further, it is not necessary to insert an element such as a relay for compensating for the lack of the number of probes between the tester (not shown) and the fixed card 24, and an element such as a relay can be inserted. There is no deterioration in the inspection performance of the inspection device or a decrease in reliability related to defect detection due to the cause.

In the first and second embodiments, the lead terminals 16A are commonly connected, but the lead terminals 16A can be arbitrarily selected to be commonly connected.
You may connect only the selected one. The same applies to the lead terminal 16B in the second embodiment.

Further, the lead terminals 16 connected in common.
Although one lead terminal 16B is inserted between the terminals A, it is also possible to insert two or more lead terminals.

In the film carrier tape according to the first and second embodiments as described above, a plurality of lead terminals are commonly connected every arbitrary number, and the leads connected in common. -In the set of terminals, for example, one electrical sorting pad is provided. This can reduce the area of the region of the lead terminal, particularly on the insulating film for forming the electrical selection pad. That is, since the area of the unnecessary portion is reduced due to the function of the film carrier type semiconductor device, an inexpensive film carrier tape using a narrow insulating film can be realized, and the film carrier type can be manufactured at a low cost. A semiconductor device can be manufactured.

Further, it is desirable that the film carrier tape according to the present invention be equipped with a semiconductor chip capable of setting its bonding pad (input / output terminal) to both an enable / disable state, By mounting such a chip, electrical selection becomes possible even when the number of bonding pads of the semiconductor chip is larger than the number of probes. Moreover, since the adjacent lead terminals are not commonly connected to each other, it is possible to detect a short circuit failure between the adjacent lead terminals.

[0026]

As described above, according to the film carrier tape of the present invention, even if the number of lead terminals is increased, it is possible to suppress the increase in the number of electrical selection pads, and the It is possible to provide a film carrier tape capable of detecting a short circuit defect between adjacent lead terminals during selective selection.

[Brief description of drawings]

FIG. 1 is a plan view of a film carrier tape according to a first embodiment.

FIG. 2 is an enlarged view of a lead terminal portion of the film carrier tape shown in FIG.

FIG. 3 is a plan view of a film carrier tape according to a second embodiment.

4 is an enlarged view of a lead terminal portion of the film carrier tape shown in FIG.

FIG. 5 is a plan view of a conventional first film carrier tape.

FIG. 6 is an enlarged view of a lead terminal portion of a conventional second film carrier tape.

FIG. 7 is a plan view of a third conventional film carrier tape.

FIG. 8 is an enlarged view of a lead terminal portion of the film carrier tape shown in FIG.

[Explanation of symbols]

10 ... Insulating film, 16A, 16B ... Lead terminal,
18A, 18B ... Electrical selection pad.

Claims (1)

[Claims] 1. An insulating film, and a plurality of lead terminals provided on the insulating film, one end of which serves as a connection portion with a pad of a semiconductor chip, and the other end of which is provided with an electrical selection pad. A lead terminal group is set at least every one or more of the lead terminals among the plurality of lead terminals, and the electrical selection pad is commonly provided in the terminal group. A film carrier tape characterized by.