JPH04318951A - Probe card - Google Patents

Abstract

PURPOSE:To obtain a probe card, wherein the region for standing probe needles can be secured sufficiently and the probe needles can be prevented from shorting each other as the result of providing them with a high density, in the probe card for testing simultaneously a number of semiconductor devices, each of which has pads on its four sides. CONSTITUTION:On a probe card 1, provided are probe needles 2A, each comprising a pair of long and short probe needles 2Aa, 2Ab which are insulated from each other with an insulation resin 6 and thereby are fastened to each other too.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card used for wafer testing of semiconductor devices.

0002

2. Description of the Related Art FIG. 5 is a plan view showing a wafer test of semiconductor devices using a conventional probe card. In the figure, 1 is a probe card, and 2 is a probe needle attached to the probe card 1 for testing a semiconductor element 3. Further, 4 is an electrode terminal (hereinafter referred to as a pad) on the semiconductor element 3, and 5 is an opening in the probe card 1.

Further, FIG. 6 shows a cross-sectional structure taken along the line VI--VI in FIG. Next, the operation will be explained. By bringing the probe needle 2 into contact with the pad 4 on the semiconductor element 3, the semiconductor element 3 can be electrically tested. FIG. 5 shows a probe card for simultaneously measuring two semiconductor devices of two chips adjacent to each other in the horizontal direction. It is placed and fixed.

0004

[Problem to be Solved by the Invention] Since the conventional probe card is constructed as described above, there is no problem in simultaneously measuring two semiconductor devices of two chips each having a pad on only one side of the chip. For example, when simultaneously measuring a large number of semiconductor devices having a large number of pads on the four sides of a chip, a large number of probe needles 2 are required as shown in FIG. could not be secured.

Furthermore, since the probe needles 2 are crowded together, the probe needles may come into contact with each other and cause short circuits during probe card fabrication and wafer testing due to contact between probe needles and pads due to vertical movement of the probe card. There was a problem.

The present invention was made to solve the above-mentioned problems, and it is an object of the present invention to provide a probe card that can simultaneously measure a large number of semiconductor devices having a large number of pads on the four sides of the chip. purpose.

[0007]

[Means for Solving the Problems] A probe card according to the present invention is provided with a probe needle formed by fixing two or more probe needles of different lengths with an insulating resin.

[0008] Further, the probe card according to the present invention has the following features:
It is equipped with a probe needle whose entire or partial surface, except for the tip, is coated with an insulating agent.

[0009]

[Function] The probe card of the present invention prevents short-circuits between probe needles from occurring when creating a probe card for simultaneous measurement of a large number of semiconductor devices having pads on the four sides of the chip and during wafer testing. The needle is set.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS A probe card according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a state in which two semiconductor elements having pads on four sides of a chip are placed adjacent to each other using a probe card according to a first embodiment of the present invention, and a wafer test is being performed on these elements at the same time. Further, FIG. 2 shows a cross-sectional structure taken along the line II-II in FIG. 1.

In these figures, reference numeral 1 indicates the probe card of this embodiment, and reference numerals 2 and 2A indicate probe needles for contacting pads of the semiconductor element 3 in order to test the semiconductor element 3. As shown in FIG. 2, the probe needle 2A is composed of a long first probe needle 2Aa and a short second probe needle 2Ab. are fixed and integrally formed with an insulating resin 6, and are insulated from each other by the insulating resin 6. Moreover, as shown in FIG. 1 when drawn in a plan view, the first probe needle 2Aa and the second probe needle 2Ab are arranged one above the other as if they were one needle. Further, the semiconductor element 3 of this embodiment has pads on all four sides thereof, 4 is a pad provided on two sets of opposing sides of the semiconductor element 3, and 4a and 4b are pads provided on two pairs of opposing sides. It is a pad provided on the side of the set. Further, 5 is an opening of the probe card 1.

FIG. 3 is a view of the connecting portion between the probe needle 2A and the probe card 1 shown in FIG. 1, as viewed from the back side of the probe card 1. 7a and 7b are electrode plates provided on the back surface of the probe card 1, respectively, and the first and second probe needles 2Aa and 2A are fixed to each other with the insulating resin.
b are separated at their tip portions, and each is electrically connected to the corresponding electrode plate 7a, 7b.

Next, a wafer test of the semiconductor device 3 using the probe card 1 of this embodiment will be explained. This embodiment shows a probe card for simultaneously measuring two two-chip semiconductor devices that are arranged adjacent to each other and have pads on all four sides. For pads 4 provided multiple times, one to one
The probe needle 2 is provided so as to correspond to the pads 4a and 4b provided on the other two pairs of opposing sides of the semiconductor element 3 and located at mutually opposing positions. The probe needles 2A are provided in a one-to-one correspondence with the probe needles 2A as one pair. As shown in FIG. 2, among the probe needles 2A, the longer first probe needle 2Aa is brought into contact with the pad 4a, and the shorter second probe needle 2Ab is brought into contact with the pad 4b.
The semiconductor element 3 is being electrically tested.

As described above, the probe card of this embodiment has a probe needle 2A formed by integrally forming a pair of long probe needles 2Aa and short probe needles 2Ab, which are insulated and fixed with insulating resin 6. Therefore, by using the probe card, even when testing a large number of semiconductor elements 3 having pads on four sides at the same time,
It is no longer necessary to provide the same number of probe needles as the number of pads on the probe card as in the past, and as a result, the probe needles can be provided with plenty of room in the probe needle installation area on the probe card, making it easy to set up the probe needles. become.

Furthermore, since the number of probe needles provided on the probe card can be reduced, when the probe needles come into contact with the pads when the probe card is moved up and down during the fabrication of the probe card and during wafer testing of semiconductor devices, the probe needles do not touch each other. The risk of short-circuiting between the probe needles due to contact is also reduced.

[0016] In the above embodiment, the case where two semiconductor elements 3 having pads on four sides are tested simultaneously is shown, but the present invention is not limited to this. The present invention can be similarly applied to cases where a plurality of elements 3 are tested simultaneously.

FIG. 4 is a diagram showing a wafer test using a probe card according to a second embodiment of the present invention.
This is a side view showing a state in which two semiconductor elements having pads on the four sides of the chip shown in FIG. 1 are simultaneously measured. In the figure, 2Ba and 2Bb are a long first probe needle and a short second probe needle whose entire surface or part of the surface is coated with insulating resin, respectively.Similar to the above embodiment, the long first probe needle 2Ba and short 2nd
As shown in FIG. 1 in a plan view, the probe needles 2Bb are arranged one above the other as if they were one needle. The first probe needle 2Ba is connected to the pad 4a.
The second probe needle 2Bb is provided in contact with the pad 4b. In addition, the same reference numerals as in FIGS. 1 and 2 indicate the same or corresponding parts, and the explanation thereof will be omitted.

In this embodiment, the first probe needles 2Ba,
An insulating resin is applied to the entire surface of the second probe needle 2Bb except for the needle end, or partially, thereby insulating the first probe needle 2Ba and the second probe needle 2Bb.

The probe card of this embodiment also uses the first and second probe needles 2Ba and 2Bb arranged above and below, which are insulated from each other, as in the above embodiment, so that all When simultaneously measuring a large number of semiconductor devices having pads on the sides, a sufficient probe needle stand area on the probe card can be secured, and short circuits between the probe needles can thereby be prevented.

[0020]

As described above, according to the present invention, a probe needle is formed by fixing two or more probe needles of different lengths with an insulating resin, or an insulating agent is applied to the surface of the needle tip except for the tip. Since it has a probe needle that has a pad on the four sides of the chip, it is possible to secure a sufficient area for the probe needle stand on the probe card when simultaneously testing multiple wafers of semiconductor devices that have pads on the four sides of the chip. This has the effect of making it easier to perform. Moreover, there is also the effect of suppressing the risk of short-circuiting between the probe needles during wafer testing.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a wafer test using a probe card according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a cross section taken along line II-II in FIG. 1;

FIG. 3 is a plan view showing a part of the back surface of the probe card according to the first embodiment of the present invention.

FIG. 4 is a side view showing a wafer test using a probe card according to a second alternative embodiment of the present invention.

FIG. 5 is a plan view showing a wafer test using a conventional probe card.

FIG. 6 is a diagram showing a VI-VI cross section in FIG. 5;

FIG. 7 is a plan view showing a wafer test using a conventional probe card.

[Explanation of symbols]

1 Probe card 2 Probe needle 2A mounted on the probe card Probe needle 2Aa according to the first embodiment of the present invention mounted on the probe card First probe needle 2Ab Second probe needle 2B Mounted on the probe card Probe needle 2Ba according to the second embodiment of the present invention, first probe needle 2Bb, second probe needle 3, semiconductor chips 4, 4a, 4b, electrode pads 5 on the semiconductor chip
Probe card opening 6 Insulating resin

Claims (2)

[Claims] 1. A probe card equipped with a plurality of measurement probes, characterized in that two or more probes of different lengths are partially fixed with an insulating resin. 2. A probe card equipped with a plurality of measuring probes, characterized in that an insulating agent is applied to the entire surface of the probe except for the tip of the probe or partially.